Patents by Inventor Toshikazu Ooue

Toshikazu Ooue has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6555024
    Abstract: A pressure-sensitive conductive ink composition includes a thermoplastic resin and a conductive filler. The thermoplastic resin is added with a curing agent capable of a partial crosslinkable reaction. The resulting composition maintains its pressure-sensitive characteristics, even at elevated temperatures.
    Type: Grant
    Filed: December 28, 2000
    Date of Patent: April 29, 2003
    Assignee: Nitta Corporation
    Inventors: Tsutomu Ueda, Toshikazu Ooue
  • Patent number: 6511441
    Abstract: A system for measuring tongue pressure includes a thin palate floor plate, thin pressure sensor sheets, an attaching member and a cable. The shape of the thin palate floor plate matches with that of a palate. The thin pressure sensor sheets have a plurality of pressure sensing cells secured to the lower surface of the palate floor plate. The attaching member attaches the palate floor plate to a proper position in the palate. The cable transmits information from the pressure sensing cells of the pressure sensor sheets to an apparatus outside the palate, and is let out of the oral cavity extending around the back of the final gum tooth and passing along the vestibule of the oval cavity when the palate floor plate is attached in the palate. Each of the pressure sensor sheets has two resin backings structured in one body, each of which has a plurality of electrodes covered with a pressure-sensitive ink layer on one side. Between the backings, air is contained gastightly.
    Type: Grant
    Filed: June 15, 2001
    Date of Patent: January 28, 2003
    Assignee: Advanced Telecommunications Research Institute International
    Inventors: Masahiko Wakumoto, Shinobu Masaki, Toshikazu Ooue
  • Publication number: 20010015423
    Abstract: A pressure-sensitive conductive ink composition includes a thermoplastic resin and a conductive filler. The thermoplastic resin is added with a curing agent capable of a partial crosslinkable reaction. The resulting composition maintains its pressure-sensitive characteristics, even at elevated temperatures.
    Type: Application
    Filed: December 28, 2000
    Publication date: August 23, 2001
    Inventors: Tsutomu Ueda, Toshikazu Ooue