Patents by Inventor Toshimi Komura

Toshimi Komura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4773955
    Abstract: A printed wiring board comprising a plastic material is formed with a through opening for mounting electronic parts therein, and the end of the opening on the rear side of the board is closed by a metal sheet bonded to the area around the opening end on the rear of the board through an adhesive layer. The inside wall and bottom face of the opening in the board are coated with an integral plating film as are the rear surfaces of the board an metal sheet. According to this board structure, the heat generated from electronic parts mounted on the bottom of the opening is dispersed by the metal sheet, and also penetration of moisture into the opening through the plastic material and the adhesive layer, as occurs with conventional boards, is prevented by the plating film.
    Type: Grant
    Filed: May 14, 1987
    Date of Patent: September 27, 1988
    Assignee: Ibiden Co. Ltd.
    Inventors: Katsumi Mabuchi, Toshimi Komura
  • Patent number: 4737395
    Abstract: A printed wiring board comprising a plastic material is formed with a through opening for mounting electronic parts therein, and the end of the opening on the rear side of the board is closed by a metal sheet bonded to the area around the opening end on the rear of the board through an adhesive layer. The inside wall and bottom face of the opening in the board are coated with an integral plating film as are the rear surfaces of the board and metal sheet. According to this board structure, the heat generated from electronic parts mounted on the bottom of the opening is dispersed by the metal sheet, and also penetration of moisture into the opening through the plastic material and the adhesive layer, as occurs with conventional boards, is prevented by the plating film.
    Type: Grant
    Filed: July 12, 1985
    Date of Patent: April 12, 1988
    Assignee: Ibiden Co. Ltd.
    Inventors: Katsumi Mabuchi, Toshimi Komura