Abstract: The invention provides an photosensitive resin composition excellent in heat resistance and adhesion to wiring layers which yields high resolution after development with aqueous solution containing no organic solvent. The composition is used as an adhesive between circuits in a process producing a multi-layer printed wiring board by a built-up method. The composition comprises a compound (A) having the molecule at least one phenolic hydroxyl group and at least one acryloyl or methacryloyl group, an unsaturated imide compound (B), a photopolymerization initiator (c) and, optionally, an epoxy compound (D) having at least two epoxy groups in the molecule. Also, provided for is a multilayer printed wiring board comprising wiring layers and insulating layers, which are alternatively formed wherein said insulating layers are formed of said composition.

Abstract: The invention provides a process for producing a piezo-electric or pyro-electric composite sheet in which particles of a piezo-electric or pyro-electric sintered body (ceramics) are dispersed in the form of a single layer in an insulating high polymeric substance, and the particles are in direct contact with electrodes made on both sides of the sheet. The composite sheet is produced by forming a sheet of an insulating high polymeric substance having dispersed therein particles of a piezo-electric or pyro-electric sintered body (ceramics) in the form of a single layer, then removing the surface skin from both sides of the sheet to expose the particles from both sides of the sheet; and making electrodes on both sides of the sheet and implying a voltage difference thereto to effect poling of the sheet.