Patents by Inventor Toshikazu SHIMOKATANO

Toshikazu SHIMOKATANO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting device and solder bond structure
    Patent number: 10546988
    Abstract: A light emitting device includes a light emitting element; a sub-mount including a sub-mount substrate with a front surface on which the light emitting element is disposed, and a back surface electrode disposed in a back surface that is on a back side of the front surface of the sub-mount substrate; a main-mount in which the sub-mount is disposed, the main-mount including a front surface metal pattern including a wiring electrode bonded to the back surface electrode via solder. The front surface metal pattern has a slit, in a plan view, at a position away from a disposition region in which the sub-mount is disposed.
    Type: Grant
    Filed: February 1, 2018
    Date of Patent: January 28, 2020
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Masahiro Hayashi, Tetsuya Kamada, Takashi Kuwaharada, Kiyomi Hagihara, Toshikazu Shimokatano, Shigeo Hayashi, Hiroki Shirozono, Hideaki Usukubo
  • LIGHT EMITTING DEVICE AND SOLDER BOND STRUCTURE
    Publication number: 20180159006
    Abstract: A light emitting device includes a light emitting element; a sub-mount including a sub-mount substrate with a front surface on which the light emitting element is disposed, and a back surface electrode disposed in a back surface that is on a back side of the front surface of the sub-mount substrate; a main-mount in which the sub-mount is disposed, the main-mount including a front surface metal pattern including a wiring electrode bonded to the back surface electrode via solder. The front surface metal pattern has a slit, in a plan view, at a position away from a disposition region in which the sub-mount is disposed.
    Type: Application
    Filed: February 1, 2018
    Publication date: June 7, 2018
    Inventors: Masahiro HAYASHI, Tetsuya KAMADA, Takashi KUWAHARADA, Kiyomi HAGIHARA, Toshikazu SHIMOKATANO, Shigeo HAYASHI, Hiroki SHIROZONO, Hideaki USUKUBO