Abstract: A control server which includes a control server controller which, on a screen for displaying print text data according to a layout according to which receipt information is printed on a paper, displays a plurality of setting items corresponding to an extraction item as a setting menu and receives selection of the setting item in a state where selection of extraction item related text is received and the extraction item related text is selected, sets the extraction item related text as item value text in a case where an item value setting item is selected, generates an extraction condition for extracting the item value text from print text data based on at least one of a relative position of the item value text in the print text data and an attribute of the item value text, and extracts text matching the generated extraction condition as the item value text.

Abstract: A control server which includes a control server controller which, on a screen for displaying print text data according to a layout according to which receipt information is printed on a paper, displays a plurality of setting items corresponding to an extraction item as a setting menu and receives selection of the setting item in a state where selection of extraction item related text is received and the extraction item related text is selected, sets the extraction item related text as item value text in a case where an item value setting item is selected, generates an extraction condition for extracting the item value text from print text data based on at least one of a relative position of the item value text in the print text data and an attribute of the item value text, and extracts text matching the generated extraction condition as the item value text.

Abstract: Disclosed is a method for manufacturing a semiconductor device. The method comprises: forming a resist layer over a substrate; exposing the resist layer to light thereby to form a first exposed pattern and a second exposed pattern on the resist layer, the second exposed pattern being used for forming one or more trenches; contacting the resist layer with a developing solution thereby to form a patterned resist having an opening corresponding to the first exposed pattern and to form one or more trenches corresponding to the second exposed pattern on a surface layer of the patterned resist; and conducting a bake process on the patterned resist.

Abstract: Disclosed is a method for manufacturing a semiconductor device. The method comprises: forming a resist layer over a substrate; exposing the resist layer to light thereby to form a first exposed pattern and a second exposed pattern on the resist layer, the second exposed pattern being used for forming one or more trenches; contacting the resist layer with a developing solution thereby to form a patterned resist having an opening corresponding to the first exposed pattern and to form one or more trenches corresponding to the second exposed pattern on a surface layer of the patterned resist; and conducting a bake process on the patterned resist.