Abstract: A titania porous body is entirely formed of titania. The titania porous body includes a titania framework, first pores, and second pores. The titania framework forms a three-dimensional network structure. The first pores are opening portions of the three-dimensional structure. The second pores are disposed in a surface of the titania framework. Such a titania porous body is also referred to as a titania monolith.

Abstract: The present invention provides a porous body, the swelling of which under acidic conditions is suppressed, and a method for producing the porous body. The first porous body of the present invention is formed of a copolymer of an epoxy compound and a curing agent, wherein the porous body is a porous body containing no primary to tertiary amino groups and has an interconnected pore structure in which holes provided inside the porous body communicate with each other. The second porous body of the present invention is formed of a copolymer of an epoxy compound and a curing agent, wherein the porous body is a porous body containing no nitrogen atom to be quaternized by acid treatment, and has an interconnected pore structure in which holes provided inside the porous body communicate with each other.

Abstract: The present invention provides a porous body, the swelling of which under acidic conditions is suppressed, and a method for producing the porous body. The first porous body of the present invention is formed of a copolymer of an epoxy compound and a curing agent, wherein the porous body is a porous body containing no primary to tertiary amino groups and has an interconnected pore structure in which holes provided inside the porous body communicate with each other. The second porous body of the present invention is formed of a copolymer of an epoxy compound and a curing agent, wherein the porous body is a porous body containing no nitrogen atom to be quaternized by acid treatment, and has an interconnected pore structure in which holes provided inside the porous body communicate with each other.

Abstract: The present invention provides porous particles made of an organic polymer, uniform in shape, and having through holes that are not closed. The porous particles according to the present invention are porous particles having a substantially spherical shape. The porous particles are made of an organic polymer. Each of the porous particles has an interconnected pore structure in which through holes provided inside the porous particle communicate with each other, and ends of the through holes are open toward an outside of the porous particle.

Abstract: A titania porous body is entirely formed of titania. The titania porous body includes a titania framework, first pores, and second pores. The titania framework forms a three-dimensional network structure. The first pores are opening portions of the three-dimensional structure. The second pores are disposed in a surface of the titania framework. Such a titania porous body is also referred to as a titania monolith.

Abstract: The present invention provides a separating medium including porous resin particles which has a sufficient pore diameter suitable for liquid chromatography applications and which has high strength, is reduced in pressure loss during liquid passing, has the excellent property of separating a desired substance, and has low nonspecific adsorption properties. The separating medium of the invention is a separating medium obtained by treating porous epoxy resin particles and having an average pore diameter of 10 to 2,000 nm, or a separating medium obtained by treating porous epoxy resin particles and having a water content of 50% or higher.

Abstract: The present invention provides porous particles made of an organic polymer, uniform in shape, and having through holes that are not closed. The porous particles according to the present invention are porous particles having a substantially spherical shape. The porous particles are made of an organic polymer. Each of the porous particles has an interconnected pore structure in which through holes provided inside the porous particle communicate with each other, and ends of the through holes are open toward an outside of the porous particle.

Abstract: The present invention provides porous particles uniform in shape and having through holes that are not closed. The porous particles according to the present invention are porous particles having a substantially spherical shape. Each of the porous particles has an interconnected pore structure in which through holes provided inside the porous particle communicate with each other, and ends of the through holes are open toward an outside of the porous particle.

Abstract: The present invention provides a separating medium including porous resin particles which has a sufficient pore diameter suitable for liquid chromatography applications and which has high strength, is reduced in pressure loss during liquid passing, has the excellent property of separating a desired substance, and has low nonspecific adsorption properties. The separating medium of the invention is a separating medium obtained by treating porous epoxy resin particles and having an average pore diameter of 10 to 2,000 nm, or a separating medium obtained by treating porous epoxy resin particles and having a water content of 50% or higher.

Abstract: According to one embodiment, a solid-state imaging device includes: a pixel array section in which pixels that accumulate photoelectrically-converted charges are arranged in a matrix shape; and an analog-voltage stabilizing circuit configured to supply, when an analog voltage exceeds a predetermined value, the analog voltage as a power supply voltage for the pixels and supply, when the analog voltage is equal to or smaller than the predetermined value, the analog voltage as the power supply voltage for the pixels after boosting the analog voltage.

Abstract: A reference voltage generation circuit generates a reference voltage and outputs it to an amplifier reference voltage line. A power-supply-noise adding circuit adds power supply noise superimposed on a power supply to the reference voltage generated by the reference voltage generation circuit. A differential amplifier amplifies a difference between a voltage of a vertical signal line and a voltage of an amplifier reference voltage line and outputs the amplified voltage.

Abstract: A reference voltage generation circuit generates a reference voltage and outputs it to an amplifier reference voltage line. A power-supply-noise adding circuit adds power supply noise superimposed on a power supply to the reference voltage generated by the reference voltage generation circuit. A differential amplifier amplifies a difference between a voltage of a vertical signal line and a voltage of an amplifier reference voltage line and outputs the amplified voltage.

Abstract: A floating levee sheet which prevents the river water from overflowing the levee, and a plurality of which are interconnected to cover the waterside levee slope comprising; a watertight sheet body that forms an internal space by being upwardly folded at the upper end; and a loading bag section constructed at the lower end of the sheet body with an open top portion; and a float which is fixed on the sheet body in the across-the-width direction at the upper part of the internal space, and is filled with air and hermetically sealed; and a plurality of joining members whose one end is secured to the upper end of the sheet body, and whose other end comprises an anchoring section to be anchored to the levee top over the anchoring section of the sheet body, and through the intervals of which the overflowing water enters the internal space.

Abstract: A variable resistance device is disclosed, which comprises a first variable resistance circuit and analog switches, a second variable resistance circuit including series-connected first and second resistors, one terminal of the first resistor connected to one terminal of the second resistor and the other terminal connected to one terminal of the first variable resistance circuit, a series-resistor circuit one terminal of which is connected to the other terminal of the second resistor, analog switches connected between the other terminal of the first resistor and nodes of respective resistors of the series-resistor circuit, an analog switch connected between the other terminal of the series-resistor circuit and a node of the first and second resistors, an analog switch connected between a node of the resistors of the series-resistor circuit and the node of the first and second resistors, and a short-circuiting analog switch connected between the first and second variable resistance circuits.

Abstract: A variable resistance device is disclosed, which comprises a first variable resistance circuit and analog switches, a second variable resistance circuit including series-connected first and second resistors, one terminal of the first resistor connected to one terminal of the second resistor and the other terminal connected to one terminal of the first variable resistance circuit, a series-resistor circuit one terminal of which is connected to the other terminal of the second resistor, analog switches connected between the other terminal of the first resistor and nodes of respective resistors of the series-resistor circuit, an analog switch connected between the other terminal of the series-resistor circuit and a node of the first and second resistors, an analog switch connected between a node of the resistors of the series-resistor circuit and the node of the first and second resistors, and a short-circuiting analog switch connected between the first and second variable resistance circuits.

Abstract: One or more through holes are formed by a process in a printed circuit board substrate formed of a resinous dielectric sheet and a conductive layer covering one surface of the dielectric sheet. The process involves the forming by laser one or more cavities on other surface of the dielectric sheet such that the cavities penetrate only the dielectric sheet, without penetrating the conductive layer. Both surfaces of the dielectric sheet are coated with a liquid photoresist layer such that the cavities are filled with the photoresist. A plurality of small areas are formed by photolithography on the surface which is covered with the conductive layer. The small areas are corresponding in location and shape to the cavities which may be of any shape. The small areas are stripped of the conductive, layer by etching before the cavities are stripped of the photoresist. The through holes are thus formed in the small areas defined by the cavities.

Abstract: There is disclosed a photosensitive conductive paste comprising a water- or alkali-soluble acidic-functional-group-containing organic binder, a photosensitive organic component, an organic solvent, a conductive powder such as iron or copper, and a mono-ol compound having a boiling point of about 178° C. or higher such as dipropylene glycol monoethyl ether and/or a diol compound such as pentamethylene glycol. The photosensitive conductive paste has excellent storage stability and can be developed consistently.

Abstract: An ultraviolet-curable and alkali-developing type photo solder resist ink comprises an epoxy resin obtained by extending chains of an epoxy compound by an isocyanate compound having at least two isocyanate groups per one molecule of the isocyanate compound, an ultraviolet-curable resin having carboxyl group and an ethylenically unsaturated group having a photopolymerization capability, a photopolymerization initiator, and a diluent. The resist ink shows a wide precuring acceptable width for providing an extended shelf life, a good tacky-dry property after a precuring step, excellent light-sensitivity at an exposing step, superior resolution, and improved removability of a film of the resist ink by an alkaline solution at a developing step. In addition, a solder resist obtained by a post-baking step of the resist ink film provides excellent resistances to molten solder and gold plating.

Abstract: A process of manufacturing a printed circuit board having plated landless through-holes involves filling a radiation curable putty material in through-holes plated with copper in a substrate, exposing the material under radiation of light in order to cure the material, placing a liquid resist on the substrate surface, covering a mask over the resist, exposing the resist layer by using a mask having a circuit pattern, developing the resist, etching the substrate surface, and removing the cured putty material in the through-holes and the remaining portion of the resist.

Abstract: A radiation curable filling material is used for a process of manufacturing a printed circuit board having plated landless through-holes. The material is filled in the through-holes and solidified in the through-holes via a photo polymerization to protect plated through-hole interior from an etching solution. The composition comprises a hydrophthalic acid monoester compound as a component (A); a catalyst for promoting photo polymerization of a vinyl group in the mono ester as a component (B); a highly transparent rosin having a Hazen color tone of 300 or less for the improvement of filling material transmission by radiation as a component (C), a powder of extender as a competent (D). The photo polymerization reaction occurs at the vinyl group of the hydrophthalic mono ester with the presence of the catalyst for promoting the photo polymerization. The rate of the reaction is enhanced by adding a vinyl compound such as an acrylate.