Abstract: A semiconductor device includes a radiation plate, first and second conductive patterns formed on one surface of the radiation plate, a first semiconductor element fixed on and connected to the first conductive pattern, a second semiconductor element fixed on and connected to the second conductive pattern, a conductive member for connecting the first and second semiconductor elements to each other, a first external terminal electrically connected to the first conductive pattern, a second external terminal electrically connected to the second conductive pattern, a third external terminal electrically connected to the conductive member, and an outer casing, which is filled with epoxy resin, for enclosing the semiconductor elements and the first to third external terminals. Part of each of the first to third external terminals is exposed to an exterior of the casing. At least one of the conductive member, first external terminal, second external terminal, and third external terminal includes a hollow fuse.

Abstract: A semiconductor device includes a radiation plate, first and second conductive patterns formed on one surface of the radiation plate, a first semiconductor element fixed on and connected to the first conductive pattern, a second semiconductor element fixed on and connected to the second conductive pattern, a conductive member for connecting the first and second semiconductor elements to each other, a first external terminal electrically connected to the first conductive pattern, a second external terminal electrically connected to the second conductive pattern, a third external terminal electrically connected to the conductive member, and an outer casing, which is filled wiht epoxy resin, for enclosing the semiconductor elements and the first to third external terminals. Part of each of the first to third external terminals is exposed to an exterior of the casing. At least one of the conductive member, first external terminal, second external terminal, and third external terminal includes a hollow fuse.

Abstract: A semiconductor rectifier device includes a heat-radiating substrate, a flame-sprayed insulating layer formed directly on a surface of the substrate, at least one first flame-sprayed metal layer selectively formed on the surface of the radiation substrate, and a second metal layer selectively formed on the flame-sprayed insulating layer. A rectifying circuit has first and second rectifying elements which are electrically coupled, respectively, at terminals of opposite polarities, with the first flame-sprayed metal layer and the second flame-sprayed metal layer. An electrode electrically connects the terminals of the rectifying elements having polarities opposite to those of the terminals connected to the first and second flame-sprayed layers.

Abstract: A semiconductor device has a sprayed metal layer formed by a method such as plasma spraying on a metal substrate of a material such as aluminum, and a semiconductor element attached to the sprayed metal layer by soldering. A sprayed insulting layer may be interposed between the sprayed metal layer and the metal substrate for electrically insulating the element from the substrate.

Abstract: A semiconductor device includes a semiconductor element having at least three semiconductor areas corresponding to first, second and third semiconductor areas, a first electrode connecting means comprising a cylindrical stud electrically connected to the first semiconductor area of the semiconductor element, and second and third electrode connecting means connected to the closed end of a housing in a position deviated from the axis of the cylindrical stud. The second electrode connecting means has a cylindrical section situated concentric with the cylindrical stud and including a free end, and includes a through hole extending from a side surface thereof toward the free end while passing through the center of the cylindrical section. The third electrode connecting means comprising a flexible lead and it is received in the through hole of the second electrode connecting means.