Patents by Inventor Toshinori Tsugaru

Toshinori Tsugaru has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-layer circuit board and method of making the same
    Patent number: 8152950
    Abstract: A method of making a multi-layer circuit board that has a first film and at least two more films, second and third films, each being made of a thermoplastic polymer capable of forming an optically anisotropic melt phase, the first film having a low melting point, the second and third films having respective melting points higher than the melting point of the first film and at least one of the second and the third films having a circuit pattern thereon, and the first to third films are thermo compressed together with the first film interposed between the second and third films. This method entails causing at least one of the circuit patterns on one of the second and third films to contact an opposing surface of the other of the second and third films through the first film during the thermo compression bonding of the first to third films.
    Type: Grant
    Filed: December 23, 2008
    Date of Patent: April 10, 2012
    Assignee: Kuraray Co., Ltd.
    Inventors: Toshinori Tsugaru, Tatsuya Sunamoto, Tadao Yoshikawa
  • MULTI-LAYER CIRCUIT BOARD AND METHOD OF MAKING THE SAME
    Publication number: 20090107624
    Abstract: A method of making a multi-layer circuit board that has a first film and at least two more films, second and third films, each being made of a thermoplastic polymer capable of forming an optically anisotropic melt phase, the first film having a low melting point, the second and third films having respective melting points higher than the melting point of the first film and at lest one of the second and the third films having a circuit pattern thereon, and the first to third films are thermo compressed together with the first film interposed between the second and third films. This method entails causing at least one of the circuit patterns on one of the second and third films to contact an opposing surface of the other of the second and third films through the first film during the thermo compression bonding of the first to third films.
    Type: Application
    Filed: December 23, 2008
    Publication date: April 30, 2009
    Applicant: Kuraray Co., Ltd.
    Inventors: Toshinori TSUGARU, Tatsuya Sunamoto, Tadao Yoshikawa
  • Multi-layer circuit board and method of making the same
    Publication number: 20040040651
    Abstract: To provide a simplified method of making a multi-layer circuit board capable of observing a high density surface mounting of electronic parts, a method is provided for making a multi-layer circuit board including a first film (A) and at least two more films, second and third films (B and C), each being made of thermoplastic polymer capable of forming an optically anisotropic melt phase. The first film (A) has a low melting point (Tm1), and the second and third films (B and C) have respective melting points (Tm2B and Tm2C) higher than the melting point (Tm1) of the first film (A). And at least one of the second and the third films have a circuit pattern thereon. The first to third films (A to C) are thermo compressed together with the first film (A) interposed between the second and third films (B and C).
    Type: Application
    Filed: August 13, 2003
    Publication date: March 4, 2004
    Applicant: Kuraray Co., Ltd.
    Inventors: Toshinori Tsugaru, Tatsuya Sunamoto, Tadao Yoshikawa
  • Resin composition comprising a saponified product of vinyl acetate polymer
    Patent number: 6288165
    Abstract: A process for producing vinyl acetate polymers comprises, after polymerization of at least one monomer comprising vinyl acetate, adding a conjugated polyene having a boiling point of at least 20° C. Saponified products of the vinyl acetate polymers obtained by this process can give molded articles causing little coloring and generation of gel-like agglomerates.
    Type: Grant
    Filed: December 5, 1997
    Date of Patent: September 11, 2001
    Assignee: Kuraray Co., Ltd.
    Inventors: Takeshi Moritani, Kaoru Ikeda, Akimasa Aoyama, Takaharu Kawahara, Yukihiro Ohara, Naoshi Nakagawa, Toshinori Tsugaru
  • Processes for producing vinyl acetate polymer and saponified product of vinyl acetate polymer and resin composition
    Patent number: 5744547
    Abstract: A process for producing vinyl acetate polymers comprises, after polymerization of at least one monomer comprising vinyl acetate, adding a conjugated polyene having a boiling point of at least 20.degree. C. Saponified products of the vinyl acetate polymers obtained by this process can give molded articles causing little coloring and generation of gel-like agglomerates.
    Type: Grant
    Filed: June 25, 1996
    Date of Patent: April 28, 1998
    Assignee: Kuraray Co., Ltd.
    Inventors: Takeshi Moritani, Kaoru Ikeda, Akimasa Aoyama, deceased, Takaharu Kawahara, Yukihiro Ohara, Naoshi Nakagawa, Toshinori Tsugaru