Abstract: A controller enabling switching between a smart function and an immobilizer function without using a key cylinder or a slot. The controller includes a verification ECU for transmitting a request signal to a first area and transmitting a transponder drive radio wave to a second area. The portable device transmits an ID code signal in response to the request signal or the transponder drive radio wave. The verification ECU enables the starting of an engine when the ID code transmitted from the portable device matches an ID code of the controller. The verification ECU transmits the drive radio wave when a driver operates a switch in a state in which the starting of the engine is not enabled after the request signal is transmitted.

Abstract: A controller enabling switching between a smart function and an immobilizer function without using a key cylinder or a slot. The controller includes a verification ECU for transmitting a request signal to a first area and transmitting a transponder drive radio wave to a second area. The portable device transmits an ID code signal in response to the request signal or the transponder drive radio wave. The verification ECU enables the starting of an engine when the ID code transmitted from the portable device matches an ID code of the controller. The verification ECU transmits the drive radio wave when a driver operates a switch in a state in which the starting of the engine is not enabled after the request signal is transmitted.

Abstract: There is provided a semiconductive resin composition comprising the following components (A), (B), (D) and (E):(A) 5 to 100 parts by weight of a modified ethylene copolymer obtainable by subjecting an ethylene copolymer (a1) and a vinyl monomer (a2) to graft polymerization conditions,(B) 0.5 to 15 parts by weight of an unsaturated silane compound,(D) 10 to 110 parts by weight of carbon black, and(E) 0 to 95 parts by weight of an ethylene copolymer, provided that the amounts of the components shown above are based on 100 parts by weight in total of the components (A) and (E),wherein the component (B) is incorporated into the composition by subjecting the component (B) to melt graft reaction together with the component (A) and/or component (E) in the presence of 0.

Abstract: A female terminal has a structure that does not allow molten solder to close a pipe section into which male terminal is inserted. Notched recessed sections (9) are oppositely formed at the lower ends of the side faces (3a and 3a) of a female terminal (1). The female terminal (1) is locked by horizontally opening locking legs (7) protruded from the rear surface of a printed wiring board (11) from an inserting hole (12). In such a state, the rear surface of the board is dipped in molten solder (21). When the board (11), is pulled up from the molten solder (12), the solder (21) closing the pipe section (2) in a bridge-like form is turned to droplets and drops from the recessed section (9), because the wettability of the pipe section (2) with the solder (21) is lowered and the adhesion is weakened due to the recessed sections (9). The remaining molten solder (21) attaches to the peripheral edge of the end of the pipe section (2) other than the recessed sections (9) due to the surface tension and solidifies.

Abstract: A case for memory disks having excellent antistatic properties, which comprises a thermoplastic resin composition comprising 100 parts by weight of the following component (A), 3 to 30 parts by weight of the following component (B) and 5 to 40 parts by weight of the following component (C):component (A): a crystalline propylene resin having a melt flow rate (MFR) of 1 to 80 g/10 min;component (B): a thermoplastic elastomer selected from (b.sup.1) olefin copolymer elastomers having a Mooney viscosity (ML.sub.1+4 (100.degree. C.)) of 10 to 85, and (b.sup.2) hydrogenated products of a block copolymer of styrene or a derivative thereof and a conjugated diene, containing 15 to 50% by weight of styrene or a derivative thereof, having a weight-average molecular weight of 50,000 to 220,000; andcomponent (C): an acrylamide copolymer.

Abstract: A thermoplastic resin composition having excellent antistatic properties comprising 100 parts by weight of the following component (A), 3 to 30 parts by weight of the following component (B) and 5 to 40 parts by weight of the following component (C): component (A): a crystalline propylene resin having a melt flow rate (MFR) of 1 to 80 g/10 min; component (B): a thermoplastic elastomer selected from (b.sup.1) olefin copolymer elastomers having a Mooney viscosity (ML.sub.1+4 (100.degree. C.)) of 10 to 85, and (b.sup.2) hydrogenated products of a block copolymer of styrene or a derivative thereof and a conjugated diene, containing 15 to 50% by weight of styrene or a derivative thereof, having a weight-average molecular weight of 50,000 to 220,000; and component (C): an acrylamide copolymer.

Abstract: A deep drawing process, comprising melt-softening a resin sheet obtained from a resin composition comprising:(a) from 15 to 82% by weight of a propylene-series resin,(b) from 15 to 82% by weight of an ethylene-series resin, and(c) from 3 to 50% by weight of carbon black, each based on the total amount of the components (a), (b), and (c), and(d) from 1 to 50 parts by weight, per 100 parts by weight of the total amount of the components (a), (b), and (c), of an inorganic filler,at a temperature not lower than the melting point of the propylene-series resin and molding the softened resin sheet by differential pressure molding or press molding, wherein the resin sheet is molded at a draw ratio of from 2.0 to 3.5.

Abstract: A semiconductive resin composition used in power cables having excellent properties is disclosed, which comprises 100 parts by weight of a base resin of at least one member selected from the group consisting of a low-density polyethylene, an ethylene/vinyl acetate copolymer having a vinyl acetate content of 25% by weight or less and an ethylene/(meth)acrylate copolymer having a (meth)acrylate content of 20% by weight or less, and 6 to 25 parts by weight of electroconductive carbon black having a DBP-absorption number of 220 to 340 ml/100 g and an impurity metal residue of 0.2% by weight or less.

Abstract: 1. A thermoplastic fluorine-containing resin blend composition comprising(a) from 5 to 95% by weight of a thermoplastic fluorine-containing resin, and(b) from 95 to 5% by weight of at least one modified ethylene polymer selected from the group consisting of the following components (i) and (ii).

Abstract: A semiconducting resin composition comprises: (A) 100 to 40 parts of a modified ethylene-vinyl acetate copolymer prepared by graft processing of 100 parts of an ethylene-vinyl acetate copolymer of a vinyl acetate content of less than 35 percent with 25 to 200 parts of an aromatic vinyl monomer; (B) 0 to 60 parts of a rubber; and (C) 3 to 150 parts of a carbon black with respect to 100 parts of the above described components (A) and (B), all quantities in "parts" and "percent" being by weight. A composition of this character has excellent characteristics for its use in forming the outer semiconducting layer of polyethylene-insulated cables.