Patents by Inventor Toshinori Ishida

Toshinori Ishida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240101491
    Abstract: The present invention adopts a microbial preparation production method comprising: a step for mixing crushed waste gypsum with a culture medium containing microorganisms to obtain a mixed liquid; and a step for culturing the mixed liquid. The particle diameter of the crushed waste gypsum is at most 30 mm.
    Type: Application
    Filed: November 30, 2023
    Publication date: March 28, 2024
    Inventors: Yohei ISHIDA, Tamaki GOTO, Katsuhiko FUJII, Toshinori OKURA
  • Patent number: 10495260
    Abstract: A safety valve system includes a main valve that includes an introduction port into which pressure from a tank is introduced, and a release port to release the pressure; a high-pressure side pilot valve and a low-pressure side pilot valve that are set to mutually different operating pressure values and that release pressure by making the introduction port and the release port communicate with each other when the pressure exceeds the operating pressure value; and a switching unit that switches so that only the low-pressure side pilot valves, which excludes the high-pressure side pilot valve with the highest operating pressure value, do not operate.
    Type: Grant
    Filed: May 30, 2016
    Date of Patent: December 3, 2019
    Assignee: MITSUBISHI SHIPBUILDING CO., LTD.
    Inventor: Toshinori Ishida
  • Publication number: 20180172213
    Abstract: A safety valve system includes a main valve that includes an introduction port into which pressure from a tank is introduced, and a release port to release the pressure; a high-pressure side pilot valve and a low-pressure side pilot valve that are set to mutually different operating pressure values and that release pressure by making the introduction port and the release port communicate with each other when the pressure exceeds the operating pressure value; and a switching unit that switches so that only the low-pressure side pilot valves, which excludes the high-pressure side pilot valve with the highest operating pressure value, do not operate.
    Type: Application
    Filed: May 30, 2016
    Publication date: June 21, 2018
    Inventor: Toshinori ISHIDA
  • Patent number: 7154926
    Abstract: Submount substrates are connected to both sides of a laser diode via hard solders. The lower submount substrate and a heat sink are connected together by a soft solder. The heat sink and a presser electrode are fixed with a predetermined gap therebetween via an insulating spacer. A coil electrode is fitted in a V-shaped groove of the presser electrode. As the coil electrode is deformed slightly elastically, the coil electrode is pressed against the upper submount substrate.
    Type: Grant
    Filed: September 17, 2004
    Date of Patent: December 26, 2006
    Assignee: Laserfront Technologies, Inc.
    Inventors: Hikaru Kouta, Hisaya Takahashi, Hideyuki Ono, Yuuzou Ikeda, Masaki Tunekane, Toshinori Ishida, Keiichi Kubota
  • Publication number: 20060215715
    Abstract: A pair of opening portions are provided as an inlet port of refrigerant and an outlet port thereof, and refrigerant flow channels are formed left-right symmetrically in its plan view from one opening portion to the other opening portion. At the area adjusted to the area which is thermally connected to the heating element in the refrigerant flow channels, projections whose cross section thereof become smaller and smaller upward from the bottom surface of the refrigerant flow channels or downward from the upper surface, that is, widens toward the end, are formed. By joining the heat radiating plate having the projections formed therein to the other heat radiating plate, which is plate-shaped, together, a heat sink is assembled. Therefore, the heat sinks are excellent in terms of thermal conductivity and reliability, are produced at a low cost, and a laser module employing the same, a laser module apparatus, and a laser processing apparatus are obtainable.
    Type: Application
    Filed: February 18, 2004
    Publication date: September 28, 2006
    Inventors: Hikaru Kouta, Hisaya Takahashi, Kazuyuki Mikubo, Hideyuki Ono, Masaki Tsunekane, Toshinori Ishida, Keiichi Kubota
  • Publication number: 20050069266
    Abstract: Submount substrates are connected to both sides of a laser diode via hard solders. The lower submount substrate and a heat sink are connected together by a soft solder. The heat sink and a presser electrode are fixed with a predetermined gap therebetween via an insulating spacer. A coil electrode is fitted in a V-shaped groove of the presser electrode. As the coil electrode is deformed slightly elastically, the coil electrode is pressed against the upper submount substrate.
    Type: Application
    Filed: September 17, 2004
    Publication date: March 31, 2005
    Inventors: Hikaru Kouta, Hisaya Takahashi, Hideyuki Ono, Yuuzou Ikeda, Masaki Tunekane, Toshinori Ishida, Keiichi Kubota