Abstract: A semiconductor device mounting method and system and an IC card fabricating method which can fabricate high quality products by dicing a thin semiconductor wafer, in a state where it is adhered to an adhesive sheet, into thin semiconductor devices, peeling the group of diced thin semiconductor devices from the adhesive sheet at high speed without damaging or cracking the semiconductor devices, conveying the group of peeled semiconductor devices on a unit basis in serial order, and mounting them onto a mounting board.

Abstract: A member coupling device is provided for use with a treatment apparatus which uses chemicals. The member coupling device is formed with a tapered hole including a tapered hole portion which diverges toward an opening. A tapered implant is inserted into the tapered hole from an enlarged side of the tapered hole portion and fitted therein. The implant includes a tapered portion in contact with the tapered hole portion, and a first thread formed on the tapered portion. With the implant fitted in the tapered hole, a member is placed in contact with the member coupling device. A second thread formed on a fastening member is engaged with the first thread of the implant in a screw coupling configuration to mount the member on the member coupling device.

Abstract: A semiconductor device mounting method and system and an IC card fabricating method which can fabricate high quality products by dicing a thin semiconductor wafer, in a state where it is adhered to an adhesive sheet, into thin semiconductor devices, peeling the group of diced thin semiconductor devices from the adhesive sheet at high speed without damaging or cracking the semiconductor devices, conveying the group of peeled semiconductor devices on a unit basis in serial order, and mounting them onto a mounting board.

Abstract: A semiconductor device mounting method and system and an IC card fabricating method which can fabricate high quality products by dicing a thin semiconductor wafer, in a state where it is adhered to an adhesive sheet, into thin semiconductor devices, peeling the group of diced thin semiconductor devices from the adhesive sheet at high speed without damaging or cracking the semiconductor devices, conveying the group of peeled semiconductor devices on a unit basis in serial order, and mounting them onto a mounting board.

Abstract: A semiconductor device mounting method and system and an IC card fabricating method which can fabricate high quality products by dicing a thin semiconductor wafer, in a state where it is adhered to an adhesive sheet, into thin semiconductor devices, peeling the group of diced thin semiconductor devices from the adhesive sheet at high speed without damaging or cracking the semiconductor devices, conveying the group of peeled semiconductor devices on a unit basis in serial order, and mounting them onto a mounting board.

Abstract: A semiconductor device mounting method and system and an IC card fabricating method which can fabricate high quality products by dicing a thin semiconductor wafer, in a state where it is adhered to an adhesive sheet, into thin semiconductor devices, peeling the group of diced thin semiconductor devices from the adhesive sheet at high speed without damaging or cracking the semiconductor devices, conveying the group of peeled semiconductor devices on a unit basis in serial order, and mounting them onto a mounting board.

Abstract: A present invention provides a locking mechanism capable of preventing a bolt from loosening. A bolt 5 has a head provided with a first part which comprises openings 511. A locking washer 4 is provided with a second part which includes outer projections 411 and a third part which includes insertion projections 401 on an outer edge. A taper piece 1 has a portion provided with a fourth part which comprises openings 105. The first part and the second part can engage with each other and the third part and the fourth part can engage with each other when said bolt 5 fastens at least two members 7 and 8 trough said washer 4 and said taper piece 1. Accordingly, the bolt 5 is prevented from rotating in an loosening direction.

Abstract: A member coupling device is provided for use with a treatment apparatus which uses chemicals. The member coupling device is formed with a tapered hole including a tapered hole portion which diverges toward an opening. A tapered implant is inserted into the tapered hole from an enlarged side of the tapered hole portion and fitted therein. The implant comprises a tapered portion in contact with the tapered hole portion, and a first thread formed on the tapered portion. With the implant fit in the tapered hole, a member is placed in contact with the member coupling device. A second thread formed on a fastening member is engaged with the first thread of the implant in a screw coupling configuration to mount the member on the member coupling device.