Patents by Inventor Toshiko Nakagawa
Toshiko Nakagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
-
Patent number: 7156904Abstract: An aqueous copper-to-resin bonding layer solution comprising: (a) at least one acid type; (b) tin salt or tin oxide; (c) salt or oxide of at least one type of metal selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cobalt, nickel, palladium, gold, and platinum; (d) a reaction accelerator; and (e) a diffusive retaining solvent, so that an alloy layer of tin and the at least one type of metal selected in (c) is formed on the surface of the copper. Subsequently, a portion of the alloy layer is removed, so that a bonding layer containing an alloy of diffused copper, tin, and the at least one type of metal selected in (c) is formed on a surface of copper which enhances the adhesion between copper and resin. The present invention provides the solution, a method of producing the bonding layer, and a product obtained thereby.Type: GrantFiled: April 16, 2004Date of Patent: January 2, 2007Assignee: Mec Company Ltd.Inventors: Mutsuyuki Kawaguchi, Satoshi Saito, Jun Hisada, Naomi Kanda, Toshiko Nakagawa
-
Patent number: 7029761Abstract: A bonding layer for bonding resin is provided that is formed on a copper surface, and contains an alloy of: (a) copper; (b) tin; and (c) at least one type of metal (third metal) selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cobalt, nickel, palladium, gold, and platinum. The copper is contained in an amount of 1 to 50 atom %, the tin is contained in an amount of 20 to 98 atom %, and the third metal is contained in an amount of 1 to 50 atom %. The bonding layer has a thickness of not less than 0.001 ?m and not more than 1 ?m. Thus, adhesion between copper and resin can be enhanced.Type: GrantFiled: April 16, 2004Date of Patent: April 18, 2006Assignee: MEC Company Ltd.Inventors: Mutsuyuki Kawaguchi, Satoshi Saito, Jun Hisada, Toshiko Nakagawa
-
Publication number: 20040219377Abstract: A surface of copper is brought into contact with an aqueous solution for forming a bonding layer for bonding resin comprising: (a) at least one type of acid selected from inorganic acid and organic acid; (b) tin salt or tin oxide; (c) salt or oxide of at least one type of metal selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cobalt, nickel, palladium, gold, and platinum; (d) a reaction accelerator; and (e) a diffusive retaining solvent, so that an alloy layer of tin and the at least one type of metal selected in (c) is formed on the surface of the copper.Type: ApplicationFiled: April 16, 2004Publication date: November 4, 2004Applicant: MEC COMPANY LTD.Inventors: Mutsuyuki Kawaguchi, Satoshi Saito, Jun Hisada, Naomi Kanda, Toshiko Nakagawa
-
Publication number: 20040219375Abstract: A bonding layer for bonding resin is provided that is formed on a copper surface, and contains an alloy of: (a) copper; (b) tin; and (c) at least one type of metal (third metal) selected from the group consisting of: silver, zinc, aluminum, titanium, bismuth, chromium, iron, cobalt, nickel, palladium, gold, and platinum. The copper is contained in an amount of 1 to 50 atom %, the tin is contained in an amount of 20 to 98 atom %, and the third metal is contained in an amount of 1 to 50 atom %. The bonding layer has a thickness of not less than 0.001 &mgr;m and not more than 1 &mgr;m. Thus, adhesion between copper and resin can be enhanced.Type: ApplicationFiled: April 16, 2004Publication date: November 4, 2004Applicant: MEC COMPANY LTD.Inventors: Mutsuyuki Kawaguchi, Satoshi Saito, Jun Hisada, Toshiko Nakagawa
-
Patent number: 6733886Abstract: A laminate is made by adhering at least one metal layer selected from the group consisting of copper and a copper alloy to a resin layer. A coating film of an azole-copper complex compound formed by a contact with an aqueous solution containing an azole compound in an range from 0.1 mass % to 15 mass % and an organic acid in a range from 1 mass % to 80 mass % is formed on the metal layer surface, and the metal layer adheres to the resin layer via the coating film of the azole-copper complex compound. Thereby, the present invention provides a laminate with improved adhesion between a surface of copper or a copper alloy and resin in a multilayered printed circuit board, and also a method of manufacturing the laminate.Type: GrantFiled: April 23, 2002Date of Patent: May 11, 2004Assignee: MEC Company Ltd.Inventors: Mutsuyuki Kawaguchi, Jun Hisada, Toshiko Nakagawa
-
Publication number: 20020192460Abstract: A laminate is made by adhering at least one metal layer selected from the group consisting of copper and a copper alloy to a resin layer. A coating film of an azole-copper complex compound formed by a contact with an aqueous solution containing an azole compound in an range from 0.1 mass % to 15 mass % and an organic acid in a range from 1 mass % to 80 mass % is formed on the metal layer surface, and the metal layer adheres to the resin layer via the coating film of the azole-copper complex compound. Thereby, the present invention provides a laminate with improved adhesion between a surface of copper or a copper alloy and resin in a multilayered printed circuit board, and also a method of manufacturing the laminate.Type: ApplicationFiled: April 23, 2002Publication date: December 19, 2002Applicant: MEC COMPANY LTD.Inventors: Mutsuyuki Kawaguchi, Jun Hisada, Toshiko Nakagawa
-
Patent number: 6106899Abstract: A method for bonding a resin which has a high glass transition temperature but low affinity to copper surfaces with a copper surface with sufficient adhesive strength. The method comprises coating the copper surfaces with an aqueous solution containing at least 0.05% of aminotetrazole or an aminotetrazole derivative, or an aqueous solution containing at least 0.05% of aminotetrazole or an aminotetrazole derivative and at least 0.1% of aminotriazole or an aminotriazole derivative.Type: GrantFiled: July 16, 1998Date of Patent: August 22, 2000Assignee: MEC Company LimitedInventors: Toshiko Nakagawa, Ryo Ogushi
-
Patent number: 5965036Abstract: A microetching composition for copper or copper alloys comprising, (a) an oxidizing agent which can oxidize the copper or copper alloy, (b) a polymer compound which contains polyamine chains or a cationic group or both in the amount of 0.000001 to 1.0% by weight, and (c) water. The composition can produce surfaces of copper or copper alloy exhibiting excellent adhesion to resins such as prepregs and resists, and superior solderability. The composition can be adaptable to the manufacture of printed wiring boards with highly integrated fine line patterns.Type: GrantFiled: January 24, 1997Date of Patent: October 12, 1999Assignee: MEC Co., Ltd.Inventors: Yoshiro Maki, Toshiko Nakagawa, Yasushi Yamada, Takashi Haruta, Maki Arimura
-
Patent number: 5885476Abstract: A microetching composition for copper or copper alloys comprising, (a) nitric acid or sulfuric acid, or both, (b) ferric nitrate or ferric sulfate, or both, (c) at least one component selected from a group consisting of unsaturated carboxylic acids, salts of unsaturated carboxylic acid, and anhydrides of unsaturated carboxylic acid, and (d) water. The composition can produce a copper or copper alloy surface exhibiting excellent adhesion to resins such as prepregs and resists and superior solderability. The composition is suitable for the manufacture of printed wiring boards with highly integrated fine line patterns.Type: GrantFiled: March 4, 1997Date of Patent: March 23, 1999Assignee: MEC Co., Ltd.Inventors: Yoong-koo Hong, Toshiko Nakagawa
-
Patent number: 5807493Abstract: A microetching composition for copper or copper alloys comprising, (a) a cupric ion source, (b) an organic acid with an acid dissociation constant (pKa) of 5 or less, (c) a halide ion source, and (d) water. The composition can produce surfaces of copper or copper alloy exhibiting excellent adhesion to resins such as prepregs and resists and superior solderability. The composition can be very adaptable to the manufacture of printed wiring boards with highly integrated fine line patterns.Type: GrantFiled: July 24, 1996Date of Patent: September 15, 1998Assignee: MEC Co., Ltd.Inventors: Yoshiro Maki, Toshiko Nakagawa, Yasushi Yamada, Takashi Haruta, Maki Arimura
-
Patent number: 5700389Abstract: An etching solution for copper or copper alloys comprising, (a) sulfuric acid, (b) a persulfate, (c) at least one compound selected from imidazole, imidazole derivatives, pyridine derivatives, triazine, and triazine derivatives, and (d) water. The etching solution exhibits a high etching speed and does not oxidize the copper surfaces after etching.Type: GrantFiled: August 2, 1995Date of Patent: December 23, 1997Assignee: MEC Co., Ltd.Inventor: Toshiko Nakagawa
-
Patent number: 5532094Abstract: A method for roughening surfaces of copper or copper alloy to provide an excellent adhesion of a coated or laminated layer thereon, comprising treating said surfaces with an amount and for a time effective to roughen them with an aqueous solution comprising an azole compound, a copper compound dissolvable in the solution, an organic or inorganic acid and a halogen ion.Type: GrantFiled: February 27, 1995Date of Patent: July 2, 1996Assignee: MEC Co., Ltd.Inventors: Maki Arimura, Daisaku Akiyama, Toshiko Nakagawa
-
Patent number: 5496590Abstract: A composition for treating surfaces of copper and copper alloys comprising a specific imidazole derivative and water, and an acid or a water-soluble solvent. The composition can produce a heat resistant organic film with superior solderability when applied to surfaces of copper or copper alloys. It is particularly useful as a rust preventing agent for printed-wiring boards.Type: GrantFiled: August 11, 1994Date of Patent: March 5, 1996Assignee: MEC Co., Ltd.Inventors: Yoshiro Maki, Toshiko Nakagawa, Yoshiaki Furukawa, Minoru Outani, Takashi Haruta, Maki Yamanami, Sachiko Nakamura