Abstract: An operation position locating system locates a position on a product where an operation is performed in a manufacturing process of the product including one or more operations to be performed. The system includes an operation completion coordinates detection unit and an operation position locating unit. The operation completion coordinates detection unit processes a plurality of images obtained by capturing from a plurality of viewpoints a range including an operation completion position where an operation is completed when the operation is completed, thereby detecting a set of operation completion coordinates representing the operation completion position.

Abstract: A cleaning apparatus includes: a supply unit to supply at least an initial amount of cleaning solution to a specific portion of an object to be cleaned; an agitator to induce agitation in the cleaning solution supplied to the object; a monitoring unit to monitor an amount of the cleaning solution and to provide a signal indicative thereof; and a control unit to detect a threshold amount of reduction in the cleaning solution based on the signal from the monitoring unit and accordingly to control the supply unit to supply an additional amount of cleaning solution to the specific portion of the object.

Abstract: A cleaning apparatus includes a supply unit to supply at least an initial amount of cleaning solution to a specific portion of an object to be cleaned, an agitator to induce agitation in the cleaning solution supplied to the object, an oscillating unit to oscillate the agitator, a drive unit to move any one of the object and the agitator so as to change a clearance between the object and the agitator, a detection unit to detect impedance of the oscillator, and a control unit to control the clearance by controlling the drive unit based on the impedance.

Abstract: An ultrasonic bonding apparatus includes an ultrasonic bonding unit, and a wiping unit configured to wipe out pre-cured underfill that has adhered to a tool surface of a head, by using a wiping member. The ultrasonic bonding unit includes a first driver configured to drive the head to press an electronic component upon a substrate, and an ultrasonic generator. The wiping unit includes a wiping table used to wipe out the tool surface, a feed mechanism configured to supply a wiping member to the wiping table and to roll up the wiping member, a cartridge configured to house the wiping table and the feed mechanism, and a second driver configured to drive the cartridge in the plane. The first driver is configured to press the head upon the wiping member on the wiping table.

Abstract: An ultrasonic bonding apparatus for manufacturing an electronic device that includes a substrate, an electronic component, and an underfill filled between the electronic component and the substrate includes a head that includes a tool surface configured to mount the electronic component, a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with the substrate and to press the head against the wiping member on the wiping table, a detector configured to detect a first pressure applied between the wiping member on the wiping table and the tool surface when the wiping unit provides wiping, and a controller configured to control a second pressure applied by the ultrasonic bonding unit, based on a detection result by the detector.

Abstract: A cleaning apparatus includes: a supply unit to supply at least an initial amount of cleaning solution to a specific portion of an object to be cleaned; an agitator to induce agitation in the cleaning solution supplied to the object; a monitoring unit to monitor an amount of the cleaning solution and to provide a signal indicative thereof; and a control unit to detect a threshold amount of reduction in the cleaning solution based on the signal from the monitoring unit and accordingly to control the supply unit to supply an additional amount of cleaning solution to the specific portion of the object.

Abstract: An ultrasonic bonding apparatus includes a head that includes a tool surface configured to mount an electronic component, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with a substrate, and a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table. The wiping unit includes a solvent supply unit configured to supply a solvent configured to powder the underfill, to the wiping member on the wiping table, a sealed cartridge configured to house the wiping table and a feed mechanism configured to supply the wiping member to the wiping table and to roll up the wiping member from the wiping table, and a cartridge support member that includes a motor configured to drive the feed mechanism, and is detachably attached to the cartridge.

Abstract: A position measuring apparatus includes a distance measuring part which obtains at least three pieces of distance information between at least three measurement points on a measured plane of an object and a displacement sensor, an imaging part which images a projection image on the measured plane of the object, and a calculating part which obtains tilt information of the measured plane based on the at least three distance information pieces and obtains position information of the object based on the tilt information and the projection image.

Abstract: An ultrasonic bonding apparatus includes an ultrasonic bonding unit, and a wiping unit configured to wipe out pre-cured underfill that has adhered to a tool surface of a head, by using a wiping member. The ultrasonic bonding unit includes a first driver configured to drive the head to press an electronic component upon a substrate, and an ultrasonic generator. The wiping unit includes a wiping table used to wipe out the tool surface, a feed mechanism configured to supply a wiping member to the wiping table and to roll up the wiping member, a cartridge configured to house the wiping table and the feed mechanism, and a second driver configured to drive the cartridge in the plane. The first driver is configured to press the head upon the wiping member on the wiping table.

Abstract: An ultrasonic bonding apparatus includes a head that includes a tool surface configured to mount an electronic component, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with a substrate, and a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table. The wiping unit includes a solvent supply unit configured to supply a solvent configured to powder the underfill, to the wiping member on the wiping table, a sealed cartridge configured to house the wiping table and a feed mechanism configured to supply the wiping member to the wiping table and to roll up the wiping member from the wiping table, and a cartridge support member that includes a motor configured to drive the feed mechanism, and is detachably attached to the cartridge.

Abstract: An ultrasonic bonding apparatus for manufacturing an electronic device that includes a substrate, an electronic component, and an underfill filled between the electronic component and the substrate includes a head that includes a tool surface configured to mount the electronic component, a wiping unit configured to wipe out pre-cured underfill that has adhered to the tool surface of the head, by using a wiping member on a wiping table, an ultrasonic bonding unit configured to ultrasonically bond the electronic component with the substrate and to press the head against the wiping member on the wiping table, a detector configured to detect a first pressure applied between the wiping member on the wiping table and the tool surface when the wiping unit provides wiping, and a controller configured to control a second pressure applied by the ultrasonic bonding unit, based on a detection result by the detector.

Abstract: A resonator 1 of the present invention includes: a vibrating member 13 holding an electronic component 12 and applying a vibration to the electronic component 12; and a depressing member 15 applying a depressing force for a side of a substrate 11 to the electronic component 12 through the vibrating member 13. The depressing member 15 includes: leg portions 15b which are disposed so as to leave spaces between the leg portions and both side faces 13a of the vibrating member 13 parallel with a vibration direction A; and supporting portions 15c through which the leg portions 15b and the side faces 13a of the vibrating member 13 are to be coupled to each other. With respect to a size of a cross section of each of the supporting portions 15c parallel with the side face 13a of the vibrating member 13, a length L2 along the vibration direction A of the vibrating member 13 is shorter than a length L1 along a depressing direction B of the depressing member 15.

Abstract: An operation position locating system locates a position on a product where an operation is performed in a manufacturing process of the product including one or more operations to be performed. The system includes an operation completion coordinates detection unit and an operation position locating unit. The operation completion coordinates detection unit processes a plurality of images obtained by capturing from a plurality of viewpoints a range including an operation completion position where an operation is completed when the operation is completed, thereby detecting a set of operation completion coordinates representing the operation completion position.

Abstract: A resonator is disclosed that may includes a vibrating member holding an electronic component and applying a vibration to the electronic component, and a depressing member applying a depressing force for a side of a substrate to the electronic component through the vibrating member. The depressing member includes leg portions which are disposed so as to leave spaces between the leg portions and both side faces of the vibrating member parallel with a vibration direction, and supporting portions through which the leg portions and the side faces of the vibrating member are to be coupled to each other. With respect to a size of a cross section of each of the supporting portions parallel with the side face of the vibrating member, a length L2 along the vibration direction A of the vibrating member is shorter than a length L1 along a depressing direction B of the depressing member.

Abstract: A resonator 15 includes: a main shaft 12 that is coupled to an ultrasonic vibrator 11 and extends in an advancement direction of an ultrasonic wave generated from the ultrasonic vibrator 11; and protrusions 13a and 13b protruding in a direction intersecting a longitudinal direction from a center plane Lc in the longitudinal direction of the main shaft 11, wherein a plurality of holes 41a, 41b are formed symmetrically with respect to a central plane Lc in the longitudinal direction of the main shaft 12, inside a section substantially orthogonal to a protruding direction of the protrusions 13a and 13b in the vicinity of the center in the longitudinal direction of the main shaft 12 from which the protrusions 13a, 13b protrude.

Abstract: A resonator 15 includes: a main shaft 12 that is coupled to an ultrasonic vibrator 11 and extends in an advancement direction of an ultrasonic wave generated from the ultrasonic vibrator 11; and protrusions 13a and 13b protruding in a direction intersecting a longitudinal direction from a center plane Lc in the longitudinal direction of the main shaft 11, wherein a plurality of holes 41a, 41b are formed symmetrically with respect to a central plane Lc in the longitudinal direction of the main shaft 12, inside a section substantially orthogonal to a protruding direction of the protrusions 13a and 13b in the vicinity of the center in the longitudinal direction of the main shaft 12 from which the protrusions 13a, 13b protrude.

Abstract: A vibration extraction processing unit extracts a deflection component synchronous with a rotation from a clock signal of a non-contact sensor so as to correct a clock jitter. A clock generating unit generates a clock signal of any format frequency preliminarily set up according to the clock signal from the vibration extraction processing unit. A sector correction processing unit measures an error due to the frequency deflection so as to correct the writing start position for the format pattern signal of each sector containing a servo frame signal stored in a memory according to the measured error. Writing processing units read out the corrected format pattern signal from the memory according to a synchronous signal corresponding to a single turn of a disc and a format frequency clock signal and then writes into a disc medium face.

Abstract: An oscillating apparatus includes a driver generating a waveform signal based on a stored data for specifying a waveform so as to output the waveform signal to a transducer. A detector detects a phase difference between electric voltage and current supplied to the transducer. A memory unit holds gain data reflecting a characteristic of the transducer. The gain data specify gains corresponding to respective phase differences. An arithmetic unit calculates the frequency of the waveform based on the phase difference detected at the detector and a gain included in the gain data. The oscillating apparatus enables determination of a gain suitable to the transducer in view of the characteristic of the transducer. The frequency of the waveform signal is allowed to follow the change in the resonant frequency in a shorter period. The oscillation can thus be kept well.

Abstract: An oscillating apparatus includes a driver generating a waveform signal based on a stored data for specifying a waveform so as to output the waveform signal to a transducer. A detector detects a phase difference between electric voltage and current supplied to the transducer. A memory unit holds gain data reflecting a characteristic of the transducer. The gain data specify gains corresponding to respective phase differences. An arithmetic unit calculates the frequency of the waveform based on the phase difference detected at the detector and a gain included in the gain data. The oscillating apparatus enables determination of a gain suitable to the transducer in view of the characteristic of the transducer. The frequency of the waveform signal is allowed to follow the change in the resonant frequency in a shorter period. The oscillation can thus be kept well.

Abstract: A resonator 1 of the present invention includes: a vibrating member 13 holding an electronic component 12 and applying a vibration to the electronic component 12; and a depressing member 15 applying a depressing force for a side of a substrate 11 to the electronic component 12 through the vibrating member 13. The depressing member 15 includes: leg portions 15b which are disposed so as to leave spaces between the leg portions and both side faces 13a of the vibrating member 13 parallel with a vibration direction A; and supporting portions 15c through which the leg portions 15b and the side faces 13a of the vibrating member 13 are to be coupled to each other. With respect to a size of a cross section of each of the supporting portions 15c parallel with the side face 13a of the vibrating member 13, a length L2 along the vibration direction A of the vibrating member 13 is shorter than a length L1 along a depressing direction B of the depressing member 15.