Patents by Inventor Toshimasa Sugimura

Toshimasa Sugimura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9478454
    Abstract: The present invention provides a dicing tape-integrated film for semiconductor back surface, including a film for flip chip type semiconductor back surface for protecting a back surface of a semiconductor element flip chip-connected onto an adherend, and a dicing tape, the dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material, the film for flip chip type semiconductor back surface being formed on the pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer is a radiation-curable pressure-sensitive adhesive layer whose pressure-sensitive adhesive force toward the film for flip chip type semiconductor back surface is decreased by irradiation with a radiation ray.
    Type: Grant
    Filed: March 21, 2014
    Date of Patent: October 25, 2016
    Assignee: NITTO DENKO CORPORATION
    Inventors: Naohide Takamoto, Goji Shiga, Fumiteru Asai, Toshimasa Sugimura
  • Publication number: 20140203458
    Abstract: The present invention provides a dicing tape-integrated film for semiconductor back surface, including a film for flip chip type semiconductor back surface for protecting a back surface of a semiconductor element flip chip-connected onto an adherend, and a dicing tape, the dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material, the film for flip chip type semiconductor back surface being formed on the pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer is a radiation-curable pressure-sensitive adhesive layer whose pressure-sensitive adhesive force toward the film for flip chip type semiconductor back surface is decreased by irradiation with a radiation ray.
    Type: Application
    Filed: March 21, 2014
    Publication date: July 24, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Naohide TAKAMOTO, Goji SHIGA, Fumiteru ASAI, Toshimasa SUGIMURA
  • Patent number: 8722517
    Abstract: The present invention provides a dicing tape-integrated film for semiconductor back surface, including a film for flip chip type semiconductor back surface for protecting a back surface of a semiconductor element flip chip-connected onto an adherend, and a dicing tape, the dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material, the film for flip chip type semiconductor back surface being formed on the pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer is a radiation-curable pressure-sensitive adhesive layer whose pressure-sensitive adhesive force toward the film for flip chip type semiconductor back surface is decreased by irradiation with a radiation ray.
    Type: Grant
    Filed: April 18, 2011
    Date of Patent: May 13, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Naohide Takamoto, Goji Shiga, Fumiteru Asai, Toshimasa Sugimura
  • Publication number: 20140004683
    Abstract: A method of manufacturing a semiconductor element is provided. The method includes the steps of: bonding a substrate for transferring and a functional layer that is formed on a substrate for forming a functional layer with a temporary fixing layer interposed therebetween; removing the substrate for forming a functional layer to expose the functional layer; bonding a final substrate to the exposed functional layer; and separating the temporary fixing layer and the substrate for transferring from the functional layer, wherein the temporary fixing layer has (A) a specific shear adhering strength or has (B) a specific weight loss rate.
    Type: Application
    Filed: June 21, 2013
    Publication date: January 2, 2014
    Inventors: Shinya Akizuki, Toshimasa Sugimura, Daisuke Uenda, Takeshi Matsumura
  • Publication number: 20140004635
    Abstract: A method of manufacturing an LED according to an embodiment of the present invention includes: forming a reflective layer on an outer side of a substrate of an LED wafer including the substrate and a light emitting element on one surface of the substrate; and attaching, prior to the forming a reflective layer, a heat-resistant pressure-sensitive adhesive sheet onto an outer side of the light emitting element.
    Type: Application
    Filed: June 12, 2013
    Publication date: January 2, 2014
    Inventors: Tomokazu TAKAHASHI, Shinya AKIZUKI, Toshimasa SUGIMURA, Takeshi MATSUMURA, Daisuke UENDA
  • Publication number: 20140000793
    Abstract: A method of manufacturing an LED according to an embodiment of the present invention includes back-grinding a substrate of an LED wafer including a light emitting element and the substrate, where the back-grinding includes fixing the LED wafer to a table via a double-sided pressure-sensitive adhesive sheet, and then grinding the substrate.
    Type: Application
    Filed: June 10, 2013
    Publication date: January 2, 2014
    Inventors: Tomokazu TAKAHASHI, Shinya AKIZUKI, Toshimasa SUGIMURA, Takeshi MATSUMURA, Daisuke UENDA
  • Publication number: 20140004637
    Abstract: A method of manufacturing an LED according to an embodiment of the present invention includes: back-grinding a substrate of an LED wafer including the substrate and a light emitting element formed on one surface of the substrate; forming, after the back-grinding, a reflective layer on an outer side of the substrate; and attaching, on an outer side of the light emitting element of the LED wafer, a heat-resistant pressure-sensitive adhesive sheet.
    Type: Application
    Filed: June 13, 2013
    Publication date: January 2, 2014
    Inventors: Tomokazu Takahashi, Shinya Akizuki, Toshimasa Sugimura, Takeshi Matsumura, Daisuke Uenda
  • Publication number: 20140004636
    Abstract: A method of manufacturing an LED including: back-grinding a substrate of an LED wafer including a light emitting element and the substrate; and attaching a protective sheet to the LED wafer one of prior to the back-grinding and after grinding the substrate in the back-grinding.
    Type: Application
    Filed: June 13, 2013
    Publication date: January 2, 2014
    Inventors: Tomokazu TAKAHASHI, Shinya AKIZUKI, Toshimasa SUGIMURA, Takeshi MATSUMURA, Daisuke UENDA
  • Patent number: 8559105
    Abstract: A polarizing plate of the present invention includes a stretched laminate that is a laminate including a base material layer and a hydrophilic polymer layer and has undergone a stretching process, and at least a dichroic substance is adsorbed to the hydrophilic polymer layer. The polarizing plate of the present invention can be prevented from curling even when the polarizer is reduced in thickness.
    Type: Grant
    Filed: September 22, 2008
    Date of Patent: October 15, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Hiroyuki Yoshimi, Hiroaki Mizushima, Toshimasa Sugimura, Minoru Miyatake, Takeharu Kitagawa
  • Publication number: 20130108867
    Abstract: The present invention provides a methylenebis(fatty acid amide) composition containing as a main component a methylenebis(fatty acid amide) obtained by reacting a fatty acid monoamide with formaldehyde, a content of impurities which consist of the fatty acid monoamide and a fatty acid from which the fatty acid monoamide is constituted is 0 to less than 2 wt %, and a adhesive sheet containing the methylenebis(fatty acid amide) composition.
    Type: Application
    Filed: July 7, 2011
    Publication date: May 2, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shigeki Ishiguro, Takumi Yutou, Hiroki Senda, Masamichi Matsumoto, Yuka Sekiguchi, Aya Nagatomo, Yuji Okawa, Fumiteru Asai, Michihito Ooishi, Toshimasa Sugimura
  • Publication number: 20110256669
    Abstract: The present invention provides a dicing tape-integrated film for semiconductor back surface, including a film for flip chip type semiconductor back surface for protecting a back surface of a semiconductor element flip chip-connected onto an adherend, and a dicing tape, the dicing tape including a base material and a pressure-sensitive adhesive layer provided on the base material, the film for flip chip type semiconductor back surface being formed on the pressure-sensitive adhesive layer, in which the pressure-sensitive adhesive layer is a radiation-curable pressure-sensitive adhesive layer whose pressure-sensitive adhesive force toward the film for flip chip type semiconductor back surface is decreased by irradiation with a radiation ray.
    Type: Application
    Filed: April 18, 2011
    Publication date: October 20, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Naohide TAKAMOTO, Goji SHIGA, Fumiteru ASAI, Toshimasa SUGIMURA
  • Publication number: 20110244229
    Abstract: A rolled adhesive tape or sheet which is wound in a rolled configuration having; a thermoplastic resin film, and a pressure sensitive adhesive layer formed on one side of the thermoplastic resin film, a fatty acid bisamide as well as a fatty acid monoamide and/or fatty acid are contained at least one of the thermoplastic resin film and the pressure sensitive adhesive layer.
    Type: Application
    Filed: March 29, 2011
    Publication date: October 6, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shigeki ISHIGURO, Takumi YUTOU, Hiroki SENDA, Masamichi MATSUMOTO, Kenichi NISHIJIMA, Toshitaka SUZUKI, Fumiteru ASAI, Isamu MIYOSHI, Michihito OOISHI, Toshimasa SUGIMURA
  • Publication number: 20110244160
    Abstract: An adhesive tape or sheet with a release liner has; a thermoplastic resin film, a pressure sensitive adhesive layer formed on one side of the thermoplastic resin film, and a release liner positioned on one side of the pressure sensitive adhesive layer, a fatty acid bisamide as well as a fatty acid monoamide and/or fatty acid are contained at least one of the thermoplastic resin film and the pressure sensitive adhesive layer.
    Type: Application
    Filed: March 29, 2011
    Publication date: October 6, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shigeki ISHIGURO, Takumi Yutou, Hiroki Senda, Masamichi Matsumoto, Kenichi Nishijima, Ryoko Asai, Yuka Sekiguchi, Yuji Okawa, Michihito Ooishi, Toshimasa Sugimura
  • Publication number: 20110237050
    Abstract: The present invention provides a method which includes sticking a surface protection sheet for dicing onto a surface of a wafer and cutting the sheet together with the wafer to protect the surface of the wafer from being contaminated by deposition of a dust such as swarf and the like, and picking up a chip without causing cracking or chipping in the chip after a dicing step, in the steps of dicing the wafer and then picking up the chip. The method includes: sticking the surface protection sheet for dicing onto the surface of the wafer; cutting the sheet together with the wafer; subsequently giving a stimulus to the surface protection sheet for dicing to peel the end of the chip from the dicing tape; and then picking up the chip.
    Type: Application
    Filed: March 21, 2011
    Publication date: September 29, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Toshimasa SUGIMURA, Akinori NISHIO, Kazuyuki KIUCHI
  • Publication number: 20110048641
    Abstract: The present invention is intended to provide a method for protecting a surface of an object to be cut from contamination due to the adhesion of dust and the like, including cutting scraps, by bonding a surface protection tape to the surface of the object to be cut, and cutting the surface protection tape together with the object to be cut in a dicing process and, after the dicing process, easily separating and removing the protection tape from individual chips. To this end, there is provided a method in which a dicing surface protection tape is bonded to a surface of an object to be cut, the tape is cut together with the object to be cut, and then the dicing surface protection tape is removed with the object to be cut inclined.
    Type: Application
    Filed: August 30, 2010
    Publication date: March 3, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Toshimasa SUGIMURA, Akinori Nishio, Kazuyuki Kiuchi
  • Publication number: 20110008949
    Abstract: An adhesive sheet for dicing a semiconductor wafer having a laminate comprises; a base film, an intermediate layer and an adhesive layer, the intermediate layer is formed by a thermoplastic resin having a melting point of 50 to 100° C.; and the base film has a higher melting point than the intermediate layer as well as a method for dicing a semiconductor wafer comprises the steps of: adhering the adhesive sheet according to the above to a corrugated surface of a semiconductor wafer, and dicing the semiconductor wafer.
    Type: Application
    Filed: July 6, 2010
    Publication date: January 13, 2011
    Applicant: NITTO DENKO CORPORATION
    Inventors: Toshimasa SUGIMURA, Tomokazu Takahashi, Noriyoshi Kawashima, Fumiteru Asai
  • Publication number: 20100202051
    Abstract: A polarizing plate of the present invention includes a stretched laminate that is a laminate including a base material layer and a hydrophilic polymer layer and has undergone a stretching process, and at least a dichroic substance is adsorbed to the hydrophilic polymer layer. The polarizing plate of the present invention can be prevented from curling even when the polarizer is reduced in thickness.
    Type: Application
    Filed: September 22, 2008
    Publication date: August 12, 2010
    Applicant: NITTO DENKO CORPORATION
    Inventors: Hiroyuki Yoshimi, Hiroaki Mizushima, Toshimasa Sugimura, Minoru Miyatake, Takeharu Kitagawa