Abstract: In projecting a pattern formed on a mask onto a substrate by using a progressive focus exposure method and transferring/forming an image of the pattern on a substrate, a control unit changes the distribution of energy amounts supplied onto the substrate based on the relative positions of the imaging plane and the substrate surface, and the integrated energy amount supplied onto the substrate in accordance with the position of an irradiation area on the substrate surface which is irradiated with an energy beam through the projection optical system. With this operation, in accordance with information about the distribution of variations in resist layer thickness on the substrate, which is obtained in advance, at least one of the distribution of energy amounts and the integrated energy, which reduce the influences of this distribution, can be changed.

Abstract: A display unit (22) displays a shot map, and an operator designates an evaluation point on the shot map. A exposure control unit (21) computes the position coordinates on a projection area (on a plate) corresponding to the designated evaluation point, and outputs the result to the display unit (22). When an overlapping portion is detected in a pattern exposed onto the substrate (6), and an evaluation point is designated on the overlapping portion, the exposure control unit (21) outputs corresponding pattern candidates, and the operator can select a desired pattern from among the candidates. Furthermore, when one point is designated on a shot map, two points containing a pattern boundary are automatically indicated as evaluation points. Thus, an evaluation point can be designated, and the position on the plate can be correctly obtained within a short time, thereby improving the operation efficiency of the apparatus.

Abstract: When alignment marks, which have been previously formed on a substrate corresponding to each of two orthogonal axial directions, are detected by a microscope, a main control unit detects positions and numbers of the respective marks, and calculates stretching degrees of the substrate in the two orthogonal axial directions respectively on the basis of information on the detected positions of specified marks and information on designed positions of the specified marks. The main control unit determines a mean value of the stretching degrees by weighting each of the calculated stretching degrees in the two orthogonal axial directions in accordance with the detected numbers of the marks corresponding to each of the two orthogonal axial directions so that the determined weighted mean value of the stretching degrees is set as a magnification correction value.

Abstract: Positions of a plurality of marks formed in a correction mask are measured as first positions. A plurality of marks in the correction mask are transferred onto a photosensitive substrate, and transferred positions of the plurality of marks are determined as second positions. Subsequently, amounts of deviation of the first positions from the second positions are determined as correction data. After that, positions of a plurality of marks formed in an exposure mask are measured as third positions by a method similar to that used for measurement of the first positions, and the third positions are corrected on the basis of the correction data.

Abstract: An exposure device sequentially transfers a pattern formed in a mask onto connected multiple regions present consecutively on a substrate through a projection optical system. The device includes a substrate stage moving in two dimensions and carrying the substrate in a movement coordinate system determined by a first axis and a mutually perpendicular second axis. A mark detecting sensor detects positions of alignment marks formed on the substrate. A magnification adjustment device corrects the magnification of the projection optical system. At least one calculating device is used to separately calculate extension amounts of the substrate in the direction of the first axis and in the direction of the second axis based on information relating to the positions of the alignment marks detected by the mark detecting sensor.