Patents by Inventor Toshimitsu Hamada

Toshimitsu Hamada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9914077
    Abstract: An end member (3A) for a spiral separation membrane element includes: an inner annular portion (31); an outer annular portion (32) surrounding the inner annular portion (31) at a distance from the inner annular portion (31); a plurality of connecting portions (33) connecting the inner annular portion (31) and the outer annular portion (32); and a shield plate (34) disposed between at least one pair of the connecting portions (33) and forming an opening (41) between the shield plate (34) and the outer annular portion (32). According to this configuration, a radially outwardly spreading flow is formed by the shield plate (34), and therefore suspended solids in a feed liquid can be effectively directed to the peripheral region.
    Type: Grant
    Filed: August 10, 2012
    Date of Patent: March 13, 2018
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shinichi Chikura, Yasuhiro Uda, Toshimitsu Hamada
  • Patent number: 9504963
    Abstract: A spiral separation membrane element (1A) includes: a wound body (3) including a separation membrane; a core tube (2) that penetrates the wound body (3) along the central axis of the wound body (3); and a joining portion (4) that joins the wound body (3) to the core tube (2) at at least one end face (3a) of the wound body (3). The joining portion (4) has a holding portion (41) disposed inwardly of the end face (3a) of the wound body (3) and an extending portion (42) formed integrally with the holding portion (41). The spiral separation membrane element (1A) further includes a restraining member (5A) that secures the extending portion (42) to the core tube (2).
    Type: Grant
    Filed: December 22, 2011
    Date of Patent: November 29, 2016
    Assignee: NITTO DENKO CORPORATION
    Inventors: Shinichi Chikura, Toshimitsu Hamada, Yasuhiro Uda, Kazuhito Yoshida
  • Patent number: 9061247
    Abstract: A separation membrane module (1A) includes: a tubular pressure container (7); a plurality of separation membrane elements (2) inserted in the pressure container (7) and each having a first end member (3) and a second end member (4); and a sealing member (5A) mounted on one of or both the first end member (3) and the second end member (4) that are adjacent to each other. In a normal condition, the sealing member (5A) is located radially inward of a maximum diameter portion of the first end member (3) and/or the second end member (4) on which the sealing member (5A) is mounted. The sealing member (5A) is deformed due to contact between the adjacent separation membrane elements (2) or due to supply of a pressurized liquid into the pressure container (7), and comes into close contact with an inner circumferential face (7a) of the pressure container (7).
    Type: Grant
    Filed: September 13, 2011
    Date of Patent: June 23, 2015
    Assignee: Nitto Denko Corporation
    Inventors: Shinichi Chikura, Toshimitsu Hamada, Yasuhiro Uda, Hideyuki Yamane, Kazuhito Yoshida, Masashi Beppu, Masakatsu Takata
  • Publication number: 20140183126
    Abstract: An end member (3A) for a spiral separation membrane element includes: an inner annular portion (31); an outer annular portion (32) surrounding the inner annular portion (31) at a distance from the inner annular portion (31); a plurality of connecting portions (33) connecting the inner annular portion (31) and the outer annular portion (32); and a shield plate (34) disposed between at least one pair of the connecting portions (33) and forming an opening (41) between the shield plate (34) and the outer annular portion (32). According to this configuration, a radially outwardly spreading flow is formed by the shield plate (34), and therefore suspended solids in a feed liquid can be effectively directed to the peripheral region.
    Type: Application
    Filed: August 10, 2012
    Publication date: July 3, 2014
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shinichi CHikura, Yasuhiro Uda, Toshimitsu Hamada
  • Patent number: 8758611
    Abstract: Disclosed are an edge member for membrane elements that can effectively improve adhesion with exterior finishing materials, and a membrane element that is equipped with the same. A plurality of types of undulations (134, 135) of different shapes are formed on the circumference of an extension (132) that extends from the main body (131) of an anti-telescoping member (edge member for membrane element) (13) toward a membrane roll body (11), and an exterior finishing material is attached to extend across the circumference of the extension (132) and the circumference of the membrane roll body. The adhesion between the anti-telescoping member (13) and the exterior finishing material can thus be effectively improved, since the exterior finishing material can be attached to the circumference of the extension (132) with the plurality of types of undulations (134, 135) in contact with the exterior finishing material.
    Type: Grant
    Filed: February 22, 2010
    Date of Patent: June 24, 2014
    Assignee: Nitto Denko Corporation
    Inventors: Masashi Beppu, Toshimitsu Hamada
  • Publication number: 20130299416
    Abstract: A spiral separation membrane element (1A) includes: a wound body (3) including a separation membrane; a core tube (2) that penetrates the wound body (3) along the central axis of the wound body (3); and a joining portion (4) that joins the wound body (3) to the core tube (2) at at least one end face (3a) of the wound body (3). The joining portion (4) has a holding portion (41) disposed inwardly of the end face (3a) of the wound body (3) and an extending portion (42) formed integrally with the holding portion (41). The spiral separation membrane element (1A) further includes a restraining member (5A) that secures the extending portion (42) to the core tube (2).
    Type: Application
    Filed: December 22, 2011
    Publication date: November 14, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shinichi Chikura, Toshimitsu Hamada, Yasuhiro Uda, Kazuhito Yoshida
  • Patent number: 8568589
    Abstract: Provided are a connection member capable of preventing leakage from a supply side to a permeating side from occurring by a simple means; and a separation membrane module using the connection member. The connection member (20) is used to connect in series a plurality of separation membrane elements equipped with end surface holding members (36) and to install the separation membrane elements in a pressure-resistant vessel (38). The connection member (20) is characterized in that, when the separation membrane elements are connected to each other, the connection member is engaged with respective grooves (36b) of the end surface holding members (36) adjacent to each other.
    Type: Grant
    Filed: February 20, 2009
    Date of Patent: October 29, 2013
    Assignee: Nitto Denko Corporation
    Inventors: Yasuhiro Uda, Toshimitsu Hamada, Masashi Beppu, Shinichi Chikura, Nobuharu Tahara, Masakatsu Takata
  • Publication number: 20130220915
    Abstract: Provided is a separation membrane element used under a high-temperature environment, in which the stress acting on a portion for fixing between a fluid collecting tube and a separation membrane is reduced and a deformation caused by receiving a long time thermal history can be prevented, and also provided is a fluid collecting tube used for the separation membrane element. The separation membrane element has a fluid collecting tube (10), a separation membrane, and fixing portions (4) provided at at least two places and fixing between the fluid collecting tube (10) and the separation membrane. The separation membrane element has at least one elastic portion in the fluid collecting tube (10) between the fixing portions (4).
    Type: Application
    Filed: September 27, 2011
    Publication date: August 29, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shinichi Chikura, Toshimitsu Hamada
  • Publication number: 20130186819
    Abstract: A separation membrane module (1A) includes: a tubular pressure container (7); a plurality of separation membrane elements (2) inserted in the pressure container (7) and each having a first end member (3) and a second end member (4); and a sealing member (5A) mounted on one of or both the first end member (3) and the second end member (4) that are adjacent to each other. In a normal condition, the sealing member (5A) is located radially inward of a maximum diameter portion of the first end member (3) and/or the second end member (4) on which the sealing member (5A) is mounted. The sealing member (5A) is deformed due to contact between the adjacent separation membrane elements (2) or due to supply of a pressurized liquid into the pressure container (7), and comes into close contact with an inner circumferential face (7a) of the pressure container (7).
    Type: Application
    Filed: September 13, 2011
    Publication date: July 25, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Shinichi Chikura, Toshimitsu Hamada, Yasuhiro Uda, Hideyuki Yamane, Kazuhito Yoshida, Masashi Beppu, Masakatsu Takata
  • Publication number: 20130087499
    Abstract: The spiral separation membrane element of the present invention includes: a perforated hollow tube (1) having a plurality of perforations (2) leading from an outer peripheral surface to an inner peripheral surface thereof; and a stack that includes a separation membrane and a passage member and that is wound around the perforated hollow tube (1). A bottomed recessed portion (3) is provided in a region covered by the stack on the outer peripheral surface of the perforated hollow tube (1). According to the present invention, permeated liquid flows into the bottomed recessed portion (3). Since the permeated liquid can flow smoothly in the bottomed recessed portion (3), the resistance to the permeated liquid can be reduced. As a result, the pressure loss can be reduced and the amount of the permeated liquid can be increased.
    Type: Application
    Filed: June 17, 2011
    Publication date: April 11, 2013
    Applicant: NITTO DENKO CORPORATION
    Inventors: Yasuhiro Uda, Toshimitsu Hamada, Shinichi Chikura
  • Publication number: 20120037562
    Abstract: Disclosed are an edge member for membrane elements that can effectively improve adhesion with exterior finishing materials, and a membrane element that is equipped with the same. A plurality of types of undulations (134, 135) of different shapes are formed on the circumference of an extension (132) that extends from the main body (131) of an anti-telescoping member (edge member for membrane element) (13) toward a membrane roll body (11), and an exterior finishing material is attached to extend across the circumference of the extension (132) and the circumference of the membrane roll body. The adhesion between the anti-telescoping member (13) and the exterior finishing material can thus be effectively improved, since the exterior finishing material can be attached to the circumference of the extension (132) with the plurality of types of undulations (134, 135) in contact with the exterior finishing material.
    Type: Application
    Filed: February 22, 2010
    Publication date: February 16, 2012
    Inventors: Masashi Beppu, Toshimitsu Hamada
  • Publication number: 20110000844
    Abstract: Provided are a connection member capable of preventing leakage from a supply side to a permeating side from occurring by a simple means; and a separation membrane module using the connection member. The connection member (20) is used to connect in series a plurality of separation membrane elements equipped with end surface holding members (36) and to install the separation membrane elements in a pressure-resistant vessel (38). The connection member (20) is characterized in that, when the separation membrane elements are connected to each other, the connection member is engaged with respective grooves (36b) of the end surface holding members (36) adjacent to each other.
    Type: Application
    Filed: February 20, 2009
    Publication date: January 6, 2011
    Inventors: Yasuhiro Uda, Toshimitsu Hamada, Masashi Beppu, Shinichi Chikura, Nobuharu Tahara, Masakatsu Takata
  • Publication number: 20100326901
    Abstract: Provided are a pressure vessel for a membrane element in which the membrane element can be easily mounted, a membrane filtration apparatus equipped with the pressure vessel for a membrane element, and a method for manufacturing a membrane filtration apparatus. A rail (protrusion) 60 is formed on the inner circumferential surface of the pressure vessel 40 in such a manner that a ridge line 61 extends along the insertion direction of the membrane element. Consequently, the membrane element 10 can be inserted into the pressure vessel 40 so as to be in a sliding contact onto the ridge line 61 of the rail 60 formed on the inner circumferential surface of the pressure vessel 40. Therefore, the frictional resistance can be reduced as compared with conventional ways, so that the membrane element 10 can be easily mounted onto the pressure vessel 40.
    Type: Application
    Filed: February 20, 2009
    Publication date: December 30, 2010
    Inventors: Shinichi Chikura, Toshimitsu Hamada, Masashi Beppu, Yasuhiro Uda, Masakatsu Takata
  • Patent number: 6757621
    Abstract: A process management system in accordance with the present invention includes inspection apparatuses for inspecting defects on a wafer, the inspection apparatuses being connected through a communication network, inspection information and image information obtained from these inspection apparatuses being collected to construct a data base and an image file, therein definition of defects is given by combinations of elements which characterize the defect based on the inspection information and the image information obtained from the inspection apparatuses. By giving definition of the defect, characteristics of the defect can be subdivided and known. Therefore, the cause of a defect can be studied.
    Type: Grant
    Filed: January 16, 2003
    Date of Patent: June 29, 2004
    Assignees: Hitachi, Ltd., Hitachi Engineering Co., Ltd.
    Inventors: Fumio Mizuno, Seiji Isogai, Kenji Watanabe, Yasuhiro Yoshitake, Terushige Asakawa, Yuichi Ohyama, Hidekuni Sugimoto, Seiji Ishikawa, Masataka Shiba, Jun Nakazato, Makoto Ariga, Tetsuji Yokouchi, Toshimitsu Hamada, Ikuo Suzuki, Masami Ikota, Mari Nozoe, Isao Miyazaki, Yoshiharu Shigyo
  • Publication number: 20030130806
    Abstract: A process management system in accordance with the present invention includes inspection apparatuses for inspecting defects on a wafer, the inspection apparatuses being connected through a communication network, inspection information and image information obtained from these inspection apparatuses being collected to construct a data base and an image file, therein definition of defects is given by combinations of elements which characterize the defect based on the inspection information and the image information obtained from the inspection apparatuses. By giving definition of the defect, characteristics of the defect can be subdivided and known. Therefore, the cause of a defect can be studied.
    Type: Application
    Filed: January 16, 2003
    Publication date: July 10, 2003
    Applicant: Hitachi, Ltd.
    Inventors: Fumio Mizuno, Seiji Isogai, Kenji Watanabe, Yasuhiro Yoshitake, Terushige Asakawa, Yuichi Ohyama, Hidekuni Sugimoto, Seiji Ishikawa, Masataka Shiba, Jun Nakazato, Makoto Ariga, Tetsuji Yokouchi, Toshimitsu Hamada, Ikuo Suzuki, Masami Ikota, Mari Nozoe, Isao Miyazaki, Yoshiharu Shigyo
  • Patent number: 6542830
    Abstract: A process management system in accordance with the present invention includes inspection apparatuses for inspecting defects on a wafer, the inspection apparatuses being connected through a communication network, inspection information and image information obtained from these inspection apparatuses being collected to construct a data base and an image file, therein definition of defects is given by combinations of elements which characterize the defect based on the inspection information and the image information obtained from the inspection apparatuses. By giving definition of the defect, characteristics of the defect can be subdivided and known. Therefore, the cause of a defect can be studied.
    Type: Grant
    Filed: September 10, 1998
    Date of Patent: April 1, 2003
    Assignees: Hitachi, Ltd., Hitachi Instruments Engineering Co., Ltd.
    Inventors: Fumio Mizuno, Seiji Isogai, Kenji Watanabe, Yasuhiro Yoshitake, Terushige Asakawa, Yuichi Ohyama, Hidekuni Sugimoto, Seiji Ishikawa, Masataka Shiba, Jun Nakazato, Makoto Ariga, Tetsuji Yokouchi, Toshimitsu Hamada, Ikuo Suzuki, Masami Ikota, Mari Nozoe, Isao Miyazaki, Yoshiharu Shigyo
  • Patent number: 6002989
    Abstract: Inspection apparatuses of an inspection apparatus group are connected to a network and transfer inspected result to a data collection system. The same wafer selected from a specific process is inspected by the different inspection apparatuses and the inspected data are collected and analyzed to calculate a correlation degree among the inspection apparatuses. On the other hand, the course of occurrence of failures in the same process can be analyzed to thereby calculate an average occurrence frequency of failures. An optimum inspection apparatus and inspection frequency are successively obtained on the basis of calculated results of an inter-apparatus correlation degree calculation process and a failure occurrence frequency calculation process, so that a feeding method of wafers to the inspection apparatus group is indicated through an inspection apparatus group management system.
    Type: Grant
    Filed: April 1, 1997
    Date of Patent: December 14, 1999
    Assignees: Hitachi, Ltd., Hitachi Electronics Engineering Co., Ltd.
    Inventors: Masataka Shiba, Kenji Watanabe, Toshimitsu Hamada, Seiji Ishikawa, Naoki Go, Toshiaki Yachi, Tetsuya Watanabe, Takahiro Jingu
  • Patent number: 5493594
    Abstract: A method and apparatus for inspecting a solder joint by an X-ray fluoroscopic image in which an X-ray is irradiated on an object to be inspected located by a specimen stage and having a lead of an electronic part soldered to a substrate to detect an X-ray fluoroscopic image signal, a position of a lead in a tip direction is obtained by a distribution of projection with said X-ray fluoroscopic image signal projected in a lead row direction, a position of a lead in a row direction is obtained by a distribution of projection with said X-ray fluoroscopic image projected in a lead tip direction to extract a position of a solder joint as an object to be inspected, and said X-ray fluoroscopic image is evaluated every solder joint in accordance with the postion information to effect a defect detection.
    Type: Grant
    Filed: March 7, 1994
    Date of Patent: February 20, 1996
    Assignee: Hitachi, Ltd.
    Inventors: Toshimitsu Hamada, Kozo Nakahata, Yoshifumi Morioka
  • Patent number: 5463667
    Abstract: A method and an apparatus for inspecting a soldered joint with an X-ray, the soldered joint being formed by soldering a lead to a surface of a substrate.
    Type: Grant
    Filed: April 28, 1993
    Date of Patent: October 31, 1995
    Assignee: Hitachi, Ltd.
    Inventors: Toshiaki Ichinose, Takanori Ninomiya, Asahiro Kuni, Kozo Nakahata, Toshimitsu Hamada, Toshihiko Ayabe
  • Patent number: 5059559
    Abstract: The present invention relates to a multi-pin chip mounting method and apparatus based on a TAB (Tape Automated Bonding) system in which leads formed on a tape and bumps formed an IC chip are aligned with each other and compress-bonded to each other. An IC chip having bumps formed on a surface thereof and inner leads formed on a carrier tape are disposed opposite to each other at a bonding station. A position of the IC chip on a stage is detected through the inner leads at the bonding station to determine the amount of correction of position of the stage. The inner leads and the IC chip are aligned with each other on the basis of the determined correction amount and are thereafter bonded to each other.
    Type: Grant
    Filed: November 1, 1988
    Date of Patent: October 22, 1991
    Assignee: Hitachi, Ltd.
    Inventors: Michio Takahashi, Tooru Mita, Yasuo Nakagawa, Toshimitsu Hamada, Hisafumi Iwata, Aizo Kaneda, Kouji Serizawa, Hiroyuki Tanaka, Koichi Sugimoto, Toshihiko Sakai, Keizo Matsukawa, Tsutomu Mimata