Patents by Inventor Toshimasa Kitagawa

Toshimasa Kitagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process of fabrication IC chip package from an IC chip carrier substrate and a leadframe and the IC chip package fabricated thereby
    Patent number: 5403785
    Abstract: An IC chip package is fabricated from a substrate carrying an IC chip and formed with a conductive pattern of conductors for electrical connection to the IC chip, and a leadframe having a plurality of connector leads with inner and outer lead sites for electrical connection with associated ones of the conductors and with an external circuit, respectively. Fabrication of the IC chip package is made through the steps of placing the inner lead sites into intimate contact on distal ends of the corresponding conductors, and applying ultrasonic vibrations to contacting surfaces between the inner lead sites and the conductors so as to effect diffusion bonding therebetween.
    Type: Grant
    Filed: May 19, 1993
    Date of Patent: April 4, 1995
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Hitoshi Arai, Syuichi Furuichi, Toshiyuki Yamaguchi, Takeshi Kanou, Tooru Higuchi, Muneo Yamada, Toshimasa Kitagawa, Takashi Sugimoto