Patents by Inventor Toshimichi Iizima

Toshimichi Iizima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Solid-state image pickup apparatus and fabricating method thereof
    Patent number: 6780667
    Abstract: A solid-state image pickup apparatus having hermetic seal portion capable of packaged in a smaller size by a simple construction and fabricated with high precision at wafer level is constructed such that an epoxy-type resin sheet having opening portion only at light-receiving portion is adhered to solid-state image pickup device chip by an adhesive and a transparent member capable of becoming a flat-plate portion is adhered onto the epoxy-type resin sheet by means of an adhesive.
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: August 24, 2004
    Assignee: Olympus Optical, Co., Ltd.
    Inventors: Toshimichi Iizima, Toyokazu Mizoguchi, Kenji Miyata
  • Solid-state image pickup apparatus and fabricating method thereof
    Patent number: 6483179
    Abstract: A solid-state image pickup apparatus having hermetic seal portion capable of packaged in a smaller size by a simple construction and fabricated with high precision at wafer level is constructed such that an epoxy-type resin sheet having opening portion only at light-receiving portion is adhered to solid-state image pickup device chip by an adhesive and a transparent member capable of becoming a flat-plate portion is adhered onto the epoxy-type resin sheet by means of an adhesive.
    Type: Grant
    Filed: March 8, 2001
    Date of Patent: November 19, 2002
    Assignee: Olympus Optical Co., Ltd.
    Inventors: Toshimichi Iizima, Toyokazu Mizoguchi, Kenji Miyata
  • Solid-state image pickup apparatus and fabricating method thereof
    Publication number: 20020149075
    Abstract: A solid-state image pickup apparatus having hermetic seal portion capable of packaged in a smaller size by a simple construction and fabricated with high precision at wafer level is constructed such that an epoxy-type resin sheet having opening portion only at light-receiving portion is adhered to solid-state image pickup device chip by an adhesive and a transparent member capable of becoming a flat-plate portion is adhered onto the epoxy-type resin sheet by means of an adhesive.
    Type: Application
    Filed: May 31, 2002
    Publication date: October 17, 2002
    Applicant: Olympus Optical, Co. Ltd.
    Inventors: Toshimichi Iizima, Toyokazu Mizoguchi, Kenji Miyata
  • Solid-state image pickup apparatus and fabricating method thereof
    Publication number: 20010020738
    Abstract: A solid-state image pickup apparatus having hermetic seal portion capable of packaged in a smaller size by a simple construction and fabricated with high precision at wafer level is constructed such that an epoxy-type resin sheet having opening portion only at light-receiving portion is adhered to solid-state image pickup device chip by an adhesive and a transparent member capable of becoming a flat-plate portion is adhered onto the epoxy-type resin sheet by means of an adhesive.
    Type: Application
    Filed: March 8, 2001
    Publication date: September 13, 2001
    Applicant: Olympus Optical Co., Ltd.
    Inventors: Toshimichi Iizima, Toyokazu Mizoguchi, Kenji Miyata