Abstract: A novel semiconductor device includes a plurality of light emitting diodes, a plurality of transistors, a source pad, and a plurality of wires. The plurality of transistors drive the plurality of light emitting diodes. The source pad is connected to sources of the plurality of transistors and supplies an electric current to each of the plurality of transistors. The plurality of wires connect the source pad and the sources of the plurality of transistors. The plurality of wires also provide substantially equal resistance to the electric current passing therethrough.

Abstract: A load driving circuit is disclosed that allows a charge pump circuit to operate at an optimum step-up ratio without frequently changing the step-up ratio. The load driving circuit includes a step-up circuit; a current setting circuit that sets a value of an electric current to be supplied to a load; a constant current circuit generating a constant electric current having the set value; a determination circuit; and a control circuit. In response to a load current setting signal, the current setting circuit sets the electric current to be maximum, and decreases the electric current step by step down to a preset value. Each time the electric current is decreased by one step, the control circuit changes the step-up ratio according to the determination results of the determination circuit, until the constant current circuit supplies the set electric current.

Abstract: An integrated circuit having an MCM structure, an interface circuit used in the integrated circuit, and an apparatus incorporating the integrated circuit are disclosed. The integrated circuit includes at least two semiconductor devices formed on a common substrate. The semiconductor devices are interconnected via an interface circuit, capable of converting a single-ended signal received from one semiconductor device to a differential signal, and providing the differential signal to another semiconductor device. The interface circuit includes a pair of bonders, which physically connect the semiconductor devices.

Abstract: A load driving circuit is disclosed that allows a charge pump circuit to operate at an optimum step-up ratio without frequently changing the step-up ratio. The load driving circuit includes a step-up circuit; a current setting circuit that sets a value of an electric current to be supplied to a load; a constant current circuit generating a constant electric current having the set value; a determination circuit; and a control circuit. In response to a load current setting signal, the current setting circuit sets the electric current to be maximum, and decreases the electric current step by step down to a preset value. Each time the electric current is decreased by one step, the control circuit changes the step-up ratio according to the determination results of the determination circuit, until the constant current circuit supplies the set electric current.

Abstract: A power supply device includes a step-up circuit configured to supply a driving voltage to a load, a comparison circuit configured to compare an output voltage from the load with a reference voltage, and a control circuit configured to control the step-up circuit based on a comparison result generated by the comparison circuit. The step-up circuit includes multiple operation modes each outputting a given voltage not lower than a power source voltage. The control circuit controls the step-up circuit to operate in one of the multiple operation modes. The control circuit maintains a current operation mode of the step-up circuit until the output voltage from the load decrease to below the reference voltage and, when the output voltage from the load is less than the reference voltage, switches the operation mode to another operation mode to output a voltage higher than a voltage output in the current operation mode.

Abstract: A power supply device includes a step-up circuit configured to supply a driving voltage to a load, a comparison circuit configured to compare an output voltage from the load with a reference voltage, and a control circuit configured to control the step-up circuit based on a comparison result generated by the comparison circuit. The step-up circuit includes multiple operation modes each outputting a given voltage not lower than a power source voltage. The control circuit controls the step-up circuit to operate in one of the multiple operation modes. The control circuit maintains a current operation mode of the step-up circuit until the output voltage from the load decrease to below the reference voltage and, when the output voltage from the load is less than the reference voltage, switches the operation mode to another operation mode to output a voltage higher than a voltage output in the current operation mode.

Abstract: A novel semiconductor device includes a plurality of light emitting diodes, a plurality of transistors, a source pad, and a plurality of wires. The plurality of transistors drive the plurality of light emitting diodes. The source pad is connected to sources of the plurality of transistors and supplies an electric current to each of the plurality of transistors. The plurality of wires connect the source pad and the sources of the plurality of transistors. The plurality of wires also provide substantially equal resistance to the electric current passing therethrough.

Abstract: A low voltage differential signaling transmitting circuit includes a driver circuit that outputs currents as differential signals from its pair of output terminals in accordance with a digital signal input to its input terminal, a bias circuit that supplies the driver circuit with a bias current so as to adjust values of the currents output from the driver circuit, a current/voltage conversion circuit that converts the currents output from the pair of output terminals of the driver circuit into voltages, and a receiver circuit that compares the voltages with each other and outputs a signal representing a result of the comparison. The bias circuit and the current/voltage conversion circuit are arranged on a same semiconductor chip.

Abstract: An integrated circuit having an MCM structure, an interface circuit used in the integrated circuit, and an apparatus incorporating the integrated circuit are disclosed. The integrated circuit includes at least two semiconductor devices formed on a common substrate. The semiconductor devices are interconnected via an interface circuit, capable of converting a single-ended signal received from one semiconductor device to a differential signal, and providing the differential signal to another semiconductor device. The interface circuit includes a pair of bonders, which physically connect the semiconductor devices.

Abstract: A low voltage differential signaling transmitting circuit includes a driver circuit that outputs currents as differential signals from its pair of output terminals in accordance with a digital signal input to its input terminal, a bias circuit that supplies the driver circuit with a bias current so as to adjust values of the currents output from the driver circuit, a current/voltage conversion circuit that converts the currents output from the pair of output terminals of the driver circuit into voltages, and a receiver circuit that compares the voltages with each other and outputs a signal representing a result of the comparison. The bias circuit and the current/voltage conversion circuit are arranged on a same semiconductor chip.