Patents by Inventor Toshikazu Kondou
Toshikazu Kondou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Publication number: 20130327478Abstract: A method of manufacturing a reuse paste includes preparing a fiber piece housing paste, producing a filtered recovery paste, and producing a reuse paste. In the preparing of the fiber piece housing paste, a conductive paste including a conductive particle, resin and a latent curing agent, and a fiber piece housing paste including a fiber piece dropping off from a prepreg used for manufacturing a circuit board are prepared. In the producing of the filtered recovery paste, the filtered recovery paste is produced by filtering the fiber piece housing paste, which remains in a paste state, by using a filter. In the production of the reuse paste, the reuse paste is produced by adding at least one of a solvent, resin, and a paste having a different composition from that of the filtered recovery paste into the filtered recovery paste.Type: ApplicationFiled: June 27, 2013Publication date: December 12, 2013Inventors: Tsuyoshi HIMORI, Masaaki KATSUMATA, Toshikazu KONDOU
-
Publication number: 20130327994Abstract: A method of manufacturing a reuse paste includes preparing a fiber piece housing paste, producing a filtered recovery paste, and producing a reuse paste. In the preparing of the fiber piece housing paste, a conductive paste including a conductive particle, resin and a latent curing agent, and a fiber piece housing paste including a fiber piece dropping off from a prepreg used for manufacturing a circuit board are prepared. In the producing of the filtered recovery paste, the filtered recovery paste is produced by filtering the fiber piece housing paste, which remains in a paste state, by using a filter. In the production of the reuse paste, the reuse paste is produced by adding at least one of a solvent, resin, and a paste having a different composition from that of the filtered recovery paste into the filtered recovery paste.Type: ApplicationFiled: June 27, 2013Publication date: December 12, 2013Inventors: Tsuyoshi HIMORI, Masaaki KATSUMATA, Toshikazu KONDOU
-
Publication number: 20130299752Abstract: A method of manufacturing a reuse paste includes the steps of preparing a fiber piece housing paste, fabricating a filtered recovery paste and fabricating a reuse paste. At the step of preparing a fiber piece housing paste, there is prepared a fiber piece housing paste including a conductive paste having conductive powder and a resin, and a fiber piece taken away from a prepreg to be used for manufacturing a circuit board. At the step of fabricating a filtered recovery paste, the fiber piece housing paste in a paste state is filtered as it is by using a filter and a filtered recovery paste is thus fabricated. At the step of fabricating a reuse paste, at least one of a solvent, a resin and a paste having a different composition from the filtered recovery paste is added to the filtered recovery paste, and the reuse paste is thus fabricated.Type: ApplicationFiled: July 30, 2013Publication date: November 14, 2013Applicant: PANASONIC CORPORATIONInventors: Tsuyoshi HIMORI, Toshikazu KONDOU, Masaaki KATSUMATA
-
Patent number: 8561294Abstract: A method of manufacturing a circuit board includes the steps of preparing a fiber piece housing paste, fabricating a filtered recovery paste, fabricating a reuse paste, sticking a protective film, forming a hole, and filling the hole with the reuse paste. Furthermore, the method includes the steps of forming a protruded portion constituted of the reuse paste, disposing a metallic foil on both sides of a second prepreg to carry out pressurization, heating the second prepreg to cure the second prepreg and the reuse paste, and processing the metallic foil into a wiring pattern.Type: GrantFiled: April 19, 2012Date of Patent: October 22, 2013Assignee: Panasonic CorporationInventors: Tsuyoshi Himori, Masaaki Katsumata, Toshikazu Kondou
-
Publication number: 20130153138Abstract: A method of manufacturing a reuse paste includes preparing a fiber piece housing paste, producing a filtered recovery paste, and producing a reuse paste. In the preparing of the fiber piece housing paste, a conductive paste including a conductive particle, resin and a latent curing agent, and a fiber piece housing paste including a fiber piece dropping off from a prepreg used for manufacturing a circuit board are prepared. In the producing of the filtered recovery paste, the filtered recovery paste is produced by filtering the fiber piece housing paste, which remains in a paste state, by using a filter. In the production of the reuse paste, the reuse paste is produced by adding at least one of a solvent, resin, and a paste having a different composition from that of the filtered recovery paste into the filtered recovery paste.Type: ApplicationFiled: July 24, 2012Publication date: June 20, 2013Applicant: PANASONIC CORPORATIONInventors: Tsuyoshi Himori, Masaaki Katsumata, Toshikazu Kondou
-
Publication number: 20130146817Abstract: A method of manufacturing a reuse paste includes the steps of preparing a fiber piece housing paste, fabricating a filtered recovery paste and fabricating a reuse paste. At the step of preparing a fiber piece housing paste, there is prepared a fiber piece housing paste including a conductive paste having conductive powder and a resin, and a fiber piece taken away from a prepreg to be used for manufacturing a circuit board. At the step of fabricating a filtered recovery paste, the fiber piece housing paste in a paste state is filtered as it is by using a filter and a filtered recovery paste is thus fabricated. At the step of fabricating a reuse paste, at least one of a solvent, a resin and a paste having a different composition from the filtered recovery paste is added to the filtered recovery paste, and the reuse paste is thus fabricated.Type: ApplicationFiled: April 19, 2012Publication date: June 13, 2013Applicant: PANASONIC CORPORATIONInventors: Tsuyoshi Himori, Toshikazu Kondou, Masaaki Katsumata
-
Publication number: 20130097857Abstract: A method of manufacturing a circuit board includes the steps of preparing a fiber piece housing paste, fabricating a filtered recovery paste, fabricating a reuse paste, sticking a protective film, forming a hole, and filling the hole with the reuse paste. Furthermore, the method includes the steps of forming a protruded portion constituted of the reuse paste, disposing a metallic foil on both sides of a second prepreg to carry out pressurization, heating the second prepreg to cure the second prepreg and the reuse paste, and processing the metallic foil into a wiring pattern.Type: ApplicationFiled: April 19, 2012Publication date: April 25, 2013Applicant: PANASONIC CORPORATIONInventors: Tsuyoshi Himori, Masaaki Katsumata, Toshikazu Kondou
-
Patent number: 8393078Abstract: In a method of manufacturing a circuit board, a conductive paste is filled in a first hole formed on a first prepreg having both sides to which a first protective film is caused to stick so that a first circuit board is manufactured. A fiber piece housing paste obtained by mixing a fiber piece is recovered to obtain a recovery paste; filtration is carried out through a filter; a solvent or the like is added; and a viscosity, a composition ratio or the like is adjusted so that a reuse paste is fabricated. The reuse paste is filled in a second hole formed on a second prepreg having both sides to which a second protective film is caused to stick.Type: GrantFiled: April 13, 2012Date of Patent: March 12, 2013Assignee: Panasonic CorporationInventors: Tsuyoshi Himori, Masaaki Katsumata, Toshikazu Kondou
-
Publication number: 20120272520Abstract: In a method of manufacturing a circuit board, a conductive paste is filled in a first hole formed on a first prepreg having both sides to which a first protective film is caused to stick so that a first circuit board is manufactured. A fiber piece housing paste obtained by mixing a fiber piece is recovered to obtain a recovery paste; filtration is carried out through a filter; a solvent or the like is added; and a viscosity, a composition ratio or the like is adjusted so that a reuse paste is fabricated. The reuse paste is filled in a second hole formed on a second prepreg having both sides to which a second protective film is caused to stick.Type: ApplicationFiled: April 13, 2012Publication date: November 1, 2012Inventors: Tsuyoshi Himori, Masaaki Katsumata, Toshikazu Kondou
-
Patent number: 8211494Abstract: A mask film, where squeegee cleaning part has been formed at a predetermined position, and another mask film are attached to both sides of a substrate. A through-hole is formed by using a laser, and conductive paste is filled into the through-hole by using a squeezing method. As discussed above, a paste-residue can be prevented on the through-hole, so that a circuit board having high quality of connection can be obtained.Type: GrantFiled: December 15, 2004Date of Patent: July 3, 2012Assignee: Panasonic CorporationInventors: Toshiaki Takenaka, Toshikazu Kondou, Yukihiro Hiraishi, Kunio Kishimoto
-
Publication number: 20060115583Abstract: A mask film, where squeegee cleaning part has been formed at a predetermined position, and another mask film are attached to both sides of a substrate. A through-hole formed by using a laser, and conductive paste is filled into the through-hole by using a squeezing method. As discussed above, a paste-residue can be prevented on the through-hole, so that a circuit board having high quality of connection can be obtained.Type: ApplicationFiled: December 15, 2004Publication date: June 1, 2006Inventors: Toshiaki Takenaka, Toshikazu Kondou, Yukihiro Hiraishi, Kunio Kishimoto