Abstract: An information processing apparatus includes a converting portion having a plurality of electrical conductors to be arranged in mutual separation and a medium arranged so as to mutually connect the plurality of electrical conductors, wherein the converting portion is the information processing apparatus to convert an input signal to an output signal. The medium includes the electrolyte and is configured to be capable of controlling an electrical conductivity of an electrically conductive path mutually electrically connecting the plurality of electrical conductors, and the medium is selected such that the electrical conductivity of the electrically conductive path changes over time with the input signal not being present.

Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.

Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.

Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.

Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.

Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.

Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.

Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.

Abstract: A semiconductor device includes a package and a cooler. The semiconductor package includes a semiconductor element, a metal member, and a molding member for encapsulating the semiconductor element and the metal member. The metal member has a metal portion thermally connected to the semiconductor element, an insulating layer on the metal portion, and a conducting layer on the insulating layer. The conducting layer is at least partially exposed outside the molding member and serves as a radiation surface for radiating heat of the semiconductor element. The cooler has a coolant passage through which a coolant circulates to cool the conducting layer. The conducting layer and the cooler are electrically connected together.

Abstract: A method of formation of a thermal spray coating which forms a thermal spray coating on a coating-forming surface, characterized by comprising a thermal spraying step of thermally spraying feedstock powder on the coating-forming surface and a deposition and coating forming step of having the thermally sprayed feedstock powder deposit on the coating-forming surface and solidify to form a coating, in the deposition and coating forming step, when deposited on the coating-forming surface by thermal spraying, the feedstock powder deposits in the solid phase state in 50 to 90%, preferably 70 to 80%, of the whole so as to raise the ratio of the crystallite remaining in the feedstock powder and secure a high heat conductivity.

Abstract: The invention aims at providing an infrared-ray absorption film having a low reflection factor and a high absorption ratio equivalent to those of gold black through an economical process such as ink jet printing involving the steps of printing a porous material solution and then conducting sintering without using a vacuum process. The invention provides an infrared-ray absorption film using a porous material which suitably has a pore size within the range of hundreds of nm to several ?m and is formed of a metal oxide of carbon or silica, an organic/inorganic hybrid material or a meso-porous material having the composition described above. The infrared-ray absorption film is produced by applying the porous material precursor solution onto a substrate and then conducting sintering.

Abstract: An organic EL device has a structure in which an anode, a hole transporting layer, an organic luminescent layer, and a cathode are disposed on a glass substrate in this order. The organic EL device further has a protective layer covering an outer surface of the structure to protect it from an external environment. The protective layer is formed by an ALE method at a temperature lower than glass transition temperatures materials constituting the hole transporting layer and the organic luminescent layer.

Abstract: The invention aims at providing an infrared-ray absorption film having a low reflection factor and a high absorption ratio equivalent to those of gold black through an economical process such as ink jet printing involving the steps of printing a porous material solution and then conducting sintering without using a vacuum process. The invention provides an infrared-ray absorption film using a porous material which suitably has a pore size within the range of hundreds of nm to several ?m and is formed of a metal oxide of carbon or silica, an organic/inorganic hybrid material or a meso-porous material having the composition described above. The infrared-ray absorption film is produced by applying the porous material precursor solution onto a substrate and then conducting sintering.

Abstract: An organic EL device has a structure in which an anode, a hole transporting layer, an organic luminescent layer, and a cathode are disposed on a glass substrate in this order. The organic EL device further has a protective layer covering an outer surface of the structure to protect it from an external environment. The protective layer is formed by an ALE method at a temperature lower than glass transition temperatures materials constituting the hole transporting layer and the organic luminescent layer.

Abstract: A matrix type display is provided in which information is transmitted to a flat panel display element such as a liquid crystal or electroluminescent panel utilizing optical communication. Synchronization signals are transmitted from a synchronization circuit to scan electrode driving circuits through optical communication utilizing a plurality of pairs of light-emitting elements and light-receiving elements facing each other, and image data is transmitted from a memory circuit to signal electrode driving circuits through non-interfering optical communication signals utilizing a plurality of opposing pairs of light-emitting elements and light-receiving elements.

Abstract: The polyolefin stretch film comprises a film produced from a resin composition principally composed of a polyolefin resin consisting either entirely of ethylene (meth)acrylic acid copolymer or ethylene (meth)acrylic acid (meth)acrylic ester terpolymer, or a mixed resin of both, and being, insofar as necessary, compounded with an anti-fogging agent and a tackifier, such film having a stress at 100% elongation in the longitudinal direction of 12-30 MPa and a stress at 100% elongation in the transverse direction of 5-11 MPa. This film is suitably used as a stretch wrap film material for packaging food and various items, inasmuch as it is free of pollution and sanitary/health hazard problems, and imparts a large elongation, excellent cut property of traverse direction, adherence/conformance property (cling property), elastic recovery after distention by fingertips, etc.

Abstract: An organic EL device has a structure in which an anode, a hole transporting layer, an organic luminescent layer, and a cathode are disposed on a glass substrate in this order. The organic EL device further has a protective layer covering an outer surface of the structure to protect it from an external environment. The protective layer is formed by an ALE method at a temperature lower than glass transition temperatures materials constituting the hole transporting layer and the organic luminescent layer.

Abstract: A negative electrode comprises carbon particles which individually consist of a core of crystalline carbon and an amorphous carbon layer formed on at least a part of the surfaces of the core, and an amorphous carbon matrix dispersing the carbon particles therein. The carbon matrix is formed by thermal decomposition of a thermosetting resin. A non-aqueous electrolyte secondary cell which comprises an electrode of the type mentioned above as at least one of electrodes is also described.