Abstract: A vacuum processing apparatus includes a reaction chamber, a non-reaction chamber which is a load-lock chamber or a double load-lock chamber. A double arm is accommodated in the non-reaction chamber, and includes a first arm and a second arm for taking out a processed wafer from the reaction chamber and supplying an unprocessed wafer to the reaction chamber. Wafer elevating mechanisms are provided in the reaction chamber and the non-reaction chamber. The double arm and the wafer elevating mechanisms are driven by a single drive source. Also, a selective engagement mechanism is provided at the reaction chamber and at the non-reaction chamber for selectively engaging the driving source with any one of the wafer elevating mechanisms at the reaction chamber and the non-reaction chamber to drive the double arm and the wafer elevating mechanism at the selected chamber.

Abstract: Generated heat is effectively dissipated to prevent thermal deformation of a gas ejector plate in a plasma processing apparatus which is capable of processing a substrate of large scale. A temperature controlling plate 106 and heat conductor 109 are fixedly disposed on the upper electrode-cum-gas ejector plate 105 which is provided with a multiplicity of gas ejecting apertures 105a disposed at regular intervals. The heat conductor 109 is constructed to be a latticed member for effectively conducting heat from the gas ejector plate 105 to the temperature controlling plate 106, and has a plurality of gas pressure equalizing spaces 109a defined between crossing bars of the lattice for pressuring process gas to be evenly ejected through the gas ejecting apertures 105a.

Abstract: A vacuum processing apparatus includes a reaction chamber, a non-reaction chamber which is a load-lock chamber or a double load-lock chamber. A double arm is accommodated in the non-reaction chamber, and includes a first arm and a second arm for taking out a processed wafer from the reaction chamber and supplying an unprocessed wafer to the reaction chamber. Wafer elevating mechanisms are provided in the reaction chamber and the non-reaction chamber. The double arm and the wafer elevating mechanisms are driven by a single drive source. Also, a selective engagement mechanism is provided at the reaction chamber and at the non-reaction chamber for selectively engaging the driving source with any one of the wafer elevating mechanisms at the reaction chamber and the non-reaction chamber to drive the double arm and the wafer elevating mechanism at the selected chamber.

Abstract: A substrate transfer apparatus includes two transfer arms pivotably arranged on a support table on opposite sides from each other with respect to a center of the support table. Each of the transfer arms includes: a first set of parallel links, a second set of parallel links, and a substrate holding member. The first set of the links is pivotably connected to the second set of the links at one ends thereof. The other ends of the first set of the links are pivotably connected to the support table. The substrate holding member is provided on the other end of the second set of the links. The each of the substrate holding members moves outward from the support table by stretching of the transfer arms and returns to the support table by bending of the transfer arms, and the transfer arms are bent in an opposite direction to each other with respect to the support table.

Abstract: In a method of mounting an electronic component wherein the electronic component is temporarily mounted on a printed circuit board before the component is securely mounted on the base plate by soldering, the improvement comprises steps of delivering adhesive to the front end of a coating head of an adhesive applicator, transferring the adhesive on to the printed circuit board between connection lands provided thereon for placement of the electronic component, and then positioning the electronic component on the adhesive applied to allow the electronic component to be held in position, with its bottom surface and a part of its side surface put in contact with the adhesive. The electronic component is thus mounted temporarily on the printed circuit board.