Abstract: A solder material includes an alloy of at least five elements including Sn, Cu, Sb, and In, and 20 mass % or less of Ag. The solidus temperature of the solder material is higher than 290° C., the liquidus temperature of the solder material is 379° C. or less and is higher than the solidus temperature, and the temperature difference between the liquidus temperature and the solidus temperature is 70° C. or less.

Abstract: A solder material includes 25 to 45 mass % of Sn, 30 to 40 mass % of Sb, 3 to 8 mass % of Cu, 25 mass % or less of Ag, and 1.3 to 6 mass % of In.

Abstract: A lead-out wiring, which is connected to a comb-shaped electrode formed on a principal surface of a piezoelectric substrate and is disposed to extend to an outer edge of the piezoelectric substrate an outer surrounding wall layer, which is arranged surrounding an outer periphery of the piezoelectric substrate including the lead-out wiring and forms a hollow portion that serves as an operation space for the comb-shaped electrode, and a top board, which bridges the outer surrounding wall layer to seal the hollow portion, are included.

Abstract: A solder material includes an alloy of at least five elements including Sn, Cu, Sb, and In, and 20 mass % or less of Ag. The solidus temperature of the solder material is higher than 290° C., the liquidus temperature of the solder material is 379° C. or less and is higher than the solidus temperature, and the temperature difference between the liquidus temperature and the solidus temperature is 70° C. or less.

Abstract: A piezoelectric component includes a piezoelectric element that includes: a piezoelectric plate; a comb-shaped electrode and an input/output electrode on a principal surface of the piezoelectric plate; a cover layer disposed above the comb-shaped electrode; and a rib to form a void between the comb-shaped electrode and the cover layer. The cover layer includes a photosensitive thermosetting resin in which translucent filler is contained.

Abstract: A piezoelectric component includes a piezoelectric element that includes: a piezoelectric plate; a comb-shaped electrode and an input/output electrode on a principal surface of the piezoelectric plate; a cover layer disposed above the comb-shaped electrode; and a rib to form a void between the comb-shaped electrode and the cover layer. The cover layer includes a photosensitive thermosetting resin in which translucent filler is contained.

Abstract: A manufacturing method, which realizes general versatility of an external connection terminal by reducing deterioration of characteristics and a decrease in yield rate of a piezoelectric device in an external connection terminal forming process, and a piezoelectric device manufactured by this method are provided. Before a piezoelectric device is sealed together with a ceiling layer to form a package, an electrode structure serving as an external connection terminal is provided beforehand on a substrate mounted with a key area of the device, and after formation of the key area of the device, the piezoelectric device is sealed and packaged together with the ceiling layer. The piezoelectric device of the present invention can accommodate a three-dimensional structure by providing a rewiring layer on a principal surface of the substrate.

Abstract: There is provided a voltage controlled oscillator that is compact and can be manufactured at low cost. The voltage controlled oscillator is structured to include: a resonance part including a variable capacitance element and an inductance element, the variable capacitance element having a capacitance that varies according to a control voltage for frequency control input from an external part, and a series resonant frequency of the resonance part being adjusted according to the capacitance; an amplifying part amplifying a frequency signal from the resonance part; and a feedback part including a capacitance element for feedback and feeding the frequency signal amplified by the amplifying part back to the resonance part to form an oscillation loop together with the amplifying part and the resonance part, wherein the amplifying part is provided in an integrated circuit chip, and the resonance part and the capacitance element for feedback are formed as circuit components separate from the integrated circuit chip.

Abstract: A piezoelectric component including a piezoelectric device having wiring electrodes disposed adjacent to a comb electrode and an insulation layer formed on an upper surface of a piezoelectric section. A rewiring layer is formed on an upper surface of the insulation layer and a protective film layer covers the entire upper surface of the rewiring layer excluding the comb electrode. An outer periphery wall section is formed by laminating a photosensitive resin film onto the protective film layer and a ceiling section is formed by laminating the photosensitive resin film onto top openings of the outer periphery wall section. Electrode posts are formed so as to pass through the outer periphery wall section and the ceiling section.

Abstract: To provide a voltage controlled oscillator having small size and capable of obtaining a low phase noise characteristic over a large span of adjustable range of frequency. A quartz crystal having a characteristic (dielectric loss tangent: tan ?) better than that of fluorocarbon resin, LTCC or the like conventionally used as a substrate of a resonance part, and on which a fine pattern of metal film can be formed through a photolithography method, is used as a quartz-crystal substrate, and a conductive line is formed on the quartz-crystal substrate to form an inductance element in the resonance part. Accordingly, since the resonance part having a high Q value can be formed, it is possible to obtain a voltage controlled oscillator having small size and low loss over a wide frequency range.

Abstract: A piezoelectric component manufacturing method is provided. The method includes preparing an integrated piezoelectric substrate, and forming comb-shaped electrodes and wiring electrodes having element wiring connecting to the comb-shape electrodes on a primary surface of the piezoelectric substrate, forming an SiO2 layer, performing a characteristics inspection on the piezoelectric substrate and marking defective piezoelectric elements, coating said SiO2 layer surface with photosensitive resin, and then exposing and developing to form an insulating layer.

Abstract: To provide a voltage controlled oscillator capable of being treated as a lumped constant circuit, having small size and capable of obtaining an oscillation frequency in a high frequency band. A resonance part in a voltage controlled oscillator has variable capacitance elements whose electrostatic capacitance varies in accordance with a control voltage for frequency control input from the outside and an inductance element, an amplifying part amplifies a frequency signal from the resonance part, and a feedback part, having feedback capacitance elements, forms an oscillation loop together with the amplifying part and the resonance part by making the frequency signal amplified in the amplifying part to be fed back to the resonance part. Further, the resonance part and the feedback part are provided on a quartz-crystal substrate.

Abstract: There is provided a voltage controlled oscillator using a Colpitts circuit capable of suppressing deterioration (decrease) in variable range (adjustable range) of an output frequency due to the influence of an inductance component on a conductive line, which connects a connection point between two capacitors of a feedback part and an emitter of a transistor. In a VCO using a Colpitts circuit, with respect to capacitors 22, 23 of a feedback part 2, a first feedback capacitance element (capacitor) 22 is disposed so as to directly couple a terminal for base (connection part 7) and a terminal for emitter on a base substrate 5, to which a terminal part 8 (T1) extending from a base of a transistor 21 and a terminal part 8 (T2) extending from an emitter of the transistor 21 are fitted, respectively, and a second feedback capacitance element (capacitor) 23 is disposed so as to directly couple the terminal for emitter and the terminal for grounding (ground electrode 51).

Abstract: A manufacturing method, which realizes general versatility of an external connection terminal by reducing deterioration of characteristics and a decrease in yield rate of a piezoelectric device in an external connection terminal forming process, and a piezoelectric device manufactured by this method are provided. Before a piezoelectric device is sealed together with a ceiling layer to form a package, an electrode structure serving as an external connection terminal is provided beforehand on a substrate mounted with a key area of the device, and after formation of the key area of the device, the piezoelectric device is sealed and packaged together with the ceiling layer. The piezoelectric device of the present invention can accommodate a three-dimensional structure by providing a rewiring layer on a principal surface of the substrate.

Abstract: An object of the present invention is to economically manufacture a piezoelectric component having superior molding pressure resistance and reduced height.

Abstract: A method for forming a piezoelectric component includes forming a plurality of sets of first piezoelectric elements having comb-shaped electrodes and wiring electrodes on a principal surface of a piezoelectric substrate base material, forming a protective film, a seed layer, and terminal electrodes, and removing the seed layer by etching. The method further includes preparing another piezoelectric substrate and performing resin-sealing by laminating a photosensitive resin film onto a principal surface side of the piezoelectric substrate base material. Cu electroplating is performed upon the terminal electrodes, and the piezoelectric substrate base material is cut along dicing lines to obtain individual piezoelectric components. The piezoelectric component includes a first piezoelectric element and a plurality of second piezoelectric elements with the second piezoelectric elements sealed by a resin seal layer such that a hollow section is formed between opposing principal surfaces thereof.

Abstract: An object of the present invention is to; miniaturize, increase the capacity, and reduce the price of piezoelectric components. The present invention relates to a piezoelectric component and a manufacturing method thereof, characterized in that: there are bonded and laminated at least two or more piezoelectric elements in which comb-teeth electrodes, wiring electrodes having element wirings that are arranged adjacent to the comb-teeth electrodes, and electrode terminals connected to the wiring electrodes, are formed on a principal surface of a plurality of piezoelectric substrates, while forming hollow sections between the respective piezoelectric elements; through electrodes are formed in the respective piezoelectric substrates so as to pass therethrough; the through electrodes are connected to the electrode terminals; and the piezoelectric substrates are sealed by a resin sealing layer.

Abstract: A solder material with favorable mechanical properties and high corrosion resistance is provided. The solder material is not apt to be melted in a re-heating process after the soldering process is performed. The solder material includes first solder powder, Cu powder, and a flux. The first solder powder contains Cu, Si, Ti, and Sn. Here, Cu accounts for 7 wt %˜9 wt %, Si accounts for 0.001 wt %˜0.05 wt %, Ti accounts for 0.001 wt %˜0.05 wt %, and the rest is Sn. The Cu powder is coated by Ag. The flux is mixed with the first solder powder and the Cu powder.

Abstract: To provide a voltage controlled oscillator having small size and capable of obtaining a low phase noise characteristic over a large span of adjustable range of frequency. A quartz crystal having a characteristic (dielectric loss tangent: tan ?) better than that of fluorocarbon resin, LTCC or the like conventionally used as a substrate of a resonance part 1, and on which a fine pattern of metal film can be formed through a photolithography method, is used as a quartz-crystal substrate 10, and a conductive line is formed on the quartz-crystal substrate 10 to form an inductance element 11 in the resonance part 1. Accordingly, since the resonance part 1 having a high Q value can be formed, it is possible to obtain a voltage controlled oscillator having small size and low loss over a wide frequency band.

Abstract: There is provided a voltage controlled oscillator using a Colpitts circuit capable of suppressing deterioration (decrease) in variable range (adjustable range) of an output frequency due to the influence of an inductance component on a conductive line, which connects a connection point between two capacitors of a feedback part and an emitter of a transistor. In a VCO using a Colpitts circuit, with respect to capacitors 22, 23 of a feedback part 2, a first feedback capacitance element (capacitor) 22 is disposed so as to directly couple a terminal for base (connection part 7) and a terminal for emitter on a base substrate 5, to which a terminal part 8 (T1) extending from a base of a transistor 21 and a terminal part 8 (T2) extending from an emitter of the transistor 21 are fitted, respectively, and a second feedback capacitance element (capacitor) 23 is disposed so as to directly couple the terminal for emitter and the terminal for grounding (ground electrode 51).