Abstract: Provided is a photosensitive element including a support film, and a photosensitive layer provided on the support film and formed from a photosensitive resin composition, in which the surface roughness of the surface of the support film that is in contact with the photosensitive layer is 200 to 4,000 nm.

Abstract: A method for manufacturing a structure containing a conductor circuit according to the present invention can provide openings in various shapes by patterning a first photosensitive resin layer in a first patterning process according to shapes of openings formed in a heat-curable resin layer. Further, in the method for manufacturing a structure containing a conductor circuit, a plurality of openings can be formed at the same time and a residue of the resin around the opening can be reduced, unlike a case in which openings are formed with a laser. Therefore, it is possible to sufficiently efficiently manufacture the structure having excellent reliability even when the number of pins of a semiconductor element increases and it is necessary to provide a great number of fine openings.

Abstract: A method for manufacturing a structure containing a conductor circuit according to the present invention can provide openings in various shapes by patterning a first photosensitive resin layer in a first patterning process according to shapes of openings formed in a heat-curable resin layer. Further, in the method for manufacturing a structure containing a conductor circuit, a plurality of openings can be formed at the same time and a residue of the resin around the opening can be reduced, unlike a case in which openings are formed with a laser. Therefore, it is possible to sufficiently efficiently manufacture the structure having excellent reliability even when the number of pins of a semiconductor element increases and it is necessary to provide a great number of fine openings.

Abstract: Provided is a photosensitive element including a support film, and a photosensitive layer provided on the support film and formed from a photosensitive resin composition, in which the surface roughness of the surface of the support film that is in contact with the photosensitive layer is 200 to 4,000 nm.

Abstract: A method for manufacturing a structure containing a conductor circuit according to the present invention can provide openings in various shapes by patterning a first photosensitive resin layer in a first patterning process according to shapes of openings formed in a heat-curable resin layer. Further, in the method for manufacturing a structure containing a conductor circuit, a plurality of openings can be formed at the same time and a residue of the resin around the opening can be reduced, unlike a case in which openings are formed with a laser. Therefore, it is possible to sufficiently efficiently manufacture the structure having excellent reliability even when the number of pins of a semiconductor element increases and it is necessary to provide a great number of fine openings.

Abstract: The present invention provides a photosensitive resin composition comprising an (a) component: an acid-modified epoxy resin, a (b) component: a photopolymerizable monomer having an ethylenically unsaturated group, a (c) component: a photopolymerization initiator, a (d) component: an epoxy resin, and an (e) component: an inorganic filler, wherein the (a) component comprises an acid-modified bisphenol novolak type epoxy resin and further the photosensitive resin composition satisfies a predetermined condition, and provides a photosensitive film, a permanent resist and a method for producing a permanent resist using the same.

Abstract: A method for manufacturing a structure containing a conductor circuit according to the present invention can provide openings in various shapes by patterning a first photosensitive resin layer in a first patterning process according to shapes of openings formed in a heat-curable resin layer. Further, in the method for manufacturing a structure containing a conductor circuit, a plurality of openings can be formed at the same time and a residue of the resin around the opening can be reduced, unlike a case in which openings are formed with a laser. Therefore, it is possible to sufficiently efficiently manufacture the structure having excellent reliability even when the number of pins of a semiconductor element increases and it is necessary to provide a great number of fine openings.

Abstract: The present invention provides a photosensitive resin composition comprising an (a) component: an acid-modified epoxy resin, a (b) component: a photopolymerizable monomer having an ethylenically unsaturated group, a (c) component: a photopolymerization initiator, a (d) component: an epoxy resin, and an (e) component: an inorganic filler, wherein the (a) component comprises an acid-modified bisphenol novolak type epoxy resin and further the photosensitive resin composition satisfies a predetermined condition, and provides a photosensitive film, a permanent resist and a method for producing a permanent resist using the same.