Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed; a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; and a sealing resin for sealing the semiconductor chip, the die pad frame, and the conductive connection member for die pad.

Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region an an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed; a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; and a sealing resin for sealing the semiconductor chip, the die pad frame, and the conductive connection member for die pad.

Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed; a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; a first clip frame disposed on the upper surface of the semiconductor chip; a first clip conductive connection member disposed between the first electrode on the semiconductor chip and a lower surface of the first clip frame, the first clip conductive connection member electrically connecting the first electrode of the semiconductor chip and the lower surface of the first clip frame; and a sealing resin for sealing the semic

Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed; a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; and a sealing resin for sealing the semiconductor chip, the die pad frame, and the conductive connection member for die pad.

Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; a first clip frame disposed on the upper surface of the semiconductor chip; a first clip conductive connection member disposed between the first electrode on the semiconductor chip and a lower surface of the first clip frame, the first clip conductive connection member electrically connecting the first electrode of the semiconductor chip and the lower surface of the first clip frame; and a sealing resin.

Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed; a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; a first clip frame disposed on the upper surface of the semiconductor chip; a first clip conductive connection member disposed between the first electrode on the semiconductor chip and a lower surface of the first clip frame, the first clip conductive connection member electrically connecting the first electrode of the semiconductor chip and the lower surface of the first clip frame; and a sealing resin for sealing the semic

Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed; a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; and a sealing resin for sealing the semiconductor chip, the die pad frame, and the conductive connection member for die pad.

Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; a first clip frame disposed on the upper surface of the semiconductor chip; a first dip conductive connection member disposed between the first electrode on the semiconductor chip and a lower surface of the first clip frame, the first clip conductive connection member electrically connecting the first electrode of the semiconductor chip and the lower surface of the first clip frame and a sealing resin.

Abstract: Provided are a membrane filtering device managing system by which the membrane filtering device can be managed with a better precision and membrane filtering device for use therein, as well as to a membrane filtering device managing method. At least two sensors of an electric conductivity sensor 11, a flow rate sensor 13, and a pressure sensor 15 are provided in at least two membrane elements 10 provided in a membrane filtering device 50. A managing device 200 obtains data from the at least two sensor, and compares the data with comparison data that represents a correlative relationship between a position along the axial line direction in the membrane filtering device 50 and a standard value obtained from the at least two sensor. Accordingly, it is possible to specify the cause of change occurring in the membrane filtering device 50 more definitely, and to carried out a suitable maintenance in accordance with the cause, so that the membrane filtering device 50 can be managed with a higher precision.

Abstract: Provided are a spiral type membrane element that can re-collect the electric power that is used in a good manner, and a spiral type membrane filtering device having the same. The spiral type membrane element comprises a power generating section that generates electric power by using a liquid, and an electric power outputting section that outputs, either in a wired manner or in a wireless manner, the electric power supplied from said power generating section. The electric power that is generated in the power generating section using the liquid (raw water, permeated water, or concentrated water) can be output from the electric power outputting section in a wired manner or in a wireless manner. Therefore, the electric power that is output from the aforesaid electric power outputting section can be used in an electric component disposed outside or can be stored into a capacitor section disposed outside.

Abstract: Provided are a spiral type membrane element that can re-collect the electric power that is used in a good manner, and a spiral type membrane filtering device having the same. The spiral type membrane element comprises a power generating section that generates electric power by using a liquid, and an electric power outputting section that outputs, either in a wired manner or in a wireless manner, the electric power supplied from said power generating section. The electric power that is generated in the power generating section using the liquid (raw water, permeated water, or concentrated water) can be output from the electric power outputting section in a wired manner or in a wireless manner. Therefore, the electric power that is output from the aforesaid electric power outputting section can be used in an electric component disposed outside or can be stored into a capacitor section disposed outside.

Abstract: Provided are a spiral type membrane filtering device by which an electric component can be re-used and a mounting member, as well as a membrane filtering device managing system and a membrane filtering device managing method using the same. An interconnector (42) attachable and detachable to a membrane element is provided with a sensor that detects the property of liquid such as raw water or permeated water that flows within a membrane filtering device, or a power generating section (26). Therefore, even if the membrane element is to be replaced, the sensor or the power generating section (26) can be re-used by re-mounting the interconnector 42 onto a new membrane element. Also, since there is no need to add a change to the membrane element, a conventional membrane element can be used as it is.

Abstract: Provided are a spiral type membrane element that can ensure a larger amount of electric power without performing a cumbersome work and a spiral type membrane filtering device having the element, as well as a membrane filtering device managing system and a membrane filtering device managing method using the device. The spiral type membrane element comprises a sensor for detecting a property of liquid, a power generating section that generates electric power by using said liquid, and a wireless transmitting section that receives the electric power supplied from said power generating section and wirelessly transmits a detection signal from said sensor. By generating electric power in the power generating section with use of the liquid detected by the sensor, a larger amount of electric power can be ensured without performing a cumbersome work.

Abstract: Provided are a membrane filtering device managing system by which the membrane filtering device can be managed with a better precision and membrane filtering device for use therein, as well as to a membrane filtering device managing method. At least two sensors of an electric conductivity sensor 11, a flow rate sensor 13, and a pressure sensor 15 are provided in at least two membrane elements 10 provided in a membrane filtering device 50. A managing device 200 obtains data from the at least two sensor, and compares the data with comparison data that represents a correlative relationship between a position along the axial line direction in the membrane filtering device 50 and a standard value obtained from the at least two sensor. Accordingly, it is possible to specify the cause of change occurring in the membrane filtering device 50 more definitely, and to carried out a suitable maintenance in accordance with the cause, so that the membrane filtering device 50 can be managed with a higher precision.

Abstract: Disclosed is a pressure-sensitive adhesive tape which has a sufficient pressure-sensitive adhesive strength for an adherend, is excellent in heat resistance, and can be easily peeled without leaving a pressure-sensitive adhesive residue on the adherend particularly upon peeling. The pressure-sensitive adhesive tape includes, on a base material sheet, a pressure-sensitive adhesive layer containing a pressure-sensitive adhesive composition and a lipophilic layered clay mineral dispersed in the pressure-sensitive adhesive composition, in which pieces of the layered clay mineral are arranged substantially perpendicular to the base material sheet.