Abstract: A method for manufacturing a multilayer ceramic electronic device includes punching out a ceramic sheet by one of left and right side surfaces of a laminated body so as to form a side margin part on the one of the left and right side surfaces of said laminated body; and punching out another ceramic sheet by another of the left and right side surfaces of the laminated body so as to form a side margin part on the another of the left and right side surfaces of said laminated body, thereby forming a ceramic main body having the laminated body and the pair of side margin parts that respectively cover the left and right side surfaces of the laminated body. The width W is greater than the length L in the multilayer ceramic electronic device.

Abstract: A multi-layer ceramic capacitor according to an embodiment of the present invention includes a multi-layer, side margins and offset sections. The multi-layer includes internal electrodes and dielectric layers alternately laminated. The side margins are configured of a dielectric and disposed to cover side faces of the multi-layer. The offset sections are made with amorphous areas or gap areas. The offset sections are formed between the internal electrodes and the side margins such that ends at side faces of the internal electrodes are offset from the side faces to an inward direction of the multi-layer.

Abstract: A multilayer ceramic electronic device includes: a ceramic main body having a laminated body and a pair of side margin parts that respectively cover left and right side surfaces of the laminated body, the laminated body including a plurality of internal electrodes laminated in a vertical direction, side ends of each of the internal electrodes reaching and being flush with the respective side surfaces of the laminated body within a range of 0.5 um ?m in the widthwise direction; and a pair of external electrodes respectively covering end surfaces of the ceramic main body, wherein a width dimension W of the multilayer ceramic electronic device in the widthwise direction is greater than a length dimension L of the multilayer ceramic electronic device in the lengthwise direction.

Abstract: A multi-layer ceramic capacitor includes a multi-layer unit and a side margin. The multi-layer unit includes ceramic layers laminated in a first direction and internal electrodes disposed between the ceramic layers. The side margin covers the multi-layer unit from a second direction orthogonal to the first direction and has a porosity of 1% or less.

Abstract: A method of producing a multi-layer ceramic electronic component includes: preparing a multi-layer sheet including laminated ceramic sheets, and internal electrodes disposed between the ceramic sheets; cutting the multi-layer sheet to produce a multi-layer chip having a side surface from which the internal electrodes are exposed; removing a superficial layer of the side surface of the multi-layer chip; and providing a side margin to the side surface of the multi-layer chip, the superficial layer being removed from the side surface.

Abstract: A multi-layer ceramic capacitor includes a multi-layer unit and a side margin. The multi-layer unit includes ceramic layers laminated in a first direction and internal electrodes disposed between the ceramic layers. The side margin covers the multi-layer unit from a second direction orthogonal to the first direction and has a porosity of 1% or less.

Abstract: A method of producing a multi-layer ceramic electronic component includes: preparing a multi-layer chip including ceramic layers laminated in a first axis direction, internal electrodes disposed between the ceramic layers, and a side surface on which the internal electrodes are exposed; applying a ceramic paste to the side surface; and pressing the applied ceramic paste toward the side surface to planarize the applied ceramic paste.

Abstract: A method of producing a multi-layer ceramic electronic component includes: preparing a multi-layer sheet including laminated ceramic sheets, and internal electrodes disposed between the ceramic sheets; cutting the multi-layer sheet to produce a multi-layer chip having a side surface from which the internal electrodes are exposed; removing a superficial layer of the side surface of the multi-layer chip; and providing a side margin to the side surface of the multi-layer chip, the superficial layer being removed from the side surface.

Abstract: A multi-layer ceramic capacitor according to an embodiment of the present invention includes a multi-layer, side margins and offset sections. The multi-layer includes internal electrodes and dielectric layers alternately laminated. The side margins are configured of a dielectric and disposed to cover side faces of the multi-layer. The offset sections are made with amorphous areas or gap areas. The offset sections are formed between the internal electrodes and the side margins such that ends at side faces of the internal electrodes are offset from the side faces to an inward direction of the multi-layer.