Abstract: A photoelectric circuit board includes a substrate, an optical waveguide and a core exposure surface. The substrate has an inspection opening. The optical waveguide includes a core and a clad formed around the core. The optical waveguide is formed on one surface side of the substrate, is exposed to the inspection opening, and has a portion curved toward the inspection opening. The core exposure surface is formed in the curved portion of the optical waveguide so that the core is exposed out of the clad.

Abstract: A substrate is bonded to a semiconductor integrated circuit to which plural solder bumps have been adhered. The substrate includes: plural contact portions that are disposed at positions corresponding to the positions of the plural solder bumps and include contact surfaces which contact the solder bumps; and a guidance structure that is disposed in the contact surfaces and, when the solder bumps are melted, guides the melted solder bumps to predetermined regions within the contact surfaces. The predetermined regions are set so that the semiconductor integrated circuit and the substrate are properly aligned.

Abstract: A photoelectric circuit board includes a substrate, an optical waveguide and a core exposure surface. The substrate has an inspection opening. The optical waveguide includes a core and a clad formed around the core. The optical waveguide is formed on one surface side of the substrate, is exposed to the inspection opening, and has a portion curved toward the inspection opening. The core exposure surface is formed in the curved portion of the optical waveguide so that the core is exposed out of the clad.

Abstract: An optical connectorcomprises an optical cable; and a ferrule that is attached to an end of the optical cable and performs optical connection; a cover that defines a through hole that the optical cable passes through, the cover covering the ferrule without contacting the ferrule; and a removal-preventing section that is disposed inside a wall that the through hole of the cover is formed on, and the removal-preventing section preventing a pulling force applied to the optical cable from being transferred to the ferrule.

Abstract: A semiconductor integrated circuit which includes an optical device for performing optical communication and which exhibits a predetermined function. This semiconductor integrated circuit includes a first electricity supply portion, which is connected to the optical device, and a second electricity supply portion, which differs from the first electricity supply portion and is connected to the optical device.

Abstract: A semiconductor integrated circuit which includes an optical device for performing optical communication and which exhibits a predetermined function. This semiconductor integrated circuit includes a first electricity supply portion, which is connected to the optical device, and a second electricity supply portion, which differs from the first electricity supply portion and is connected to the optical device.

Abstract: An optical connectorcomprises an optical cable; and a ferrule that is attached to an end of the optical cable and performs optical connection; a cover that defines a through hole that the optical cable passes through, the cover covering the ferrule without contacting the ferrule; and a removal-preventing section that is disposed inside a wall that the through hole of the cover is formed on, and the removal-preventing section preventing a pulling force applied to the optical cable from being transferred to the ferrule.

Abstract: An optical connector mounted on a board comprises an optical connector main body that performs optical transmission and a fixing pin that fixes the optical connector main body to the board. The optical connector main body has a pin insertion hole that the fixing pin is inserted.

Abstract: A substrate is bonded to a semiconductor integrated circuit to which plural solder bumps have been adhered. The substrate includes: plural contact portions that are disposed at positions corresponding to the positions of the plural solder bumps and include contact surfaces which contact the solder bumps; and a guidance structure that is disposed in the contact surfaces and, when the solder bumps are melted, guides the melted solder bumps to predetermined regions within the contact surfaces. The predetermined regions are set so that the semiconductor integrated circuit and the substrate are properly aligned.

Abstract: The present invention provides an optical waveguide interconnection board, including: optical input and output ports; at least one optical waveguide corresponding to an optical circuit pattern; and at least one light direction-changing element each of which is disposed between one of the optical input port and the optical output port and one of the at least one optical waveguide or, when the optical waveguide interconnection board has two or more optical waveguides, between two of the optical waveguides, and which comprises at least one of at least one light direction-changing element A that changes the direction of light in a plane parallel to a plane of the optical waveguide interconnection board and at least one light direction-changing element B that changes the direction of light to a direction having an angle with respect to a plane parallel to the plane of the optical waveguide interconnection board.

Abstract: A semiconductor integrated circuit which includes an optical device for performing optical communication and which exhibits a predetermined function. This semiconductor integrated circuit includes a first electricity supply portion, which is connected to the optical device, and a second electricity supply portion, which differs from the first electricity supply portion and is connected to the optical device.

Abstract: The present invention provides an optical waveguide interconnection board, including: optical input and output ports; at least one optical waveguide corresponding to an optical circuit pattern; and at least one light direction-changing element each of which is disposed between one of the optical input port and the optical output port and one of the at least one optical waveguide or, when the optical waveguide interconnection board has two or more optical waveguides, between two of the optical waveguides, and which comprises at least one of at least one light direction-changing element A that changes the direction of light in a plane parallel to a plane of the optical waveguide interconnection board and at least one light direction-changing element B that changes the direction of light to a direction having an angle with respect to a plane parallel to the plane of the optical waveguide interconnection board.

Abstract: The present invention provides an ink jet recording head that enables stable high-speed continuous printing, its manufacturing method and an ink jet recording device. A bubble generated in a common liquid chamber is moved to the side of an ink tank via a communicating port formed in a sufficient size and a supply passage. That is, a bubble generated inside a common liquid chamber is exhausted satisfactorily from the common liquid chamber by forming the communicating port in a shape which the bubble can pass, resulting in the supply of ink to the common liquid chamber and an individual passage (nozzle) prevented from being blocked by the bubble. As a result, even if high-speed continuous jetting (printing) is performed, stable printing is enabled.

Abstract: A satisfactory bonding is implemented at low cost. In a step, a resin layer is formed on a bonding surface side of a silicon wafer on which portion are formed electro-thermal transducers. In a later step, the silicon wafer and another silicon wafer are aligned and fixed temporarily, then the atmosphere is set at a pressure of 10−3 mbar or lower and the temperature is set at 300° C. or higher, and voltage is applied across the both wafers while pressure is applied to the wafers. When the value of an electric current flowing across the wafers has reached a level of a certain current value or lower, the application of the voltage is stopped and the atmosphere is opened to the atmospheric pressure while reducing the temperature.

Abstract: The present invention provides an ink jet recording head that enables stable high-speed continuous printing, its manufacturing method and an ink jet recording device. A bubble generated in a common liquid chamber is moved to the side of an ink tank via a communicating port formed in a sufficient size and a supply passage. That is, a bubble generated inside a common liquid chamber is exhausted satisfactorily from the common liquid chamber by forming the communicating port in a shape which the bubble can pass, resulting in the supply of ink to the common liquid chamber and an individual passage (nozzle) prevented from being blocked by the bubble. As a result, even if high-speed continuous jetting (printing) is performed, stable printing is enabled.

Abstract: A semiconductor integrated circuit providing a novel patterned multilayered wiring structure to enhance the degree of the integration of the circuit and the speed of the operation. The structure includes at least one first interlaid electric insulator film on the wall of the contact portion of a first wiring layer and its vicinity, a second interlaid electric insulator film, which reacts distinctly to the etching process utilized from the first interlaid electric insulator film, is provided on a substrate.

Abstract: A semiconductor integrated circuit providing a novel patterned multilayered wiring structure to enhance the degree of the integration of the circuit and the speed of the operation. The structure includes at least one first interlaid electric insulator film on the wall of the contact portion of a first wiring layer and its vicinity, a second interlaid electric insulator film, which reacts distinctly to the etching process utilized from the first interlaid electric insulator film, is provided on a substrate.