Abstract: An information processing system includes an identification unit configured to identify unique information on shoes using at least part of a captured image of the shoes, and a setting unit configured to set an association between an acquisition device configured to acquire the unique information and a module device attached to the shoes based on the unique information.

Abstract: An electronic component (1) is provided with a circuit board (2) having a plurality of electrodes on the upper and lower planes of an insulating substrate, and a circuit element (7) fixed to the upper plane of the circuit board (2). The electronic component is also provided with an upper electrode (4) whereupon a circuit element (7) is to be arranged; a through hole (13) penetrating the insulating substrate (12); and a lower electrode (15), which is formed on the lower side ranging from a first side end (20A) of the circuit board (2) to a sectional side end (20B) facing the first side end (20A) and carries electricity to the upper electrode (4) through the through hole (13).

Abstract: In an electronic component (1), a frame (3) composed of a conductor is fixed on a circumference portion on the upper surface of a circuit board (2). The circuit board (2) and the frame (3) have a side surface (41) composed of a same surface, and the circuit board (2) is provided with terminal sections (16, 17) exposed on the side surface (41). The frame (3) has an empty space (22) over a lower surface facing the circuit board (2) and a side surface (20). The empty space (22) may be filled with an insulating material.

Abstract: A light emitting element includes: a box-shaped case formed by an insulation material and having a space inside; a lead frame formed by a conductive material and fixed to the case; and a light emitting chip fixed to the lead frame. On the lead frame, a rise portion is formed in a side wall of the case or along the inner surface of the side wall. The lead frame has a first lead frame fixing the light emitting chip and a second lead frame connected to the light emitting chip by the wire bonding. At least on the first lead frame, a rise portion is formed.

Abstract: A light emitting element includes: a box-shaped case formed by an insulation material and having a space inside; a lead frame formed by a conductive material and fixed to the case; and a light emitting chip fixed to the lead frame. On the lead frame, a rise portion is formed in a side wall of the case or along the inner surface of the side wall. The lead frame has a first lead frame fixing the light emitting chip and a second lead frame connected to the light emitting chip by the wire bonding. At least on the first lead frame, a rise portion is formed.