Abstract: In a semiconductor device, a plurality of first switching element chips and a plurality of first diode chips constituting a first inverter circuit, and a plurality of second switching element chips and a plurality of second diode chips constituting a second inverter circuit are mounted on a printed wiring board incorporated into a package. At this point, a current capacity of each of the plurality of second switching element chips is greater than a current capacity of each of the plurality of first switching element chips, and a current capacity of each of the plurality of second diode chips is greater than a current capacity of each of the plurality of first diode chips.

Abstract: Provided is a power module having a sufficient space in which a large electronic component in size is disposed, and having yield strength against external stresses, such as vibrations. A power module includes: an insulating substrate; a semiconductor element mounted above the insulating substrate; a sealant sealing the insulating substrate and semiconductor element, and forming the outer shape of the power module; and a pair of terminals disposed on the sealant, in both ends of the sealant in a width direction of the power module in an upright manner. The pair of terminals are spaced from each other by a distance greater than the width of a film capacitor being a first electronic component mounted on the bottom surface of a control substrate being a circuit substrate coupled to tips of the pair of terminals. The pair of terminals are longer in a height direction than the film capacitor.

Abstract: Provided is a power module having a sufficient space in which a large electronic component in size is disposed, and having yield strength against external stresses, such as vibrations. A power module includes: an insulating substrate; a semiconductor element mounted above the insulating substrate; a sealant sealing the insulating substrate and semiconductor element, and forming the outer shape of the power module; and a pair of terminals disposed on the sealant, in both ends of the sealant in a width direction of the power module in an upright manner. The pair of terminals are spaced from each other by a distance greater than the width of a film capacitor being a first electronic component mounted on the bottom surface of a control substrate being a circuit substrate coupled to tips of the pair of terminals. The pair of terminals are longer in a height direction than the film capacitor.