Abstract: The invention provides a positive-working photosensitive resin composition comprising an alkali soluble resin (A), a diazoquinone compound (B) and a compound (C) which contains a —CH2OH group but not a phenolic hydroxyl group, a method for producing a pattern-formed resin film using the composition, a semiconductor device and a display device using the composition, and a method for producing the semiconductor device and the display device.

Abstract: The present invention provides a positive-working photosensitive resin composition with high sensitivity that gives a pattern having a high resolution and a high film thickness retention rate. In other words, the present invention provides a positive-working photosensitive resin composition comprising 100 parts by weight of a polyamide and 1 to 50 parts by weight of a photosensitive material, that is, a 1,2-naphthoquinone-2-diazide-5-sulfonate ester compound or a 1,2-naphthoquinone-2-diazide-4-sulfonate ester compound of a phenol compound. In addition, the present invention provides a positive-working photosensitive resin composition comprising 100 parts by weight of a polyamide, 1 to 50 parts by weight of a photosensitive material, that is, a 1,2-naphthoquinone-2-diazide-5-sulfonate ester compound or a 1,2-naphthoquinone-2-diazide-4-sulfonate ester compound of a phenol compound and 1 to 30 parts by weight of a phenol compound.

Abstract: A process for producing a semiconductor device which comprises forming a layer of an organic polymer resin on a surface of a semiconductor element, treating the formed layer by pattern working and curing, etching the element using the patterned and cured layer as a mask, exposing an electric conductive layer at open portions, treating the element with oxygen plasma at a temperature of 100° C. or higher and cleaning the electric conductive layer at the open portions. When the electric conductive layer at open portions is cleaned by the oxygen plasma treatment, formation of cracks on the organic protective layer is suppressed and adhesion between the organic protective layer and a sealing resin is improved.

Abstract: The present invention provides a positive photosensitive resin composition which can form a pattern of high resolution and high residual film ratio and has high sensitivity.

Abstract: The present invention alleviates the operational problems in production of flip chips and provides a semiconductor device superior in various reliabilities. The preset invention lies in an encapsulated semiconductor device comprising: (a) a polybenzoxazole resin film for chip protection, obtained by coating, on a circuit-formed chip, a positive photosensitive resin composition comprising 100 parts by weight of a polyamide and 1 to 100 parts by weight of a photosensitive diazoquinone compound, and subjecting the coated composition to patterning and curing, and (b) a bump electrode.

Abstract: A process for producing a semiconductor device which comprises forming a layer of an organic polymer resin on a surface of a semiconductor element, treating the formed layer by pattern working and curing, etching the element using the patterned and cured layer as a mask, exposing an electric conductive layer at open portions, treating the element with oxygen plasma at a temperature of 100° C. or higher and cleaning the electric conductive layer at the open portions.

Abstract: The present invention provides a positive photosensitive resin composition which can form a pattern of high resolution and high residual film ratio and has high sensitivity.

Abstract: The present invention provides a method for formation of a pattern of a photosensitive resin composition, which method is superior in sensitivity and film-thinning ratio, generates no scum in pattern formation, and gives a high resolution. That is, the present invention lies in a method for forming a pattern of a photosensitive resin composition, which comprises coating, on a substrate or the like, a positive photosensitive resin composition composed of a polyamide of particular structure and a diazoquinone compound, subjecting the resulting material to prebaking and then to light exposure, and dissolving and removing the exposed portions of the material with an aqueous alkaline solution containing an anionic surfactant and at least one kind of compound selected from compounds of calcium, strontium and barium, to obtain a pattern. The feature of the present invention lies particularly in using such an aqueous alkaline solution as a developing solution.

Abstract: A positive type photosensitive resin composition which comprises (A) 100 parts by weight of a polyamide represented by the general formula (1): wherein X represents a tetravalent aromatic group; Y represents a divalent aromatic group; Z represents a divalent group represented by the formula: in which R1 and R2 represent divalent organic groups and R3 and R4 represent monovalent organic groups; a and b represent molar fractions; a+b=100 mole %; a=60.0-100.0 mole %; b=0-40.0 mole %; and n represents an integer of 2 to 500, (B) 1 to 100 parts by weight of a photosensitive diazoquinone compound and (C)1 to 50 parts by weight of a phenol compound represented by a specific structural formula and/or (D) 0.

Abstract: A method of pattern-processing a photosensitive resin composition which comprises coating on a substrate a positive photosensitive resin composition of a polyamide of formula (1) below and a diazoquinone compound, subjecting the same to prebaking and then to irradiation with light, thereafter dissolving the exposed portion in an alkaline aqueous solution containing an alkylbenzenesulfonic acid to remove the same, thereby obtaining a pattern. wherein X is a tetravalent aromatic group; Y is a divalent aromatic group; Z is in which R1 and R2 are divalent organic groups and R3 and R4 are nonvalent organic groups; a and b are mole fractions; a+b=100 mole %; a=60.0-100 mole %; b=0-40.0 mole % and n=2-500. When the development is effected with the alkaline aqueous solution containing the alkylbenzenesulfonic acid, a scum-free, very high resolution pattern is obtained.

Abstract: A positive type photosensitive resin composition which comprises (A) 100 parts by weight of a polyamide represented by the general formula (1): ##STR1## wherein X represents a tetravalent aromatic group; Y represents a divalent aromatic group; Z represents a group represented by the formula: ##STR2## in which R.sub.1 and R.sub.2 represent organic groups and R.sub.3 and R.sub.4 represent monovalent organic groups; a and b represent molar fractions; a+b=100 mole %; a=60.0-100.0 mole %; b=0-40.0 mole %; and n represents an integer of 2 to 500, (B) 1 to 100 parts by weight of a photosensitive diazoquinone compound and (C) 1 to 50 parts by weight of a phenol compound represented by a specific structural formula and/or (D) 0.1 to 20 parts by weight of an organosilicon compound represented by a specific structural formula; and a semiconductor device in which a pattern of a polybenzoxazole resin obtained by using the above photosensitive resin composition is formed in a thickness of 0.1 to 20 .mu.

Abstract: By using a polyamic acid ester comprising the following structural units (1a), (1b) and (1c) as a photosensitive resin and a sulfonamide compound or a specific glycol ether acetate as a stabilizer, a photo-sensitive resin composition excellent especially in viscosity stability can be obtained, and by using the above photosensitive resin and a specific developer, a relief pattern of high resolution can be formed.

Abstract: A process for producing a photosensitive resin, comprises reacting a diamine with a tetracarboxylic acid tetraester represented by the formula (1) at a temperature of 0.degree. to 50.degree. C. in an aprotic polar solvent: ##STR1## wherein R.sub.1 is a tetravalent organic group; R.sub.2 is a group represented by the formula: ##STR2## in which R.sub.5 is a divalent to hexavalent organic group, R.sub.6 is H or CH.sub.3 and p is an integer of 1 to 5; R.sub.3 is a group represented by --OCH.sub.3, --OC.sub.2 H.sub.5, --OC.sub.3 H.sub.7 or the formula: ##STR3## and R.sub.4 is a group of the formula: ##STR4## the tetracarboxylic acid tetraester of the formula (1) is obtained by subjecting to addition reaction a tetracarboxylic dianhydride, an alcohol compound represented by the formula R.sub.2 H in which R.sub.2 is as defined above and an alcohol compound represented by the formula R.sub.3 H in which R.sub.

Abstract: The present invention provides a positive photo-sensitive resin composition comprising a polybenzoxazole precursor as a base resin, an organic solvent-soluble polymer or its precursor (e.g., a polyamic acid) as a component for imparting improved adhesion, flexibility or heat resistance, and a diazoquinone compound and/or a dihydropyridine compound as a photosensitive agent. This photo-sensitive resin composition can form a pattern of high resolution and further has excellent adhesion and mechanical properties. The present invention further provides three novel diazoquinone compounds as a photo-sensitive agent, which compounds give high resolution, high contrast and thick-film formability when compounded in a positive photo-sensitive resin composition. The present invention furthermore provides a new type positive photo-sensitive resin composition obtained by reacting a polybenzoxazole precursor with a diazoquinone compound as a photo-sensitive agent.

Abstract: Disclosed is a fuel injection quantity controlling device for diesel engines having a vertically extending crankshaft. The device has a control rod disposed in parallel with the crankshaft. In the event of a failure in the mechanism for vertically and reciprocatingly driving the control rod, e.g. a lever, link or the like, the control rod moves downward by the force of gravity to automatically stop the fuel supply to the unit injectors.

Abstract: The inductive elements in the background and pulse current portions of a pulse welding circuit are wound around separate cores and the background current path is connected in series with the pulse current inductive element to prevent damage to the background current switching element due to reverse voltage or current.

Abstract: A fuel injection pump for an internal combustion engine wherein a plunger is mounted in a barrel for sliding axial movement and rotation about its own axis, and the barrel is formed therein with a suction port and an outlet port. A metering groove is formed in the plunger and maintained in communication with a top of the plunger through a bore formed in the plunger, so that a desired amount of metered fuel can be delivered to the engine according to the load applied to the engine by varying the area and the time at which the metering groove is brought into communication with the outlet port, thereby varying the amount of fuel outflow. A pulsation control chamber of a greater sectional area is formed in the fuel passageway between a discharge valve of the pump and a fuel valve so as to intensify and prolong the duration of throbs of a pulsating current of fuel moved through the pulsation control chamber as it is delivered by pumping.