Abstract: A packaged semiconductor device (450) includes a semiconductor chip (400) having at least one selectively thinned substrate (cavity) region (410). A package (460) is provided for mounting, enclosing and electrically connecting the chip (400) to the outside world, and structure for applying external stress (470) to induce strain in the thinned substrate region (410). The external stress is preferably adjustable, such as by varying the gas flow (or a vacuum) applied through a pressure valve.

Abstract: (A1+A3, B1?B3, C1?C3) Disclosed herein are microfluidic devices having an array of microfluidic valves and other components to meet the requirement of an antibody array for analyte detection. The microfluidic valves disclosed herein enable simultaneous detection of multiple analytes in a sample. One embodiment exemplified herein pertains to a microarray that is in the format of a sandwich assay, each of which comprises a capture antibody, analyte, and secondary detection antibody conjugated with a fluorescent dye or an enzyme or another moiety to facilitate detection. Methods of using microfluidic valves in an array for simultaneously detecting multiple analytes is also disclosed.

Abstract: A neural probe and method of fabricating same are provided. The probe comprises a plurality of frames connected to each other and to a substrate by respective bimorphs. A probe base is connected by another bimorph to the frames. A probe tip extends from the probe base. The probe can achieve a large vertical motion and out-of-plane curling. The probe can operate according to three modes. The first mode pertains to a large-signal motion for tuning in single-unit neuronal activity. The second pertains to a small-signal motion with lock-in amplifier that increases SNR. The third pertains to burst small-signal motion for clearing tissue responses. Fabrication of a neural probe begins with a processed CMOS chip. Post-CMOS processing incorporates self-aligned selective nickel plating and sacrifices two aluminum layers. The fabrication technique produces a neural probe in which the sensing elements are in close proximity to CMOS circuitry.

Abstract: A method of fabricating a MEMS flexible substrate neural probe is provided. The method can include applying an insulation layer on a substrate, and depositing a plurality of metal traces on the insulation layer and electroplating each of the plurality of traces. The method also can include encapsulating the insulation layer and metal traces deposited thereon with an insulation layer. Additionally the method can include etching the insulation layer to form a plurality bond pad sites and probes to form a flexible ribbon cable having a plurality of bond pad sites disposed on a surface of the flexible cable and a plurality of neural probes extending from the flexible cable. The method further can include separating the substrate from the insulation layer and depositing insulation on each of the neural probes, each probe comprising insulated portion and exposed metallic tip.

Abstract: In one embodiment, a neural interface system includes an implantable neural probe having a flexible substrate, electrodes that extend from the substrate that are adapted to contact neural tissue of the brain, a signal processing circuit configured to process neural signals collected with the electrodes, and a wireless transmission circuit configured to wirelessly transmit the processed neural signals, and a backend computing device configured to wirelessly receive the processed neural signals, to process the received signals to reconstruct the collected neural signals, and to analyze the collected neural signals.

Abstract: A packaged semiconductor device (450) includes a semiconductor chip (400) having at least one selectively thinned substrate (cavity) region (410). A package (460) is provided for mounting, enclosing and electrically connecting the chip (400) to the outside world, and structure for applying external stress (470) to induce strain in the thinned substrate region (410). The external stress is preferably adjustable, such as by varying the gas flow (or a vacuum) applied through a pressure valve.

Abstract: A multi-resonator-based system responsive to acoustic waves includes at least two resonators, each including a bottom plate, side walls secured to the bottom plate, and a top plate disposed on top of the side walls. The top plate includes an orifice so that a portion of an incident acoustical wave compresses gas in the resonators. The bottom plate or the side walls include at least one compliant portion. A reciprocal electromechanical transducer coupled to the compliant portion of each of the resonators forms a first and second transducer/compliant composite. An electrical network is disposed between the reciprocal electromechanical transducer of the first and second resonator.

Abstract: Embodiments of the present invention described and shown in the specification and drawings include a combination responsive to an acoustic wave that can be utilized as a dynamic pressure sensor. In one embodiment of the present invention, the combination has a substrate having a first surface and an opposite second surface, a microphone positioned on the first surface of the substrate and having an input and a first output and a second output, wherein the input receives a biased voltage, and the microphone generates an output signal responsive to the acoustic wave between the first output and the second output. The combination further has an amplifier positioned on the first surface of the substrate and having a first input and a second input and an output, wherein the first input of the amplifier is electrically coupled to the first output of the microphone and the second input of the amplifier is electrically coupled to the second output of the microphone for receiving the output signal from the microphone.

Abstract: A Moiré interferometric-based shear-stress sensor includes a substrate support. The substrate includes a first optical grating disposed in or on the substrate, the first grating having a plurality of features defining a first spatial period. A floating element having a second optical grating is disposed in or on the floating element. The second grating has a plurality of features defining a second spatial period. The floating element is suspended over the first grating and flexibly connected to the substrate with compliant springs, wherein the respective gratings are in an optical path with one another. Upon irradiation, the sensor forms a Moiré fringe pattern which relates to a shear-stress induced translation of the floating element.

Abstract: An electromechanical floating element shear-stress sensor, which may also be referred to as a flow rate sensor, having one or more transduction mechanisms coupled to a support arm of a floating element wafer such that the transduction mechanisms are normal to the force applied to a top surface of the floating element. The transduction mechanisms may be generally attached to a side surface of one or more arms supporting the floating element and may be coupled together and to a processor using one or more contacts extending from the backside of the floating element sensor. Thus, the floating element shear-stress sensor may have an unobstructed surface past which a fluid may flow. The floating element may also include a temperature sensing system for accounting for affects of temperature on the floating element system.

Abstract: An integrated MEMS resonant generator system includes a substrate, a plurality of piezoelectric micro generators disposed on the substrate, the micro generators each generating a voltage output in response to vibrational energy received, and at least one power processor disposed on the substrate. The power processor electrically coupled to outputs of the plurality of micro generators. When the input conditions change, the power processor can dynamically adjust its switching functions to optimize the power delivered to a load or energy storage reservoir.

Abstract: An electromechanical floating element shear-stress sensor, which may also be referred to as a flow rate sensor, having one or more transduction mechanisms coupled to a support arm of a floating element wafer such that the transduction mechanisms are normal to the force applied to a top surface of the floating element. The transduction mechanisms may be generally attached to a side surface of one or more arms supporting the floating element and may be coupled together and to a processor using one or more contacts extending from the backside of the floating element sensor. Thus, the floating element shear-stress sensor may have an unobstructed surface past which a fluid may flow. The floating element may also include a temperature sensing system for accounting for affects of temperature on the floating element system.

Abstract: A multi-resonator-based system responsive to acoustic waves includes at least two resonators, each including a bottom plate, side walls secured to the bottom plate, and a top plate disposed on top of the side walls. The top plate includes an orifice so that a portion of an incident acoustical wave compresses gas in the resonators. The bottom plate or the side walls include at least one compliant portion. A reciprocal electromechanical transducer coupled to the compliant portion of each of the resonators forms a first and second transducer/compliant composite. An electrical network is disposed between the reciprocal electromechanical transducer of the first and second resonator.

Abstract: A system responsive to acoustic waves includes a resonator having a bottom plate, side walls secured to the bottom plate, and a top plate disposed on top of the side walls. The top plate includes an orifice. The bottom plate or side walls of the resonator include at least one compliant portion. A reciprocal electromechanical transducer is coupled to the compliant portion of the resonator to form a transducer/compliant composite, wherein the transducer/compliant composite has an open circuit acoustic impedance. An electrical network is coupled to the transducer/compliant composite. The acoustic impedance of the transducer/compliant composite copied to the electrical network is different as compared to the open circuit impedance which perm its the frequency response of the system to be varied over a large range of frequencies.

Abstract: An integrated MEMS resonant generator system includes a substrate, a plurality of piezoelectric micro generators disposed on the substrate, the micro generators each generating a voltage output in response to vibrational energy received, and at least one power processor disposed on the substrate. The power processor electrically coupled to outputs of the plurality of micro generators. When the input conditions change, the power processor can dynamically adjust its switching functions to optimize the power delivered to a load or energy storage reservoir.

Abstract: Embodiments of the present invention described and shown in the specification and drawings include a combination responsive to an acoustic wave that can be utilized as a dynamic pressure sensor. In one embodiment of the present invention, the combination has a substrate having a first surface and an opposite second surface, a microphone positioned on the first surface of the substrate and having an input and a first output and a second output, wherein the input receives a biased voltage, and the microphone generates an output signal responsive to the acoustic wave between the first output and the second output. The combination further has an amplifier positioned on the first surface of the substrate and having a first input and a second input and an output, wherein the first input of the amplifier is electrically coupled to the first output of the microphone and the second input of the amplifier is electrically coupled to the second output of the microphone for receiving the output signal from the microphone.

Abstract: Embodiments of the present invention described and shown in the specification and drawings include a combination responsive to a sound wave that can be utilized as an acoustic liner and/or an acoustic energy reclamation device. The combination has a first plate having a passage for allowing a portion of the sound wave to pass through, a second plate having a hole, and a third plate having an adjustable compliance. The second plate is located between the first plate and the third plate such that the hole of the second plate is closed to form a chamber that is in fluid communication with the passage, and the compliance of the third plate is adjustable for altering a resonant frequency of the chamber to achieve a desired noise suppression of the sound wave.