Patents by Inventor Toshinobu Akutagawa
Toshinobu Akutagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240168083Abstract: A switching device includes a base, a first DUT terminal, a first DC terminal, a first RF terminal, a first low-pass filter, and a first switching section. The first DUT terminal is a terminal for a device under test and is arranged on the base. The first DC terminal is a terminal for a DC test and is arranged on the base. The first RF terminal is a terminal for an RF test and is arranged on the base. The first low-pass filter is connected to the first DUT terminal and the first DC terminal. The first switching section is switchable between an on state and an off state. The first switching section electrically connects the first DUT terminal and the first RF terminal in the on state. The first switching section electrically disconnects the first DUT terminal and the first RF terminal in the off state.Type: ApplicationFiled: October 16, 2023Publication date: May 23, 2024Inventors: Tetsuro TSURUSU, Toshinobu AKUTAGAWA
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Patent number: 11139815Abstract: A first input circuit is connected to a first input terminal and a second input terminal in a package. A second input circuit is connected to the first input terminal and the third input terminal in the package. A third input circuit is connected to the first or second input terminal and a third input terminal in the package. A first output circuit is connected to a first output terminal and a first connection line in the package. A second output circuit is connected to a second output terminal and the first connection line in the package. A third output circuit is connected to a third output terminal and the first connection line in the package.Type: GrantFiled: January 21, 2019Date of Patent: October 5, 2021Assignee: OMRON CORPORATIONInventor: Toshinobu Akutagawa
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Patent number: 11075630Abstract: A semiconductor relay module includes first to third semiconductor relays, first to third input terminals, first to third output terminals, a first connection line, and a first monitor terminal connected to the first connection line. A first input circuit of the first semiconductor relay and a second input circuit of the second semiconductor relay are connected to the first and second input terminals. A third input circuit of the third semiconductor relay is connected to the first or second input terminal and the third input terminal. A first output circuit of the first semiconductor relay is connected to the first output terminal and the first connection line. A second output circuit of the second semiconductor relay is connected to the second output terminal and the first connection line. A third output circuit of the third semiconductor relay is connected to the third output terminal and the first connection line.Type: GrantFiled: October 12, 2020Date of Patent: July 27, 2021Assignee: OMRON CORPORATIONInventors: Shinya Sasaki, Toshinobu Akutagawa, Shigenari Okada
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Patent number: 11075631Abstract: A semiconductor relay module includes first to third semiconductor relays, first to third input terminals, first to third output terminals, and a first connection line. A first input circuit of the first semiconductor relay and a second input circuit of the second semiconductor relay are connected to the first and second input terminals. The first and second input circuits are connected in series. A third input circuit of the third semiconductor relay is connected to the first or second input terminal and the third input terminal. A first output circuit of the first semiconductor relay is connected to the first output terminal and the first connection line. A second output circuit of the second semiconductor relay is connected to the second output terminal and the first connection line. A third output circuit of the third semiconductor relay is connected to the third output terminal and the first connection line.Type: GrantFiled: October 12, 2020Date of Patent: July 27, 2021Assignee: OMRON CORPORATIONInventors: Toshinobu Akutagawa, Shigenari Okada, Shinya Sasaki
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Publication number: 20210218397Abstract: A first input circuit is connected to a first input terminal and a second input terminal in a package. A second input circuit is connected to the first input terminal and the third input terminal in the package. A third input circuit is connected to the first or second input terminal and a third input terminal in the package. A first output circuit is connected to a first output terminal and a first connection line in the package. A second output circuit is connected to a second output terminal and the first connection line in the package. A third output circuit is connected to a third output terminal and the first connection line in the package.Type: ApplicationFiled: January 21, 2019Publication date: July 15, 2021Inventor: Toshinobu AKUTAGAWA
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Patent number: 11057034Abstract: In a semiconductor relay module, inside a package, one of a pair of input parts of a first semiconductor relay is connected to a first input terminal, the other of the pair of input parts of the first semiconductor relay is connected to a second input terminal, one of a pair of input parts of a second semiconductor relay is connected to the second input terminal, the other of the pair of input parts of the second semiconductor relay is connected to the first input terminal, one of a pair of input parts of a third semiconductor relay is connected to a third input terminal, and the other of the pair of input parts of the third semiconductor relay is connected to the first input terminal or the second input terminal.Type: GrantFiled: December 22, 2017Date of Patent: July 6, 2021Assignee: Omron CorporationInventors: Toshinobu Akutagawa, Yosuke Morimoto, Tetsuro Tsurusu
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Publication number: 20210135669Abstract: A semiconductor relay module includes first to third semiconductor relays, first to third input terminals, first to third output terminals, and a first connection line. A first input circuit of the first semiconductor relay and a second input circuit of the second semiconductor relay are connected to the first and second input terminals. The first and second input circuits are connected in series. A third input circuit of the third semiconductor relay is connected to the first or second input terminal and the third input terminal. A first output circuit of the first semiconductor relay is connected to the first output terminal and the first connection line. A second output circuit of the second semiconductor relay is connected to the second output terminal and the first connection line. A third output circuit of the third semiconductor relay is connected to the third output terminal and the first connection line.Type: ApplicationFiled: October 12, 2020Publication date: May 6, 2021Inventors: Toshinobu AKUTAGAWA, Shigenari OKADA, Shinya SASAKI
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Publication number: 20210135668Abstract: A semiconductor relay module includes first to third semiconductor relays, first to third input terminals, first to third output terminals, a first connection line, and a first monitor terminal connected to the first connection line. A first input circuit of the first semiconductor relay and a second input circuit of the second semiconductor relay are connected to the first and second input terminals. A third input circuit of the third semiconductor relay is connected to the first or second input terminal and the third input terminal. A first output circuit of the first semiconductor relay is connected to the first output terminal and the first connection line. A second output circuit of the second semiconductor relay is connected to the second output terminal and the first connection line. A third output circuit of the third semiconductor relay is connected to the third output terminal and the first connection line.Type: ApplicationFiled: October 12, 2020Publication date: May 6, 2021Inventors: Shinya SASAKI, Toshinobu AKUTAGAWA, Shigenari OKADA
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Publication number: 20200228114Abstract: In a semiconductor relay module, inside a package, one of a pair of input parts of a first semiconductor relay is connected to a first input terminal, the other of the pair of input parts of the first semiconductor relay is connected to a second input terminal, one of a pair of input parts of a second semiconductor relay is connected to the second input terminal, the other of the pair of input parts of the second semiconductor relay is connected to the first input terminal, one of a pair of input parts of a third semiconductor relay is connected to a third input terminal, and the other of the pair of input parts of the third semiconductor relay is connected to the first input terminal or the second input terminal.Type: ApplicationFiled: December 22, 2017Publication date: July 16, 2020Applicant: Omron CorporationInventors: Toshinobu Akutagawa, Yosuke Morimoto, Tetsuro Tsurusu