Patents by Inventor Toshinori Ozaki

Toshinori Ozaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240148664
    Abstract: Provided are a lipid and a composition that can effectively deliver an introduction compound such as a nucleic acid to a target cell, tissue, or the like in vivo.
    Type: Application
    Filed: April 11, 2022
    Publication date: May 9, 2024
    Applicants: SOGO PHARMACEUTICAL CO., LTD., SHIZUOKA PREFECTURAL UNIVERSITY CORPORATION
    Inventors: Tetsuo KOANA, Jun HAYASHIDA, Toshinori TAKAKI, Yohei TANAKA, Nahoko OZAKI, Tomohiro ASAI
  • Patent number: 7985556
    Abstract: Screening methods for determining pro-apoptotic compounds or anti-apoptotic compounds comprise measuring the interaction between p53 and NEDL1 in the presence and in the absence of a test compound, and comparing the strength of interaction between p53 and NEDL1 in the presence and in the absence of the test compound.
    Type: Grant
    Filed: August 9, 2006
    Date of Patent: July 26, 2011
    Assignees: Hisamitsu Pharmaceutical Co., Inc., Chiba Prefecture
    Inventors: Akira Nakagawara, Toshinori Ozaki
  • Publication number: 20100279312
    Abstract: Screening methods for determining pro-apoptotic compounds or anti-apoptotic compounds comprise measuring the interaction between p53 and NEDL1 in the presence and in the absence of a test compound, and comparing the strength of interaction between p53 and NEDL1 in the presence and in the absence of the test compound.
    Type: Application
    Filed: August 9, 2006
    Publication date: November 4, 2010
    Applicants: HISAMITSU PHARMACEUTICAL CO., INC, CHIBA-PREFECTURE
    Inventors: Akira Nakagawara, Toshinori Ozaki
  • Patent number: 7625711
    Abstract: The present invention provides a novel drug/agent for the prevention and/or treatment of Alzheimer's disease based on a different Alzheimer's disease onset mechanism from the amyloid hypothesis, and a method of screening for it.
    Type: Grant
    Filed: September 6, 2004
    Date of Patent: December 1, 2009
    Assignee: Hisamitsu Pharmaceutical Co., Inc.
    Inventors: Akira Nakagawara, Toshinori Ozaki
  • Patent number: 7618787
    Abstract: A method for screening a pro-apoptotic compound comprising a determination step of determining a compound enhancing interaction between p73 and IKK-? as a pro-apoptotic compound.
    Type: Grant
    Filed: March 23, 2005
    Date of Patent: November 17, 2009
    Assignees: Hisamitsu Pharmaceutical Co., Inc., Chiba-Prefecture
    Inventors: Akira Nakagawara, Toshinori Ozaki
  • Publication number: 20080032320
    Abstract: A method for screening a pro-apoptotic compound comprising a determination step of determining a compound enhancing interaction between p73 and IKK-? as a pro-apoptotic compound.
    Type: Application
    Filed: March 23, 2005
    Publication date: February 7, 2008
    Inventors: Akira Nakagawara, Toshinori Ozaki
  • Publication number: 20070218031
    Abstract: The present invention provides a novel drug/agent for the prevention and/or treatment of Alzheimer's disease based on a different Alzheimer's disease onset mechanism from the amyloid hypothesis, and a method of screening for it.
    Type: Application
    Filed: September 6, 2004
    Publication date: September 20, 2007
    Inventors: Akira Nakagawara, Toshinori Ozaki
  • Patent number: 4942452
    Abstract: A lead frame and a semiconductor device wherein a through hole is formed in the center of a semiconductor chip-mounting surface of a chip pad at the center of the lead frame, the through hole being tapered or being one which corresponds to a surface area that is greater on the surface of the chip-mounting surface of the chip pad than on the surface of the side opposite to the chip-mounting surface thereof. This prevents the occurrence of cracks in the sealing plastic portion in the step of reflow soldering of the lead frame to the substrate.
    Type: Grant
    Filed: February 22, 1988
    Date of Patent: July 17, 1990
    Assignee: Hitachi, Ltd.
    Inventors: Makoto Kitano, Sueo Kawai, Asao Nishimura, Hideo Miura, Akihiro Yaguchi, Chikako Kitabayashi, Ichio Shimizu, Toshio Hatsuda, Toshinori Ozaki, Toshio Hattori, Souji Sakata
  • Patent number: 4292832
    Abstract: A method of producing a vibration attenuating material having the steps of forming a multiplicity of grooves in the surface of a ductile raw material and subjecting the raw material to a drawing or rolling work to form a multiplicity of minute friction interfaces in the surface region of the vibration attenuating material. An improved vibration attenuating performance is ensured by a suitable selection of numerical values of factors such as relationship between the maximum depth of the friction interface and the thickness of the vibration attenuating material, pitch of the friction interfaces and so forth.
    Type: Grant
    Filed: October 25, 1979
    Date of Patent: October 6, 1981
    Assignee: Hitachi, Ltd.
    Inventors: Hideo Nakae, Toshinori Ozaki, Takashi Shimaguchi, Syogo Morimoto
  • Patent number: 4203195
    Abstract: One or a plurality of layers of a metallic raw material in plate form and one or a plurality of layers of wire netting are placed one over another in vertically stacked relation and then subjected to rolling to produce vibration absorbing metallic material. The metallic material produced in this way exhibits an excellent vibration damping performance.
    Type: Grant
    Filed: December 20, 1977
    Date of Patent: May 20, 1980
    Assignee: Hitachi, Ltd.
    Inventors: Hideo Nakae, Toshinori Ozaki, Kazunori Nakane, Takashi Shimaguchi
  • Patent number: RE37690
    Abstract: A lead frame and a semiconductor device wherein a through hole is formed in the center of a semiconductor chip-mounting surface of a chip pad at the center of the lead frame, the through hole being tapered or being one which corresponds to a surface area that is greater on the surface of the chip-mounting surface of the chip pad than on the surface of the side opposite to the chip-mounting surface thereof. This prevents the occurrence of cracks in the sealing plastic portion in the step of reflow soldering of the lead frame to the substrate.
    Type: Grant
    Filed: May 24, 1995
    Date of Patent: May 7, 2002
    Assignee: Hitachi, Ltd.
    Inventors: Makoto Kitano, Sueo Kawai, Asao Nishimura, Hideo Miura, Akihiro Yaguchi, Chikako van Koten nee Kitabayashi, Ichio Shimizu, Toshio Hatsuda, Toshinori Ozaki, Toshio Hattori, Souji Sakata