Patents by Inventor Toshiki Iwata

Toshiki Iwata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5250241
    Abstract: A method and a device for forming a molded portion at an end of an extruded weather strip. The method includes the steps of placing the end of the extruded weather strip made of foamed elastic material in a cavity defined by a movable upper mold member and a fixed lower mold member which composes a mold, closing the mold with the end of the extruded weather strip clamped by a predetermined clamping force, injecting a foamable molding material into the cavity, moving the upper mold member up by an force not more than the clamping amount in the process of foaming of the foamable molding material to reduce clamping of the upper mold member and to enlarge the cavity, continuing molding with the upper mold member moved up until the foamable molding material fills the enlarged cavity, and opening the mold when molding of the molded portion is completed.
    Type: Grant
    Filed: October 18, 1991
    Date of Patent: October 5, 1993
    Assignee: Toyoda Gosei Co., Ltd.
    Inventors: Tadanobu Iwasa, Tatsuhiko Nagata, Toshiki Iwata, Hiroyasu Kozawa
  • Patent number: 5111063
    Abstract: An integrated circuit comprises a first clock driver responsive to an external clock signal and producing a first clock signal, a second clock driver responsive to the first clock signal and producing a second clock signal delayed from the first clock signal, an internal circuit responsive to the second clock signal and producing an output data signal, and an output circuit coupled to a data output pin and transferring the output data signal to the data output pin in synchronization with the first clock signal, so that a time interval between the production of the output data signal and the validity at the data output pin is shrunk even though a large parasitic capacitance is coupled to the data output pin.
    Type: Grant
    Filed: February 5, 1990
    Date of Patent: May 5, 1992
    Assignee: NEC Corporation
    Inventor: Toshiki Iwata