Patents by Inventor Toshinobu Akutagawa

Toshinobu Akutagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor relay module and semiconductor relay circuit
    Patent number: 11139815
    Abstract: A first input circuit is connected to a first input terminal and a second input terminal in a package. A second input circuit is connected to the first input terminal and the third input terminal in the package. A third input circuit is connected to the first or second input terminal and a third input terminal in the package. A first output circuit is connected to a first output terminal and a first connection line in the package. A second output circuit is connected to a second output terminal and the first connection line in the package. A third output circuit is connected to a third output terminal and the first connection line in the package.
    Type: Grant
    Filed: January 21, 2019
    Date of Patent: October 5, 2021
    Assignee: OMRON CORPORATION
    Inventor: Toshinobu Akutagawa
  • Semiconductor relay module and semiconductor relay circuit
    Patent number: 11075631
    Abstract: A semiconductor relay module includes first to third semiconductor relays, first to third input terminals, first to third output terminals, and a first connection line. A first input circuit of the first semiconductor relay and a second input circuit of the second semiconductor relay are connected to the first and second input terminals. The first and second input circuits are connected in series. A third input circuit of the third semiconductor relay is connected to the first or second input terminal and the third input terminal. A first output circuit of the first semiconductor relay is connected to the first output terminal and the first connection line. A second output circuit of the second semiconductor relay is connected to the second output terminal and the first connection line. A third output circuit of the third semiconductor relay is connected to the third output terminal and the first connection line.
    Type: Grant
    Filed: October 12, 2020
    Date of Patent: July 27, 2021
    Assignee: OMRON CORPORATION
    Inventors: Toshinobu Akutagawa, Shigenari Okada, Shinya Sasaki
  • Semiconductor relay module and semiconductor relay circuit
    Patent number: 11075630
    Abstract: A semiconductor relay module includes first to third semiconductor relays, first to third input terminals, first to third output terminals, a first connection line, and a first monitor terminal connected to the first connection line. A first input circuit of the first semiconductor relay and a second input circuit of the second semiconductor relay are connected to the first and second input terminals. A third input circuit of the third semiconductor relay is connected to the first or second input terminal and the third input terminal. A first output circuit of the first semiconductor relay is connected to the first output terminal and the first connection line. A second output circuit of the second semiconductor relay is connected to the second output terminal and the first connection line. A third output circuit of the third semiconductor relay is connected to the third output terminal and the first connection line.
    Type: Grant
    Filed: October 12, 2020
    Date of Patent: July 27, 2021
    Assignee: OMRON CORPORATION
    Inventors: Shinya Sasaki, Toshinobu Akutagawa, Shigenari Okada
  • SEMICONDUCTOR RELAY MODULE AND SEMICONDUCTOR RELAY CIRCUIT
    Publication number: 20210218397
    Abstract: A first input circuit is connected to a first input terminal and a second input terminal in a package. A second input circuit is connected to the first input terminal and the third input terminal in the package. A third input circuit is connected to the first or second input terminal and a third input terminal in the package. A first output circuit is connected to a first output terminal and a first connection line in the package. A second output circuit is connected to a second output terminal and the first connection line in the package. A third output circuit is connected to a third output terminal and the first connection line in the package.
    Type: Application
    Filed: January 21, 2019
    Publication date: July 15, 2021
    Inventor: Toshinobu AKUTAGAWA
  • Semiconductor relay module
    Patent number: 11057034
    Abstract: In a semiconductor relay module, inside a package, one of a pair of input parts of a first semiconductor relay is connected to a first input terminal, the other of the pair of input parts of the first semiconductor relay is connected to a second input terminal, one of a pair of input parts of a second semiconductor relay is connected to the second input terminal, the other of the pair of input parts of the second semiconductor relay is connected to the first input terminal, one of a pair of input parts of a third semiconductor relay is connected to a third input terminal, and the other of the pair of input parts of the third semiconductor relay is connected to the first input terminal or the second input terminal.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: July 6, 2021
    Assignee: Omron Corporation
    Inventors: Toshinobu Akutagawa, Yosuke Morimoto, Tetsuro Tsurusu
  • SEMICONDUCTOR RELAY MODULE AND SEMICONDUCTOR RELAY CIRCUIT
    Publication number: 20210135669
    Abstract: A semiconductor relay module includes first to third semiconductor relays, first to third input terminals, first to third output terminals, and a first connection line. A first input circuit of the first semiconductor relay and a second input circuit of the second semiconductor relay are connected to the first and second input terminals. The first and second input circuits are connected in series. A third input circuit of the third semiconductor relay is connected to the first or second input terminal and the third input terminal. A first output circuit of the first semiconductor relay is connected to the first output terminal and the first connection line. A second output circuit of the second semiconductor relay is connected to the second output terminal and the first connection line. A third output circuit of the third semiconductor relay is connected to the third output terminal and the first connection line.
    Type: Application
    Filed: October 12, 2020
    Publication date: May 6, 2021
    Inventors: Toshinobu AKUTAGAWA, Shigenari OKADA, Shinya SASAKI
  • SEMICONDUCTOR RELAY MODULE AND SEMICONDUCTOR RELAY CIRCUIT
    Publication number: 20210135668
    Abstract: A semiconductor relay module includes first to third semiconductor relays, first to third input terminals, first to third output terminals, a first connection line, and a first monitor terminal connected to the first connection line. A first input circuit of the first semiconductor relay and a second input circuit of the second semiconductor relay are connected to the first and second input terminals. A third input circuit of the third semiconductor relay is connected to the first or second input terminal and the third input terminal. A first output circuit of the first semiconductor relay is connected to the first output terminal and the first connection line. A second output circuit of the second semiconductor relay is connected to the second output terminal and the first connection line. A third output circuit of the third semiconductor relay is connected to the third output terminal and the first connection line.
    Type: Application
    Filed: October 12, 2020
    Publication date: May 6, 2021
    Inventors: Shinya SASAKI, Toshinobu AKUTAGAWA, Shigenari OKADA
  • SEMICONDUCTOR RELAY MODULE
    Publication number: 20200228114
    Abstract: In a semiconductor relay module, inside a package, one of a pair of input parts of a first semiconductor relay is connected to a first input terminal, the other of the pair of input parts of the first semiconductor relay is connected to a second input terminal, one of a pair of input parts of a second semiconductor relay is connected to the second input terminal, the other of the pair of input parts of the second semiconductor relay is connected to the first input terminal, one of a pair of input parts of a third semiconductor relay is connected to a third input terminal, and the other of the pair of input parts of the third semiconductor relay is connected to the first input terminal or the second input terminal.
    Type: Application
    Filed: December 22, 2017
    Publication date: July 16, 2020
    Applicant: Omron Corporation
    Inventors: Toshinobu Akutagawa, Yosuke Morimoto, Tetsuro Tsurusu