Patents by Inventor Toshimitsu Nakamura

Toshimitsu Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11121483
    Abstract: A terminal holder for accommodating a plurality of terminal fittings that are attached to respective ends of a plurality of electrical wires, each of the plurality of terminal fittings including a connection that is connected and fixed to an attachment object through a bolt inserted in the connection, and a fixing portion that is fixed to the electrical wire, the terminal holder including: a plurality of through holes in which the connections of the plurality of terminal fittings are to be respectively disposed and that expose the connections; a plurality of accommodations for respectively accommodating the fixing portions of the plurality of terminal fittings; and a partition wall continuously extending between the fixing portions and between the connections of adjacent terminal fittings.
    Type: Grant
    Filed: November 21, 2018
    Date of Patent: September 14, 2021
    Assignee: SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Hirokazu Nakai, Toshimitsu Nakamura
  • Publication number: 20200366006
    Abstract: A terminal holder for accommodating a plurality of terminal fittings that are attached to respective ends of a plurality of electrical wires, each of the plurality of terminal fittings including a connection that is connected and fixed to an attachment object through a bolt inserted in the connection, and a fixing portion that is fixed to the electrical wire, the terminal holder including: a plurality of through holes in which the connections of the plurality of terminal fittings are to be respectively disposed and that expose the connections; a plurality of accommodations for respectively accommodating the fixing portions of the plurality of terminal fittings; and a partition wall continuously extending between the fixing portions and between the connections of adjacent terminal fittings.
    Type: Application
    Filed: November 21, 2018
    Publication date: November 19, 2020
    Applicant: SUMITOMO WIRING SYSTEMS, LTD.
    Inventors: Hirokazu NAKAI, Toshimitsu NAKAMURA
  • Patent number: 10043996
    Abstract: Provided are a resin composition for element encapsulation for organic electronic devices which is transparent, has excellent flexibility, water vapor barrier properties, and adhesive force, and can suppress the generation of dark spots, a resin sheet for element encapsulation for organic electronic devices, an organic electroluminescent element, and an image display device. This adhesive resin composition for element encapsulation for organic electronic devices is used to seal an element for organic electronic devices, and is characterized by containing a diene polymer and a softening agent, in which the content of the softening agent is from 5% by mass to 30% by mass of the total mass.
    Type: Grant
    Filed: September 28, 2015
    Date of Patent: August 7, 2018
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Masami Aoyama, Tetsuya Mieda, Keiji Saito, Kunihiko Ishiguro, Toshimitsu Nakamura, Naoaki Mihara, Takumi Asanuma
  • Patent number: 9913324
    Abstract: A resin composition for sealing an organic electroluminescent element, containing: at least one epoxy compound; at least one polyester resin; and at least one Lewis acid compound or at least one compound which generates a Lewis acid, in which the content of the epoxy compound is from 10 to 200 parts by mass with respect to 100 parts by mass of the polyester resin.
    Type: Grant
    Filed: December 11, 2014
    Date of Patent: March 6, 2018
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Naoaki Mihara, Kunihiko Ishiguro, Toshimitsu Nakamura, Tetsuya Mieda
  • Patent number: 9758690
    Abstract: A transparent resin composition for sealing an organic EL element and other things having a sufficient effect of blocking moisture and excellent flexibility is provided. As essential components, a thermoplastic resin, tackifying resin and organometallic compound represented by the following chemical formula are included, having a light transmittance of 85% or more, and having a relationship of AM/Y<162, A: the acid value excluding the organometallic compound M: the weight average molecular weight of the organometallic compound Y: the weight ratio of the organometallic compound with respect to 100 parts by weight of resin components wherein the thermoplastic resin contains a hydride of a styrene-based A-B-A type triblock, wherein R1 to R4 represent organic groups including an alkyl group, aryl group, alkoxy group, cycloalkyl group and acyl group, each having a carbon number of 1 or more and 8 or less, M represents a metal atom having 3 valency.
    Type: Grant
    Filed: June 25, 2015
    Date of Patent: September 12, 2017
    Assignee: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kunihiko Ishiguro, Tetsuya Mieda, Keiji Saito, Masami Aoyama, Toshimitsu Nakamura, Naoaki Mihara, Takumi Asanuma
  • Patent number: 9257671
    Abstract: A resin composition for sealing an organic electroluminescent device, containing: a drying agent, and a curable component, wherein a surface roughness Ra of the shear failure surface after curing the resin composition is 0.5 ?m or more; a production method thereof; an adhesive film and a gas-barrier formed of the resin composition; an organic electroluminescent device and an organic electroluminescent panel using the same.
    Type: Grant
    Filed: June 12, 2014
    Date of Patent: February 9, 2016
    Assignee: Furukawa Electric Co., Ltd.
    Inventors: Toshihiro Suzuki, Satoshi Hattori, Tetsuya Mieda, Hideto Fukuda, Takanori Yamakawa, Toshimitsu Nakamura
  • Publication number: 20160017186
    Abstract: A sealant composition being adhesive for used in electronic devices, the sealant composition including an olefin-based polymer and a tackifier, wherein the olefin-based polymer is at least one selected from an ethylene/?-olefin copolymer and an ethylene/?-olefin/non-conjugated diene copolymer, and the content of the tackifier is 10% by mass or more and 70% by mass or less in the resin composition that constitutes the sealant composition.
    Type: Application
    Filed: September 28, 2015
    Publication date: January 21, 2016
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Masami AOYAMA, Tetsuya MIEDA, Keiji SAITO, Kunihiko ISHIGURO, Toshimitsu NAKAMURA, Naoaki MIHARA, Takumi ASANUMA
  • Publication number: 20160020426
    Abstract: Provided are a resin composition for element encapsulation for organic electronic devices which is transparent, has excellent flexibility, water vapor barrier properties, and adhesive force, and can suppress the generation of dark spots, a resin sheet for element encapsulation for organic electronic devices, an organic electroluminescent element, and an image display device. This adhesive resin composition for element encapsulation for organic electronic devices is used to seal an element for organic electronic devices, and is characterized by containing a diene polymer and a softening agent, in which the content of the softening agent is from 5% by mass to 30% by mass of the total mass.
    Type: Application
    Filed: September 28, 2015
    Publication date: January 21, 2016
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Masami AOYAMA, Tetsuya MIEDA, Keiji SAITO, Kunihiko ISHIGURO, Toshimitsu NAKAMURA, Naoaki MIHARA, Takumi ASANUMA
  • Publication number: 20160017197
    Abstract: Provided are an element sealing resin composition for organic electronic devices, which promotes a balance between the water vapor barrier properties and adhesiveness, decreases the water content, and sufficiently suppresses the generation of outgases, so that consequently the service life of an element for organic electronic devices can be lengthened, and which gives a satisfactory external appearance when used to seal an organic electronic device; an element sealing resin sheet for organic electronic devices; an organic electroluminescent element; and an image display apparatus. Disclosed is an element sealing resin composition for organic electronic devices, comprising a polyisobutylene resin (A) having a weight average molecular weight (Mw) of 10,000 to 300,000 and a hydrogenated cyclic olefin-based polymer (B), and having a water content according to the Karl-Fischer method of 500 ppm or less and an amount of outgas generation of 500 ppm or less when heated at 85° C. for 1 hour.
    Type: Application
    Filed: September 25, 2015
    Publication date: January 21, 2016
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Tetsuya MIEDA, Toshimitsu NAKAMURA, Kunihiko ISHIGURO, Masami AOYAMA
  • Publication number: 20150291824
    Abstract: A transparent resin composition for sealing an organic EL element and other things having a sufficient effect of blocking moisture and excellent flexibility is provided. As essential components, a thermoplastic resin, tackifying resin and organometallic compound represented by the following chemical formula are included, having a light transmittance of 85% or more, and having a relationship of AM/Y<162, A: the acid value except the organometallic compound M: the weight average molecular weight of the organometallic compound Y: the weight ratio of the organometallic compound with respect to 100 parts by weight of resin components wherein the thermoplastic resin contains a hydride of a styrene-based A-B-A type triblock, wherein R1 to R4 represent organic groups including an alkyl group, aryl group, alkoxy group, cycloalkyl group and acyl group, each having a carbon number of 1 or more and 8 or less, M represents a metal atom having 3 valency.
    Type: Application
    Filed: June 25, 2015
    Publication date: October 15, 2015
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Kunihiko ISHIGURO, Tetsuya Mieda, Keiji Saito, Masami Aoyama, Toshimitsu Nakamura, Naoaki Mihara, Takumi Asanuma
  • Publication number: 20150091436
    Abstract: A resin composition for sealing an organic electroluminescent element, containing: at least one epoxy compound; at least one polyester resin; and at least one Lewis acid compound or at least one compound which generates a Lewis acid, in which the content of the epoxy compound is from 10 to 200 parts by mass with respect to 100 parts by mass of the polyester resin.
    Type: Application
    Filed: December 11, 2014
    Publication date: April 2, 2015
    Applicant: FURUKAWA ELECTRIC CO., LTD.
    Inventors: Naoaki MIHARA, Kunihiko ISHIGURO, Toshimitsu NAKAMURA, Tetsuya MIEDA
  • Publication number: 20140291655
    Abstract: A resin composition for sealing an organic electroluminescent device, containing: a drying agent, and a curable component, wherein a surface roughness Ra of the shear failure surface after curing the resin composition is 0.5 ?m or more; a production method thereof; an adhesive film and a gas-barrier formed of the resin composition; an organic electroluminescent device and an organic electroluminescent panel using the same.
    Type: Application
    Filed: June 12, 2014
    Publication date: October 2, 2014
    Inventors: Toshihiro SUZUKI, Satoshi HATTORI, Tetsuya MIEDA, Hideto FUKUDA, Takanori YAMAKAWA, Toshimitsu NAKAMURA
  • Patent number: 6435675
    Abstract: A method for manufacturing an ink tank comprises the steps of supplying a container having an opening, inserting a porous member into the opening of the container in a compressed state, and holding the porous member in the compressed state by fixing a plate member to the opening of the container. The porous member is compressed more in a direction substantially orthogonal to the direction of the insertion into the opening. When compressing the porous member, the porous member is clamped in the same direction as the inserting direction so as not to allow the porous member to be deformed in the inserting direction, and in such state, the porous member is compressed in directions substantially orthogonal to the inserting direction.
    Type: Grant
    Filed: February 21, 2001
    Date of Patent: August 20, 2002
    Assignee: Canon Kabushiki Kaisha
    Inventors: Akinori Okura, Tadashi Makiguchi, Tsutomu Abe, Toshimitsu Nakamura
  • Publication number: 20010015743
    Abstract: A method for manufacturing an ink tank comprises the steps of supplying an container having an opening, inserting a porous member into the opening of the container in a state of being compressed, and holding the porous member in the compressed state by fixing a plate member to the opening of the container, and the porous member being in a compressed shape more in the direction substantially orthogonal to the direction of the insertion when the porous member is compressed in the inserting direction into the opening.
    Type: Application
    Filed: February 21, 2001
    Publication date: August 23, 2001
    Inventors: Akinori Okura, Tadashi Makiguchi, Tsutomu Abe, Toshimitsu Nakamura
  • Patent number: 4974342
    Abstract: An inner sole for a shoe which has upper and lower foot form sheets bonded through an elastic porous material to the heel of the rear portion thereof and through spaces to the front portion thereof, a suction valve provided in a portion to be bonded to the elastic porous material of the lower foot form sheet, an air feed valve provided at the front of the elastic porous material, and an air discharge hole formed at the front portion of the upper foot form sheet in such a manner that the discharge hole is communicated through an air feed passage, obtained between the spacer, with the valve hole of the suction valve. Thus, a foot is hardly moistened even if the shoe is worn for a long time.
    Type: Grant
    Filed: June 30, 1989
    Date of Patent: December 4, 1990
    Inventor: Toshimitsu Nakamura