Patents by Inventor Toshiki ASAI
Toshiki ASAI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230353038Abstract: A power supply control device includes: a power conversion device; a controller; a current detection device; a comparison device configured to output a shut-off start signal when a value of current detected by the current detection device is larger than a preset current threshold value; a shut-off device configured to shut off, based on a shut-off control signal, a conversion operation signal; a latch device configured to output the shut-off control signal based on the shut-off start signal output by the comparison device and to perform, until a latch release signal is input, a latch operation, in which the shut-off device is caused to maintain a state in which a conversion operation signal is shut off; and a delay device configured to output a latch release signal after a delay time elapses, the delay time being determined by components of the delay device.Type: ApplicationFiled: November 18, 2020Publication date: November 2, 2023Inventors: Toshiki ASAI, Akihiro TSUMURA
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Patent number: 11658601Abstract: A motor control device includes a power converter that supplies a three-phase voltage to two motors being connected in parallel, a three-phase power line that connects between one of the two motors and the power converter, a branch three-phase power line that connects between the other of the two motors and the power converter, a switching device having two switches that are provided on the branch three-phase power line, a current detection device that detects three-phase currents flowing in the two motors, and a controller. The controller performs a failure determination of the switching device by identifying a phase of a power line in which no current flows in the three-phase power line and the branch three-phase power line, and, when a failure is detected in one of the two switches in the failure determination, controls to change a state of the other switch, which operates normally, to coincide with a state of the failed switch.Type: GrantFiled: April 23, 2019Date of Patent: May 23, 2023Assignee: Mitsubishi Electric CorporationInventors: Toshiki Asai, Akihiro Tsumura, Yasuhiko Wada, Junji Morimoto, Shigeo Takata
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Publication number: 20220345070Abstract: A motor control device includes a power converter that supplies a three-phase voltage to two motors being connected in parallel, a three-phase power line that connects between one of the two motors and the power converter, a branch three-phase power line that connects between the other of the two motors and the power converter, a switching device having two switches that are provided on the branch three-phase power line, a current detection device that detects three-phase currents flowing in the two motors, and a controller. The controller performs a failure determination of the switching device by identifying a phase of a power line in which no current flows in the three-phase power line and the branch three-phase power line, and, when a failure is detected in one of the two switches in the failure determination, controls to change a state of the other switch, which operates normally, to coincide with a state of the failed switch.Type: ApplicationFiled: April 23, 2019Publication date: October 27, 2022Inventors: Toshiki ASAI, Akihiro TSUMURA, Yasuhiko WADA, Junji MORIMOTO, Shigeo TAKATA
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Patent number: 11445609Abstract: There is provided a printed circuit board in which an amount of molten solder adhering over electrodes adjacent to each other is increased in flow soldering. The printed circuit board according to the present invention includes: a first insulating substrate (6) having a mounting hole (15) that penetrates through the first insulating substrate (6) from a first surface (6a) to a second surface (6b); a second insulating substrate (18) including a connection portion (23a) that penetrates through the mounting hole (15) from the first surface (6a) side and protrudes from the second surface (6b); first electrodes (7 and 9) that are provided on the second surface (6b) and are arranged at an edge of the mounting hole (15); and second electrodes (19 and 25) provided on the connection portion (23a). The first electrodes (7 and 9) and the second electrodes (19 and 25) are joined by solder.Type: GrantFiled: February 13, 2019Date of Patent: September 13, 2022Assignee: Mitsubishi Electric CorporationInventors: Yoshiko Fujima, Toshiki Asai, Yusuke Morimoto, Kohei Sato, Shunsuke Sasaki
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Patent number: 11432403Abstract: A printed circuit board includes: a first insulating substrate having a mounting hole that penetrates through the first insulating substrate from a first surface to a second surface; a second insulating substrate including a connection portion; a first electrode provided on the second surface and disposed at an edge of the mounting hole; a second electrode provided on the connection portion and joined to the first electrode; and an electronic component provided on the second surface. A center of mass of the second insulating substrate is disposed on the first surface of the first insulating substrate. A center of mass of the electronic component is disposed on the second surface of the first insulating substrate. The electronic component has a weight equivalent to a weight of the second insulating substrate.Type: GrantFiled: February 13, 2019Date of Patent: August 30, 2022Assignee: Mitsubishi Electric CorporationInventors: Yoshiko Fujima, Toshiki Asai, Yusuke Morimoto, Kohei Sato, Shunsuke Sasaki
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Patent number: 11226119Abstract: A heat exchanger unit connected to a refrigerant pipe in which refrigerant is sealed includes plural heat sources, each of the heat sources having a different amount of heat generation, and plural cooling units. Each of the cooling units cools an associated one of the heat sources. Cooling provided by each of the cooling units is different depending on amounts of heat generation of the associated heat source.Type: GrantFiled: September 21, 2017Date of Patent: January 18, 2022Assignee: Mitsubishi Electric CorporationInventor: Toshiki Asai
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Publication number: 20210267060Abstract: There is provided a printed circuit board in which an amount of molten solder adhering over electrodes adjacent to each other is increased in flow soldering. The printed circuit board according to the present invention includes: a first insulating substrate (6) having a mounting hole (15) that penetrates through the first insulating substrate (6) from a first surface (6a) to a second surface (6b); a second insulating substrate (18) including a connection portion (23a) that penetrates through the mounting hole (15) from the first surface (6a) side and protrudes from the second surface (6b); first electrodes (7 and 9) that are provided on the second surface (6b) and are arranged at an edge of the mounting hole (15); and second electrodes (19 and 25) provided on the connection portion (23a). The first electrodes (7 and 9) and the second electrodes (19 and 25) are joined by solder.Type: ApplicationFiled: February 13, 2019Publication date: August 26, 2021Inventors: Yoshiko FUJIMA, Toshiki ASAI, Yusuke MORIMOTO, Kohei SATO, Shunsuke SASAKI
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Publication number: 20210267056Abstract: A printed circuit board includes: a first insulating substrate having a mounting hole that penetrates through the first insulating substrate from a first surface to a second surface; a second insulating substrate including a connection portion; a first electrode provided on the second surface and disposed at an edge of the mounting hole; a second electrode provided on the connection portion and joined to the first electrode; and an electronic component provided on the second surface. A center of mass of the second insulating substrate is disposed on the first surface of the first insulating substrate. A center of mass of the electronic component is disposed on the second surface of the first insulating substrate. The electronic component has a weight equivalent to a weight of the second insulating substrate.Type: ApplicationFiled: February 13, 2019Publication date: August 26, 2021Inventors: Yoshiko FUJIMA, Toshiki ASAI, Yusuke MORIMOTO, Kohei SATO, Shunsuke SASAKI
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Publication number: 20200240652Abstract: A heat exchanger unit connected to a refrigerant pipe in which refrigerant is sealed includes a plurality of heat sources, each of the heat sources having a different amount of heat generation, and a plurality of cooling units each configured to cool associated one of the plurality of heat sources. Cooling schemes of the plurality of cooling units are different depending on amounts of heat generation of the plurality of heat sources.Type: ApplicationFiled: September 21, 2017Publication date: July 30, 2020Inventor: Toshiki ASAI