Abstract: The present invention provides a diamond-like carbon coated carrier for holding an object to be polished used for double-sided polishing, and a manufacturing method therefor. The carrier for holding a workpiece according to the present invention has a substrate whose entire surface is coated with diamond-like carbon. The method of the present invention includes coating the entire carrier surface with diamond-like carbon using a surface coating apparatus using plasma CVD.

Abstract: To provide a diamond-like carbon coated carrier for holding an object to be polished used for double-sided polishing, and a manufacturing method therefor. A carrier for holding an object to be polished according to the present invention has a substrate whose entire surface is coated with diamond-like carbon. A method of the present invention includes coating the entire carrier surface with diamond-like carbon using a surface coating apparatus using plasma CVD.

Abstract: A carrier and CMP apparatus which improve the uniformity of polishing in a wafer or other workpiece and increase the margin of the amount of wear of the retainer ring to improve the operating rate of the CMP apparatus. A carrier 1 is constituted by a housing 10, a carrier base 11, a retainer ring 12, a sheet supporter 13, a hard sheet 18, and a soft backing sheet 19. The sheet supporter 13 is formed by a supporter body portion 14 having an air opening 14a communicating with an air outlet/inlet 11b of the carrier base 11, a flexible diaphragm 15, and an edge ring 16. Therefore, a wafer W is uniformly pressed by the air pressure in the pressure chamber R and fluctuation in the force pressing against the outer peripheral rim of the wafer W caused by the wear of the retainer ring 12 is countered by the diaphragm 15.

Abstract: Numerous spin-dry mechanisms 45A, 45B, and 45C for drying workpieces W at individual drying positions by rotating them at high speed are disposed in a drying section 3 of a washing apparatus, and sequentially move forward and backward between the respective drying position and the workpiece delivery position 3A at which workpieces are delivered to a transfer mechanism 6.