Patents by Inventor Toshikazu Oda

Toshikazu Oda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210214514
    Abstract: The present invention provides a porous body, the swelling of which under acidic conditions is suppressed, and a method for producing the porous body. The first porous body of the present invention is formed of a copolymer of an epoxy compound and a curing agent, wherein the porous body is a porous body containing no primary to tertiary amino groups and has an interconnected pore structure in which holes provided inside the porous body communicate with each other. The second porous body of the present invention is formed of a copolymer of an epoxy compound and a curing agent, wherein the porous body is a porous body containing no nitrogen atom to be quaternized by acid treatment, and has an interconnected pore structure in which holes provided inside the porous body communicate with each other.
    Type: Application
    Filed: February 27, 2020
    Publication date: July 15, 2021
    Inventors: Norio ISHIZUKA, Toshikazu ODA
  • Patent number: 10858491
    Abstract: The present invention provides porous particles made of an organic polymer, uniform in shape, and having through holes that are not closed. The porous particles according to the present invention are porous particles having a substantially spherical shape. The porous particles are made of an organic polymer. Each of the porous particles has an interconnected pore structure in which through holes provided inside the porous particle communicate with each other, and ends of the through holes are open toward an outside of the porous particle.
    Type: Grant
    Filed: August 5, 2016
    Date of Patent: December 8, 2020
    Assignees: Kyoto University, Emaus Kyoto, Inc., Kosen National Institute of Technology
    Inventors: Norio Ishizuka, Kyoko Konishi, Toshikazu Oda, Yoshinobu Tsujii, Keita Sakakibara, Takaya Sato
  • Publication number: 20200354228
    Abstract: A titania porous body is entirely formed of titania. The titania porous body includes a titania framework, first pores, and second pores. The titania framework forms a three-dimensional network structure. The first pores are opening portions of the three-dimensional structure. The second pores are disposed in a surface of the titania framework. Such a titania porous body is also referred to as a titania monolith.
    Type: Application
    Filed: July 29, 2020
    Publication date: November 12, 2020
    Applicants: NGK INSULATORS, LTD., EMAUS KYOTO, INC.
    Inventors: Kazunari YAMADA, Hideki SHIMIZU, Norio ISHIZUKA, Toshikazu ODA, Kyoko KONISHI
  • Patent number: 10773241
    Abstract: The present invention provides a separating medium including porous resin particles which has a sufficient pore diameter suitable for liquid chromatography applications and which has high strength, is reduced in pressure loss during liquid passing, has the excellent property of separating a desired substance, and has low nonspecific adsorption properties. The separating medium of the invention is a separating medium obtained by treating porous epoxy resin particles and having an average pore diameter of 10 to 2,000 nm, or a separating medium obtained by treating porous epoxy resin particles and having a water content of 50% or higher.
    Type: Grant
    Filed: February 7, 2018
    Date of Patent: September 15, 2020
    Assignees: Mitsubishi Chemical Corporation, EMAUS KYOTO, INC., KYOTO UNIVERSITY
    Inventors: Norio Ishizuka, Kyoko Konishi, Toshikazu Oda, Yoshinobu Tsujii, Keita Sakakibara, Shoya Yoda
  • Publication number: 20180230284
    Abstract: The present invention provides porous particles made of an organic polymer, uniform in shape, and having through holes that are not closed. The porous particles according to the present invention are porous particles having a substantially spherical shape. The porous particles are made of an organic polymer. Each of the porous particles has an interconnected pore structure in which through holes provided inside the porous particle communicate with each other, and ends of the through holes are open toward an outside of the porous particle.
    Type: Application
    Filed: August 5, 2016
    Publication date: August 16, 2018
    Inventors: Norio ISHIZUKA, Kyoko KONISHI, Toshikazu ODA, Yoshinobu TSUJII, Keita SAKAKIBARA, Takaya SATO
  • Publication number: 20180223067
    Abstract: The present invention provides porous particles uniform in shape and having through holes that are not closed. The porous particles according to the present invention are porous particles having a substantially spherical shape. Each of the porous particles has an interconnected pore structure in which through holes provided inside the porous particle communicate with each other, and ends of the through holes are open toward an outside of the porous particle.
    Type: Application
    Filed: August 5, 2016
    Publication date: August 9, 2018
    Inventors: Norio ISHIZUKA, Kyoko KONISHI, Toshikazu ODA, Yoshinobu TSUJII, Keita SAKAKIBARA, Takaya SATO
  • Publication number: 20180161758
    Abstract: The present invention provides a separating medium including porous resin particles which has a sufficient pore diameter suitable for liquid chromatography applications and which has high strength, is reduced in pressure loss during liquid passing, has the excellent property of separating a desired substance, and has low nonspecific adsorption properties. The separating medium of the invention is a separating medium obtained by treating porous epoxy resin particles and having an average pore diameter of 10 to 2,000 nm, or a separating medium obtained by treating porous epoxy resin particles and having a water content of 50% or higher.
    Type: Application
    Filed: February 7, 2018
    Publication date: June 14, 2018
    Applicants: Mitsubishi Chemical Corporation, EMAUS KYOTO, INC., KYOTO UNIVERSITY
    Inventors: Norio ISHIZUKA, Kyoko KONISHI, Toshikazu ODA, Yoshinobu TSUJll, Keita SAKAKIBARA, Shoya YODA
  • Publication number: 20120307117
    Abstract: According to one embodiment, a solid-state imaging device includes: a pixel array section in which pixels that accumulate photoelectrically-converted charges are arranged in a matrix shape; and an analog-voltage stabilizing circuit configured to supply, when an analog voltage exceeds a predetermined value, the analog voltage as a power supply voltage for the pixels and supply, when the analog voltage is equal to or smaller than the predetermined value, the analog voltage as the power supply voltage for the pixels after boosting the analog voltage.
    Type: Application
    Filed: February 8, 2012
    Publication date: December 6, 2012
    Applicant: KABUSHIKI KAISHA TOSHIBA
    Inventors: Maki SATO, Toshikazu ODA
  • Patent number: 8174422
    Abstract: A reference voltage generation circuit generates a reference voltage and outputs it to an amplifier reference voltage line. A power-supply-noise adding circuit adds power supply noise superimposed on a power supply to the reference voltage generated by the reference voltage generation circuit. A differential amplifier amplifies a difference between a voltage of a vertical signal line and a voltage of an amplifier reference voltage line and outputs the amplified voltage.
    Type: Grant
    Filed: March 19, 2010
    Date of Patent: May 8, 2012
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Ryuta Okamoto, Toshikazu Oda
  • Publication number: 20100259430
    Abstract: A reference voltage generation circuit generates a reference voltage and outputs it to an amplifier reference voltage line. A power-supply-noise adding circuit adds power supply noise superimposed on a power supply to the reference voltage generated by the reference voltage generation circuit. A differential amplifier amplifies a difference between a voltage of a vertical signal line and a voltage of an amplifier reference voltage line and outputs the amplified voltage.
    Type: Application
    Filed: March 19, 2010
    Publication date: October 14, 2010
    Applicant: Kabushiki Kaisha Toshiba
    Inventors: Ryuta OKAMOTO, Toshikazu Oda
  • Patent number: 7431533
    Abstract: A floating levee sheet which prevents the river water from overflowing the levee, and a plurality of which are interconnected to cover the waterside levee slope comprising; a watertight sheet body that forms an internal space by being upwardly folded at the upper end; and a loading bag section constructed at the lower end of the sheet body with an open top portion; and a float which is fixed on the sheet body in the across-the-width direction at the upper part of the internal space, and is filled with air and hermetically sealed; and a plurality of joining members whose one end is secured to the upper end of the sheet body, and whose other end comprises an anchoring section to be anchored to the levee top over the anchoring section of the sheet body, and through the intervals of which the overflowing water enters the internal space.
    Type: Grant
    Filed: June 5, 2007
    Date of Patent: October 7, 2008
    Assignee: ENTECH Corporation
    Inventor: Toshikazu Oda
  • Patent number: 6900752
    Abstract: A variable resistance device is disclosed, which comprises a first variable resistance circuit and analog switches, a second variable resistance circuit including series-connected first and second resistors, one terminal of the first resistor connected to one terminal of the second resistor and the other terminal connected to one terminal of the first variable resistance circuit, a series-resistor circuit one terminal of which is connected to the other terminal of the second resistor, analog switches connected between the other terminal of the first resistor and nodes of respective resistors of the series-resistor circuit, an analog switch connected between the other terminal of the series-resistor circuit and a node of the first and second resistors, an analog switch connected between a node of the resistors of the series-resistor circuit and the node of the first and second resistors, and a short-circuiting analog switch connected between the first and second variable resistance circuits.
    Type: Grant
    Filed: July 16, 2003
    Date of Patent: May 31, 2005
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Toshikazu Oda, Mitsuru Nagata, Hiroyuki Eguchi
  • Publication number: 20040061635
    Abstract: A variable resistance device is disclosed, which comprises a first variable resistance circuit and analog switches, a second variable resistance circuit including series-connected first and second resistors, one terminal of the first resistor connected to one terminal of the second resistor and the other terminal connected to one terminal of the first variable resistance circuit, a series-resistor circuit one terminal of which is connected to the other terminal of the second resistor, analog switches connected between the other terminal of the first resistor and nodes of respective resistors of the series-resistor circuit, an analog switch connected between the other terminal of the series-resistor circuit and a node of the first and second resistors, an analog switch connected between a node of the resistors of the series-resistor circuit and the node of the first and second resistors, and a short-circuiting analog switch connected between the first and second variable resistance circuits.
    Type: Application
    Filed: July 16, 2003
    Publication date: April 1, 2004
    Inventors: Toshikazu Oda, Mitsuru Nagata, Hiroyuki Eguchi
  • Patent number: 6458514
    Abstract: One or more through holes are formed by a process in a printed circuit board substrate formed of a resinous dielectric sheet and a conductive layer covering one surface of the dielectric sheet. The process involves the forming by laser one or more cavities on other surface of the dielectric sheet such that the cavities penetrate only the dielectric sheet, without penetrating the conductive layer. Both surfaces of the dielectric sheet are coated with a liquid photoresist layer such that the cavities are filled with the photoresist. A plurality of small areas are formed by photolithography on the surface which is covered with the conductive layer. The small areas are corresponding in location and shape to the cavities which may be of any shape. The small areas are stripped of the conductive, layer by etching before the cavities are stripped of the photoresist. The through holes are thus formed in the small areas defined by the cavities.
    Type: Grant
    Filed: June 7, 2000
    Date of Patent: October 1, 2002
    Inventors: Chong-Ren Maa, Hong-Ming Lin, Toshikazu Oda, Makoto Nakamura, Sunao Meguro
  • Patent number: 6315927
    Abstract: There is disclosed a photosensitive conductive paste comprising a water- or alkali-soluble acidic-functional-group-containing organic binder, a photosensitive organic component, an organic solvent, a conductive powder such as iron or copper, and a mono-ol compound having a boiling point of about 178° C. or higher such as dipropylene glycol monoethyl ether and/or a diol compound such as pentamethylene glycol. The photosensitive conductive paste has excellent storage stability and can be developed consistently.
    Type: Grant
    Filed: March 24, 2000
    Date of Patent: November 13, 2001
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Masahiro Kubota, Michiaki Iha, Shizuharu Watanbe, Satoshi Miyayama, Toshikazu Oda
  • Patent number: 6136506
    Abstract: An ultraviolet-curable and alkali-developing type photo solder resist ink comprises an epoxy resin obtained by extending chains of an epoxy compound by an isocyanate compound having at least two isocyanate groups per one molecule of the isocyanate compound, an ultraviolet-curable resin having carboxyl group and an ethylenically unsaturated group having a photopolymerization capability, a photopolymerization initiator, and a diluent. The resist ink shows a wide precuring acceptable width for providing an extended shelf life, a good tacky-dry property after a precuring step, excellent light-sensitivity at an exposing step, superior resolution, and improved removability of a film of the resist ink by an alkaline solution at a developing step. In addition, a solder resist obtained by a post-baking step of the resist ink film provides excellent resistances to molten solder and gold plating.
    Type: Grant
    Filed: June 22, 1998
    Date of Patent: October 24, 2000
    Assignee: GOO Chemical Co., Ltd.
    Inventors: Soichi Hashimoto, Koichi Yoshioka, Masahiro Mizushima, Toshikazu Oda
  • Patent number: 5916736
    Abstract: A process of manufacturing a printed circuit board having plated landless through-holes involves filling a radiation curable putty material in through-holes plated with copper in a substrate, exposing the material under radiation of light in order to cure the material, placing a liquid resist on the substrate surface, covering a mask over the resist, exposing the resist layer by using a mask having a circuit pattern, developing the resist, etching the substrate surface, and removing the cured putty material in the through-holes and the remaining portion of the resist.
    Type: Grant
    Filed: April 25, 1996
    Date of Patent: June 29, 1999
    Assignee: Goo Chemical Co., Ltd.
    Inventors: Katsuo Doi, Satoshi Miyayama, Toshikazu Oda
  • Patent number: 5821279
    Abstract: A radiation curable filling material is used for a process of manufacturing a printed circuit board having plated landless through-holes. The material is filled in the through-holes and solidified in the through-holes via a photo polymerization to protect plated through-hole interior from an etching solution. The composition comprises a hydrophthalic acid monoester compound as a component (A); a catalyst for promoting photo polymerization of a vinyl group in the mono ester as a component (B); a highly transparent rosin having a Hazen color tone of 300 or less for the improvement of filling material transmission by radiation as a component (C), a powder of extender as a competent (D). The photo polymerization reaction occurs at the vinyl group of the hydrophthalic mono ester with the presence of the catalyst for promoting the photo polymerization. The rate of the reaction is enhanced by adding a vinyl compound such as an acrylate.
    Type: Grant
    Filed: April 25, 1996
    Date of Patent: October 13, 1998
    Assignee: Goo Chemical Co., Ltd.
    Inventors: Katsuo Doi, Satoshi Miyayama, Toshikazu Oda
  • Patent number: 5821031
    Abstract: Disclosed herein is a photosensitive solder resist ink capable of development with a dilute alkaline solution. It has a wide pre-curing latitude. It permits the pre-cured board to be stored for a long period of time. It is superior in resolution, sensitivity, and solder resistance. Disclosed also herein is a printed circuit board having good adhesion, chemical resistance, electrical properties, gold plating resistance, solder heat resistance, and electrocorrosion resistance. Disclosed also herein is a process for producing said printed circuit board by using said solder resist ink.The photosensitive solder resist ink comprises (A) an ultraviolet-curable resin containing 0-20 wt % of aromatic ring moiety which is obtained by reacting a polymer composed of (a) 40-100 mol % of ethylenically unsaturated monomer having an epoxy group and (b) 0-60 mol % of ethylenically unsaturated monomer capable of copolymerization therewith, with (meth)acrylic acid in an amount of 0.7-1.
    Type: Grant
    Filed: May 22, 1996
    Date of Patent: October 13, 1998
    Assignee: Goo Chemical Co., Ltd.
    Inventors: Soichi Hashimoto, Fumito Suzuki, Toshikazu Oda
  • Patent number: 5539064
    Abstract: A resist ink composition developable with a diluted, alkaline solution, which exhibits high dispersion stability itself, can form a pattern with excellent resolution, even in the case of a low exposure amount, and can produce a cured resist film excellent in solvent resistance for high-performance printed circuits and which comprises an ultraviolet-curable resin obtained by copolymerizing (a) from 5 to 50% by weight of an ethylenically unsaturated monomer of a general formula: ##STR1## wherein R.sub.1 represents a hydrogen atom or a methyl group; R.sub.2 represents a hydrogen atom or an alkyl group; n represent an integer of from 1 to 4, and/or glycerol mono(meth)acrylate, (b) from 10 to 90% by weight or glycidyl (meth)acrylate and (c) from 0 to 80% by weight of other ethylenically unsaturated monomers capable of copolymerizing with these (a) and (b), followed by reacting the resulting copolymer with from 0.7 to 1.
    Type: Grant
    Filed: September 12, 1995
    Date of Patent: July 23, 1996
    Assignee: Goo Chemical Industries Co., Ltd.
    Inventors: Soichi Hashimoto, Satoshi Miyayama, Toshiaki Nishimura, Toshikazu Oda