Abstract: The present invention provides a sputtering cathode whereby it is possible to increase the degree of freedom to adjust a distance between a target and a magnet unit. A sputtering cathode in accordance with one embodiment of the present invention includes a plurality of magnet units arranged at positions opposite to the rear surface of the target and a distance adjusting mechanism for separately adjusting a distance between the target and a magnet unit for each magnet unit. In addition, the sputtering cathode includes a reciprocating movement mechanism for reciprocating a plurality of magnet units in parallel to the rear surface of the target. The plurality of magnet units, the distance adjusting mechanism and the reciprocating movement mechanism may be housed in a magnet chamber that can be evacuated.

Abstract: The present invention provides a sputtering apparatus and a method of thin film formation, whereby a film having quality superior in uniformity even for relatively large substrates can be obtained and the generation of particles and nodules is suppressed. The sputtering apparatus of the present invention includes: a vacuum vessel (9); a substrate holder (7) for supporting a substrate (6); a cathode mechanism located opposite to the substrate (6); and a second gas introduction mechanism for introducing a gas into the vacuum vessel (9). The cathode mechanism has a plurality of targets (1a) to (1c) arranged with a gap formed between each other and a plurality of backing plates (2a) to (2c) arranged with a gap formed between each other. A gap (14) between each of the targets is smaller than a gap (15) between each of the backing plates. In addition, the gap (14) overlaps with at least part of the gap (15). The second gas introduction mechanism introduces a gas through the gap (15) and the gap (14).

Abstract: The present invention provides a sputtering cathode whereby it is possible to increase the degree of freedom to adjust a distance between a target and a magnet unit. A sputtering cathode in accordance with one embodiment of the present invention includes a plurality of magnet units arranged at positions opposite to the rear surface of the target and a distance adjusting mechanism for separately adjusting a distance between the target and a magnet unit for each magnet unit. In addition, the sputtering cathode includes a reciprocating movement mechanism for reciprocating a plurality of magnet units in parallel to the rear surface of the target. The plurality of magnet units, the distance adjusting mechanism and the reciprocating movement mechanism may be housed in a magnet chamber that can be evacuated.