Patents by Inventor Toshinari KINJO

Toshinari KINJO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of producing carrier for use in double-side polishing apparatus and method of double-side polishing wafers
    Patent number: 9764443
    Abstract: A method of producing a carrier for use in a double-side polishing apparatus, the method including engaging an insert with a holding hole formed in a carrier body and sticking the insert to the holding hole, the carrier body being configured to be disposed between upper and lower turn tables to which polishing pads are attached of the double-side polishing apparatus, the holding hole being configured to hold a wafer during polishing, the insert being configured to contact an edge of the wafer to be held, the method including: performing a lapping process and a polishing process on the insert; engaging the insert subjected to the lapping process and the polishing process with the holding hole of the carrier body; and sticking and drying the engaged insert while applying a load to the insert in a direction perpendicular to main surfaces of the carrier body.
    Type: Grant
    Filed: January 15, 2014
    Date of Patent: September 19, 2017
    Assignee: SHIN-ETSU HANDOTAI CO., LTD.
    Inventors: Kazuya Sato, Yuki Tanaka, Syuichi Kobayashi, Kenji Iha, Toshinari Kinjo
  • METHOD OF PRODUCING CARRIER FOR USE IN DOUBLE-SIDE POLISHING APPARATUS AND METHOD OF DOUBLE-SIDE POLISHING WAFERS
    Publication number: 20150375363
    Abstract: A method of producing a carrier for use in a double-side polishing apparatus, the method including engaging an insert with a holding hole formed in a carrier body and sticking the insert to the holding hole, the carrier body being configured to be disposed between upper and lower turn tables to which polishing pads are attached of the double-side polishing apparatus, the holding hole being configured to hold a wafer during polishing, the insert being configured to contact an edge of the wafer to be held, the method including: performing a lapping process and a polishing process on the insert; engaging the insert subjected to the lapping process and the polishing process with the holding hole of the carrier body; and sticking and drying the engaged insert while applying a load to the insert in a direction perpendicular to main surfaces of the carrier body.
    Type: Application
    Filed: January 15, 2014
    Publication date: December 31, 2015
    Applicant: SHIN-ETSU HANDOTAI CO., LTD.
    Inventors: Kazuya SATO, Yuki TANAKA, Syuichi KOBAYASHI, Kenji IHA, Toshinari KINJO