Abstract: The solid-state imaging device includes: a first node for receiving a first signal from outside the solid-state imaging device; a second node for receiving a second signal from outside the solid-state imaging device; a test signal selection circuit for outputting the first signal received at the first node and the second signal received at the second node as a test signal by switching between the first and second signals at desired timing; and a test signal input circuit for supplying the test signal from the test signal selection circuit to an input of the A/D converter.

Abstract: The solid-state imaging device includes: a first node for receiving a first signal from outside the solid-state imaging device; a second node for receiving a second signal from outside the solid-state imaging device; a test signal selection circuit for outputting the first signal received at the first node and the second signal received at the second node as a test signal by switching between the first and second signals at desired timing; and a test signal input circuit for supplying the test signal from the test signal selection circuit to an input of the A/D converter.

Abstract: A scan test circuit is provided with a scan chain having n pieces of scan storage elements (n: integer, n>1); a scan clock generation circuit which is able to control a frequency of a first clock to be used for shifting data into the first to (n?1)th scan storage elements, and a frequency of a second clock to be used for shifting data into the n-th scan storage element and performing actual operation, independently from each other; and a scan selection internal signal generation circuit for generating a scan selection internal signal that is synchronized with the second clock.

Abstract: A scan test circuit is provided with a scan chain having n pieces of scan storage elements (n: integer, n>1); a scan clock generation circuit which is able to control a frequency of a first clock to be used for shifting data into the first to (n>1)th scan storage elements, and a frequency of a second clock to be used for shifting data into the n-th scan storage element and performing actual operation, independently from each other; and a scan selection internal signal generation circuit for generating a scan selection internal signal that is synchronized with the second clock.

Abstract: A method of injecting adhesives (7) into cracks (2) of structures (1) for sealing the cracks, involves affixing injection pipes (4) on non-sealed surface portions of the structures at the cracks and connecting an adhesives injection device (10) to each one of the injection pipes. The injection devices are comprised of transparent cylinders having scales thereon graduated toward injection, nozzles (17) thereof, and of pistons (13) which can move linearly in both directions in the cylinders. The nozzles are respectively connected to the injection pipes after adhesives are drawn into the cylinders, and the pistons are moved toward the nozzles by compression, or pushing pressure, of rubber or springs to inject the adhesives into the cracks.