Abstract: Disclosed herein are a method of forming an amorphous alloy film and a printed wiring board manufactured by the same. The amorphous alloy film may be formed on a copper foil as one of rust-proofing treatment methods of the copper foil to thereby simultaneously show and improve corrosion-resistance and conductivity, and the amorphous alloy film may be formed by the sputtering deposition method, such that high melting point materials may be manufactured as a thin film at a relatively low temperature and the amorphous alloy film having strong adhesion strength with a substrate may be obtained.

Abstract: Disclosed herein are a surface-treated copper foil, a copper-clad laminate plate including the same, a printed circuit board using the same, and a method for manufacturing the same. In detail, the copper-clad laminate plate according to one implementation embodiment of the present invention includes: carrier; a peel layer formed on the carrier; a copper-clad layer formed on the peel layer; and a surface-treated layer formed on the copper-clad layer, in which the surface-treated layer includes a thiol-based compound. Therefore, the present invention provides a printed circuit board capable of improving an adhesive force between a base and a copper-clad layer without treating a roughed surface by forming the surface-treated layer on the copper-clad layer.

Abstract: To provide a dielectric-layer-provided copper foil or the like for extremely improving the product yield while making the most use of the increase effect of an electric capacity of a thin dielectric layer using the sputtering vapor deposition method. In the case of dielectric-layer-provided copper foils respectively having a dielectric layer on one side of a copper foil, the dielectric layer 6 is an inorganic-oxide sputter film having a thickness of 1.0 ?m or less and formed on the one side of the copper foil in accordance with the sputtering vapor deposition method and the dielectric-layer-provided copper foils for respectively forming a capacitor layer, characterized in that a pit-like defective portion generated on the inorganic-oxide sputter film is sealed by polyimide resin are used.

Abstract: To provide a dielectric-layer-provided copper foil or the like for extremely improving the product yield while making the most use of the increase effect of an electric capacity of a thin dielectric layer using the sputtering vapor deposition method. In the case of dielectric-layer-provided copper foils respectively having a dielectric layer on one side of a copper foil, the dielectric layer 6 is an inorganic-oxide sputter film having a thickness of 1.0 ?m or less and formed on the one side of the copper foil in accordance with the sputtering vapor deposition method and the dielectric-layer-provided copper foils for respectively forming a capacitor layer, characterized in that a pit-like defective portion generated on the inorganic-oxide sputter film is sealed by polyimide resin are used.

Abstract: A method of forming a dielectric layer containing dielectric filler, which is excellent in film thickness uniformity, from a polyimide electrodeposition liquid containing dielectric filler. In particular, a method of forming a polyimide coating container dielectric filler on a surface of metallic material according to the electrodeposition coating technique, characterized in that as the dielectric filler, use is made of dielectric powder of perovskite structure in approximately spherical form which has an average particle diameter (D1A) of 0.05 to 1.0 ?m and a weight cumulative particle diameter (D50), measured in accordance with the laser diffraction scattering type particle size distribution measuring method, of 0.1 to 2.0 ?m and further exhibits an aggregation degree, in terms of D50/D1a wherein D50 and D1a represent a weight cumulative particle diameter and an average particle diameter obtained by image analysis, respectively, of 4.5 or less.

Abstract: The method for electrolytically refining copper makes use of crude copper as an anode and is characterized in that the temperature of the electrolyte in an electrolytic cell is maintained at a level of not less than 55° C.; that the electrolyte is continuously introduced into the electrolytic cell from the top of the cell, continuously discharged from the bottom of the cell along with slime, the slime is removed from the electrolyte discharged from the electrolytic cell and the electrolyte free of any slime is recirculated in the cell; and that the electrolyte is passed through the space between the electrodes at an average electrolyte velocity sufficient for allowing the electrolyte to flow on the whole surface of the cathode downward or in the direction opposite to that of the upward stream of the electrolyte generated on the cathode surface when the electrolysis is initiated while the electrolyte is in the stationary state.

Abstract: A copper foil having improved resistance to abrasion damage during the manufacture of printed circuit boards has a uniform deposit of benzotriazole (BTA) or BTA derivative, optionally a mixture thereof, of at least about 5 mg/m2.

Abstract: A high tensile strength copper foil having a matte side roughness Rz of 2.5 &mgr;m or less and a tensile strength of 40,000 Kgf/mm2 after heating one hour at 180° C. is produced by a process in which copper is electrodeposited from a solution containing predetermined small amounts of a polyether glycol and tin and iron ions. The chloride ion content is maintained below 0.1 wt. ppm. The copper foil is characterized by having copper crystals with atomic cells having a predominently (111) orientation.

Abstract: An organic rust-roof treated copper foil characterized in that it has a metallic rust-proof layer formed on the non-adhesive side of the original copper foil and has an organic rust-proof layer formed on said metallic rust-proof layer, the organic rust-proof layer comprising a mixture of at least two kinds of chemicals selected from the group consisting of benzotriazole, its derivatives, aminotriazole and its isomers and derivatives is provided with on said metallic rust-proof layer, or it further has a chromate-treated layer formed between said metallic rust-proof layer and said organic rust-proof layer.

Abstract: A high tensile strength copper foil having a matte side roughness Rz of 2.5 .mu.m or less and a tensile strength of 40,000 Kgf/mm.sup.2 after heating one hour at 180.degree. C. is produced by a process in which copper is electrodeposited from a solution containing predetermined small amounts of a polyether glycol and tin and iron ions. The chloride ion content is maintained below 0.1 wt. ppm. The copper foil is characterized by having copper crystals with atomic cells having a predominantly (111) orientation.