Abstract: A non-transitory computer-readable recording medium stores t herein a program management program for causing a computer to execute processes including: referring to a storage indicating an execution status of a production support program which is executed using production management data; specifying one or more data items which correspond to a data item not used at execution time of the production support program or a data item whose frequency of use at the execution time of the production support program is a predetermined reference value or less, among data items included in the production management data; and outputting the specified one or more data items.

Abstract: A non-transitory computer-readable recording medium stores therein a program utilization support program that causes a computer to execute processing including: obtaining first data items included in production management data; specifying second data items which are used in execution of a production support program with reference to a storage that stores information indicating an execution status of the production support program; and determining whether the production support program is usable based on whether all of the second data items are included in the first data items.

Abstract: A non-transitory computer-readable recording medium stores therein a program use assisting program for causing a computer to execute processing including: acquiring data items included in production management data; referring to a storage that stores a data item which is used when each of a plurality of production assisting programs is executed; specifying a production assisting program of which all data items which are used at the time of execution are included in the acquired data items from among the plurality of production assisting programs as a specific program; and outputting information indicating the specific program.

Abstract: A method of cutting a stack structure and the stack structure are disclosed. In the stack structure comprising at least one laser absorbing member and at least one laser transmitting member, a plurality of grooves are formed on the surface of the laser transmitting member which is in contact with the laser absorbing member, which grooves correspond to a plurality off cutting lines. In order to cut this stack structure, a laser beam is emitted on the laser absorbing member along each of the cutting lines, while at the same time gas is injected at the laser irradiated spot.

Abstract: Prior to dicing, a volatile protective agent is applied to at least the face of the substrate in which the devices are fabricated. Then the devices are separated by dicing. After dicing, the surface of the volatile protective agent is cleaned, and then the volatile protective agent is evaporated.

Abstract: A method for producing a mold, used for imprint, by dry etching a substrate made of quartz by using a dry etching apparatus, the method includes: a mask forming step for forming an etching mask having a concave and convex pattern on the substrate, and an etching step for forming a protective film on a side wall of the etching mask and for etching the substrate at the same time.

Abstract: A method, for producing a substrate, includes: forming an alignment mark on a first surface of the substrate; detecting a position of the alignment mark; forming a mark by scanning and focusing a laser beam on a position, on a second surface of the substrate, corresponding to the position of the alignment mark, the laser beam having a wavelength so as to pass through the substrate.

Abstract: A device such as an MEMS device is fabricated by cutting a laminate of a semiconductor substrate and a glass substrate. Grooves are formed in the glass substrate, and the semiconductor substrate and the glass substrate are laminated together such that the groove faces the semiconductor substrate. The laminated substrates are irradiated with a laser along the groove from the side of the glass substrate. In this way, the laminate is cut into elements.

Abstract: A spring member manufacturing device that manufactures the spring member by laser irradiation includes a laser irradiation unit including a plurality of laser irradiation devices that perform predetermined laser irradiation with respect to the spring member. In the spring member manufacturing device, the laser irradiation devices are configured so that laser irradiated conditions different from each other are preset for the respective laser irradiation devices, and are arranged so that the respective irradiated positions do not overlap each other. The laser irradiation apparatus is constituted by combining laser irradiation devices having laser irradiation conditions being 2 to the (n?1)th power, n being a positive integer,of predetermined minimum adjustment amount for adjusting load on the spring member. The combination of the laser irradiation devices are selected in accordance with load adjusting amount required for the spring member.

Abstract: A scanning mechanism that scans a scanning object with a light beam has light-collecting means for collecting the light beam that is emitted by a light source; driving means for driving the light-collecting means in a direction orthogonal to an optical axis of the light-collecting means; first reflecting means provided near a first side of the scanning object, for reflecting the light beam collected by the light-collecting means to allow the light beam to be incident on the scanning object; and second reflecting means provided near a second side of the scanning object that is opposite to the first side of the scanning object, for reflecting the light beam collected by the light-collecting means to allow the light beam to be incident on the scanning object.

Abstract: A device such as an MEMS device is fabricated by cutting a laminate of a semiconductor substrate and a glass substrate. Grooves are formed in the glass substrate, and the semiconductor substrate and the glass substrate are laminated together such that the groove faces the semiconductor substrate. The laminated substrates are irradiated with a laser along the groove from the side of the glass substrate. In this way, the laminate is cut into elements.

Abstract: In a dicing method, a dicing is performed in such a way that in such a way that a device substrate, on which two or more devices and alignment marks for positioning are formed, is positioned in accordance with the alignment mark. The dicing method comprises: a substrate fixing step of fixing the device substrate on a fixed stand in a state that the device substrate is covered with coagulant and the coagulant is coagulated; a positioning step of performing a positioning based on the alignment mark in such a manner that a partial area, in which the alignment mark on the device substrate fixed on the fixed stand is formed, is locally heated to melt the coagulant at the partial area, so that the alignment mark is observed through the melted coagulant; and a dicing step of dicing the device substrate and separating the device substrate into the individual device elements.

Abstract: A device such as an MEMS device is fabricated by cutting a laminate of a semiconductor substrate and a glass substrate. Grooves are formed in the glass substrate, and the semiconductor substrate and the glass substrate are laminated together such that the groove faces the semiconductor substrate. The laminated substrates are irradiated with a laser along the groove from the side of the glass substrate to cut the laminate into elements.

Abstract: A method of fabricating an element having a microstructure such as an MEMS device uses a material whose state changes with a temperature change. A sheet-like member having a microstructure on its surface is fixed to a vacuum chuck by an adhesive sheet and the material whose state changes with a temperature change is applied to the surface of the sheet-like member the material is then cooled to solidify it on the surface of the sheet-like member and the sheet-like member is cut 10 into a plurality of elements, while the material is in the solidified state, and the separated elements are then removed from the adhesive sheet.

Abstract: A scanning mechanism that scans a scanning object with a light beam has light-collecting means for collecting the light beam that is emitted by a light source; driving means for driving the light-collecting means in a direction orthogonal to an optical axis of the light-collecting means; first reflecting means provided near a first aide of the scanning object, for reflecting the light beam collected by the light-collecting means to allow the light beam to be incident on the scanning object; and second reflecting means provided near a second side of the scanning object that is opposite to the first side of the scanning object, for reflecting the light beam collected by the light-collecting means to allow the light beats to be incident on the scanning object.

Abstract: Prior to dicing, a volatile protective agent is applied to at least the face of the substrate in which the devices are fabricated. Then the devices are separated by dicing. After dicing, the surface of the volatile protective agent is cleaned, and then the volatile protective agent is evaporated.

Abstract: Light is irradiated to a light curing resin material within a mold. The light penetrates through the light curing resin material at a position off a mask. The light curing resin material gets cured at the position off the mask. The mold in this manner serves to form the contour of a molded product. On the other hand, the mask partly blocks the light. An uncured section is established in the light curing resin material behind the mask. When the light curing resin material is removed from the uncured section, the uncured section provides a hole, for example. If the mask is finely formed, it is possible to form a fine hole in an easier manner in a shorter time. It is possible to realize the mass production of a molded product having a fine hole.

Abstract: In a dicing method, a dicing is performed in such a way that in such a way that a device substrate, on which two or more devices and alignment marks for positioning are formed, is positioned in accordance with the alignment mark. The dicing method comprises: a substrate fixing step of fixing the device substrate on a fixed stand in a state that the device substrate is covered with coagulant and the coagulant is coagulated; a positioning step of performing a positioning based on the alignment mark in such a manner that a partial area, in which the alignment mark on the device substrate fixed on the fixed stand is formed, is locally heated to melt the coagulant at the partial area, so that the alignment mark is observed through the melted coagulant; and a dicing step of dicing the device substrate and separating the device substrate into the individual device elements.

Abstract: A device such as an MEMS device is fabricated by cutting a laminate of a semiconductor substrate and a glass substrate. Grooves are formed in the glass substrate, and the semiconductor substrate and the glass substrate are laminated together such that the groove faces the semiconductor substrate. The laminated substrates are irradiated with a laser along the groove from the side of the glass substrate. In this way, the laminate is cut into elements.

Abstract: A device such as an MEMS device is fabricated by cutting a laminate of a semiconductor substrate and a glass substrate. Grooves are formed in the glass substrate, and the semiconductor substrate and the glass substrate are laminated together such that the groove faces the semiconductor substrate. The laminated substrates are irradiated with a laser along the groove from the side of the glass substrate. In this way, the laminate is cut into elements.