Abstract: The number of components of a semiconductor package is reduced. The semiconductor package includes a solid-state imaging element, a frame, and an adhesive. In the semiconductor package, the solid-state imaging element has a pixel region in which pixels are arrayed and a circuit region in which a predetermined circuit is arranged adjacent to the pixel region. In the semiconductor package, an inner wall of the frame surrounds an outer periphery of the solid-state imaging element, and a part of the inner wall is extended inward. In the semiconductor package, the adhesive bonds the extended portion of the frame and the circuit region.

Abstract: Circuits are added while an increase in size of a semiconductor package is prevented. The semiconductor package includes a transparent member; an embedding resin; an embedded circuit; and a solid-state image pickup element. In the semiconductor package, the embedding resin is formed around the transparent member. Further, in the semiconductor package, the embedded circuit is embedded in the embedding resin. Further, in the semiconductor package, the solid-state image pickup element performs photoelectric conversion on light that has passed through the transparent member and thereby generates image data.

Abstract: Heat is efficiently discharged without impairing an imaging characteristic of a solid-state imaging element mounted on a substrate. A semiconductor device is provided with a substrate, the solid-state imaging element, and an adhesive portion that adheres the substrate and the solid-state imaging element. The substrate is a substrate provided with metal wiring. The solid-state imaging element is mounted on a surface of the substrate. The adhesive portion adheres a predetermined region on one surface of the solid-state imaging element to the substrate. The adhesive portion has predetermined thermal conductivity and discharges heat generated in the solid-state imaging element toward the substrate.

Abstract: A recess (5a) in the corner direction and recesses (5b) in side directions are formed in each connecting pad (5A) located at a corner of a lower surface-side of an insulating base 2 having groove-shaped recesses (6) in the periphery, and groove-shaped recesses (6a and 6b) in the corner and side directions are formed in each corner portion (2A) of the insulating base 2 corresponding to the connecting pad (5A). Connecting pads (5) of an electronic apparatus in which an electronic component is mounted on the insulating base 2 are mounted on an external electrical circuit board by using a solder. A solder (31) melted during the solder-mounting adheres onto the groove-shaped recesses (6a and 6b) in the corner and side directions of the corner portion (2A) of the insulating base 2 and thus solder fillets are formed in the groove-shaped recesses (6a and 6b).

Abstract: The present invention provides a fuel cell which is good in gas permeability of a diffusion layer, exhibits good discharge of water vapor and a carbon dioxide gas, and can improve output properties. The fuel cell includes a cell (20), which comprises an electrolyte membrane (22), a cathode layer (24) provided on one side of the electrolyte membrane and an anode layer (26) provided on the other side thereof and in which a redox reaction takes place between a fed fuel, such as methane, and an oxidizing agent, such as oxygen, through the electrolyte membrane (22) to generate an electromotive force, and is characterized in that a diffusion layer (24b, 26b), which is composed of a carbon fiber fabric having a protrusion part (24c, 26c) protruded outward from a side face to which a fuel or oxidizing agent will be fed, is provided on at least one of the cathode layer (24) and the anode layer (26).

Abstract: A recess (5a) in the corner direction and recesses (5b) in side directions are formed in each connecting pad (5A) located at a corner of a lower surface-side of an insulating base 2 having groove-shaped recesses (6) in the periphery, and groove-shaped recesses (6a and 6b) in the corner and side directions are formed in each corner portion (2A) of the insulating base 2 corresponding to the connecting pad (5A). Connecting pads (5) of an electronic apparatus in which an electronic component is mounted on the insulating base 2 are mounted on an external electrical circuit board by using a solder. A solder (31) melted during the solder-mounting adheres onto the groove-shaped recesses (6a and 6b) in the corner and side directions of the corner portion (2A) of the insulating base 2 and thus solder fillets are formed in the groove-shaped recesses (6a and 6b).

Abstract: 4-Cyanocoumarin derivatives which have a distinct sensitivity to visible light, distinct luminescent ability, and satisfactory applicability for photochemical polymerization, dye lasers, and organic electroluminescent elements. Since most of the derivatives have a fluorescent maximum wavelength of 600 to 650 nm, particularly, 610 to 630 nm, they are extremely useful as luminescent agents for organic EL elements which emit visible light in a red-color region, and can be quite useful as luminescent agents in organic EL elements and laser-active substances in dye lasers, as well as luminous bodies as lighting sources for lighting devices, and information displays for visually displaying information.

Abstract: The composite material is constituted by a substrate and a carbonized nanofiber layer and capable of being widely applied. The method of producing the composite material comprises the steps of: disposing an electrically conductive substrate on an electrode plate of an electro spinning apparatus; spraying a polymer solution or a molten polymer, to which high voltage is applied from a capillary of a capillary electrode of the electro spinning apparatus, toward the substrate on the electrode plate so as to form a large number of nanofibers on the substrate; and burning the substrate, on which a large number of the nanofibers have been formed, so as to form a carbonized nanofiber layer on the substrate.

Abstract: The objects of the present invention are to provide semiconductor layers for obtaining solar cells having a relatively high energy conversion efficiency, solar cells using the same, and their production methods and uses; all of which are solved by providing semiconductor layers that are used in solar cells and constructed by semiconductor particle groups having a plurality of peaks in particle size distribution, solar cells using the same, and their production methods and uses.

Abstract: To make it possible to mount micro ball electrodes of a semiconductor device of CSP (chip size package) or BGA (ball grid array) type, to reduce the diameter of the electrode forming hole, to make fine the pattern of the wiring film, to improve precision of the external accuracy, and to facilitate production. A plurality of wiring films (4) are formed on one surface part of the base (5) of an insulating resin such that said film surface is positioned flush with said base surface and at least part of the wiring films overlap the electrode forming hole (8) of said base, each electrode forming hole (8) is buried with an electrically conductive material and the external electrode (6) projecting to the opposite side of the wiring film is formed, and the semiconductor chip (14) is flip-chip-connected onto said one surface of the base (5).

Abstract: The present invention aims to provide a solar cell which has an improved processibility suitable for industrial-scale and which is easily prepared at a lower cost.

Abstract: An organic semiconductor laser device is composed of a positive electrode layer, an electron hole-transporting layer, a light-emitting layer containing an organic dye and having an open end, an electron-transporting layer, and a negative electrode layer in order. The electron hole-transporting layer and the electron-transporting layer satisfy the conditions of 1<n1/n2 and 1<n1/n3 (n1 is a refractive index of the light-emitting layer determined at a wavelength of the light emitted in the light-emitting layer, n2 is that of the electron hole-transporting layer, and n3 is that of the electron-transporting layer) and further satisfy the conditions; 0.

Abstract: 4-Cyanocoumarin derivatives which have a distinct sensitivity to visible light, distinct luminescent ability, and satisfactory applicability for photochemical polymerization, dye lasers, and organic electroluminescent elements. Since most of the derivatives have a fluorescent maximum wavelength of 600 to 650 nm, particularly, 610 to 630 nm, they are extremely useful as luminescent agents for organic EL elements which emit visible light in a red-color region, and can be quite useful as luminescent agents in organic EL elements and laser-active substances in dye lasers, as well as luminous bodies as lighting sources for lighting devices, and information displays for visually displaying information.

Abstract: The objects of the present invention are to provide semiconductor layers for obtaining solar cells having a relatively high energy conversion efficiency, solar cells using the same, and their production methods and uses; all of which are solved by providing semiconductor layers that are used in solar cells and constructed by semiconductor particle groups having a plurality of peaks in particle size distribution, solar cells using the same, and their production methods and uses.

Abstract: To make it possible to mount micro ball electrodes of a semiconductor device of CSP (chip size package) or BGA (ball grid array) type, to reduce the diameter of the electrode forming hole, to make fine the pattern of the wiring film, to improve precision of the external accuracy, and to facilitate production. A plurality of wiring films (4) are formed on one surface part of the base (5) of an insulating resin such that said film surface is positioned flush with said base surface and at least part of the wiring films overlap the electrode forming hole (8) of said base, each electrode forming hole (8) is buried with an electrically conductive material and the external electrode (6) projecting to the opposite side of the wiring film is formed, and the semiconductor chip (14) is flip-chip-connected onto said one surface of the base (5).

Abstract: An organic semiconductor laser device is composed of a positive electrode layer, an electron hole-transporting layer, a light-emitting layer containing an organic dye and having an open end, an electron-transporting layer, and a negative electrode layer in order. The electron hole-transporting layer and the electron-transporting layer satisfy the conditions of 1<n1/n2 and 1<n1/n3 (n1 is a refractive index of the light-emitting layer determined at a wavelength of the light emitted in the light-emitting layer, n2 is that of the electron hole-transporting layer, and n3 is that of the electron-transporting layer) and further satisfy the conditions; 1 0.16 < n 2 × d 2 × ( n 1 n 2 ) 2 - 1 λ 0.

Abstract: 4-Cyanocoumarin derivatives which have a distinct sensitivity to visible light, distinct luminescent ability, and satisfactory applicability for photochemical polymerization, dye lasers, and organic electroluminescent elements. Since most of the derivatives have a fluorescent maximum wavelength of 600 to 650 nm, particularly, 610 to 630 nm, they are extremely useful as luminescent agents for organic EL elements which emit visible light in a red-color region, and can be quite useful as luminescent agents in organic EL elements and laser-active substances in dye lasers, as well as luminous bodies as lighting sources for lighting devices, and information displays for visually displaying information.

Abstract: 4-Cyanocoumarin derivatives which have a distinct sensitivity to visible light, distinct luminescent ability, and satisfactory applicability for photochemical polymerization, dye lasers, and organic electroluminescent elements. Since most of the derivatives have a fluorescent maximum wavelength of 600 to 650 nm, particularly, 610 to 630 nm, they are extremely useful as luminescent agents for organic EL elements which emit visible light in a red-color region, and can be quite useful as luminescent agents in organic EL elements and laser-active substances in dye lasers, as well as luminous bodies as lighting sources for lighting devices, and information displays for visually displaying information.

Abstract: After interposer corresponding to respective device units are mounted on only good semiconductor chips of a semiconductor wafer and inner bumps of each interposer are joined to electrode pads of the associated good semiconductor chip by thermocompression bonding, the semiconductor wafer is cut into semiconductor chips to produce desired LGA semiconductor devices in each of which a good semiconductor chip is packaged on an interposer. Since the plane size of the interposer is equal to or smaller than that of the semiconductor chips, a real-chip-size semiconductor device can easily be realized.

Abstract: An outline forming method for a semiconductor device, including the steps of placing a film carrier on which a semiconductor chip is mounted in a molding die so as to enclose the semiconductor chip in a cavity defined in the molding die; clamping the film carrier with a clamp of the molding die; injecting a resin to be molded into the cavity; and shearing the film carrier by means of the clamp to separate the film carrier into a part present inside the cavity and a remaining part present outside the cavity.