Abstract: A metal wiring layer includes a plurality of hierarchical blocks each divided by a side that serves as a boundary. One of the hierarchical blocks is placed to extend along the outer periphery of the self hierarchical block, and includes: a shield ring wire formed by a single metal wire or by a plurality of metal wires; and a plurality of metal wires that are placed inside the shield ring wire and extend in a preferential direction determined in advance. The shield ring wire has a first section extending in the preferential direction and a second section extending in a non-preferential direction perpendicular to the preferential direction.

Abstract: A metal wiring layer includes a plurality of hierarchical blocks each divided by a side that serves as a boundary. One of the hierarchical blocks is placed to extend along the outer periphery of the self hierarchical block, and includes: a shield ring wire formed by a single metal wire or by a plurality of metal wires; and a plurality of metal wires that are placed inside the shield ring wire and extend in a preferential direction determined in advance. The shield ring wire has a first section extending in the preferential direction and a second section extending in a non-preferential direction perpendicular to the preferential direction.

Abstract: To provide a polishing composition which can polish a polishing object composed of a hard brittle material having the Vickers hardness of greater than 1,500 HV at a high polishing rate under a condition of a high polishing load (polishing pressure) of 150 g/cm2 or more and can suppress the generation of a defect such as scratches on the surface of the polishing object or the generation of scratches on a polishing pad, a holding jig or the like when polishing a polishing object composed of a hard brittle material using a polishing apparatus having the polishing pad. The polishing composition contains abrasive grains, water and an additive agent that is adsorbed on the surface of the polishing pad to decrease unnecessary frictional resistance between the polishing pad and the polishing object.