Patents by Inventor Toshio Hakuto

Toshio Hakuto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240044368
    Abstract: A sliding member includes a metal substrate and a sliding layer formed on one surface of the metal substrate. The sliding layer has a matrix phase containing Cu and Sn and hard particles dispersed in the matrix phase and containing a Laves phase constituted of a composition of Co, Mo and Si.
    Type: Application
    Filed: November 1, 2021
    Publication date: February 8, 2024
    Inventors: Naoki SATO, Toshio HAKUTO, Takashi AKAGAWA, Yuji KAWAMATA, Ryoichi SUZUKI, Takashi SAITO, Tadashi OSHIMA, Hajime KATO
  • Patent number: 7906222
    Abstract: A sliding material has a sintered layer formed atop a backing plate. The sintered layer contains 5-15 mass % of Bi nonuniformly distributed in a Cu—Sn alloy matrix consisting essentially of 8-12 mass % of Sn and a remainder of Cu. The sliding material can be manufactured by nonuniformly mixing Cu—Sn alloy powder and Bi powder, dispersing the mixed powder on a backing plate, and sintering the mixed powder to form a sintered layer on the backing plate. The sliding material does not undergo seizing and does not have separation of the sintered layer from the backing plate even when used in severe conditions such as in hydraulic equipment or construction equipment.
    Type: Grant
    Filed: July 10, 2007
    Date of Patent: March 15, 2011
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Sinzo Nakamura, Naoki Sato, Toshio Hakuto
  • Patent number: 7854996
    Abstract: A conventional Bi-containing sliding material sometimes underwent seizing in a sliding part operating at a high rotational speed. The present invention provides a sliding material which does not undergo seizing in a sliding part operating at a high rotational speed and a method for its manufacture. A low melting point alloy containing at least 20 mass % of Bi and having a liquidus temperature of at most 200° C. is made to penetrate into a porous portion comprising a Cu—Sn based alloy. A Bi—Sn based alloy or a Bi—In based alloy is suitable as the low melting point alloy. After a low melting point alloy paste is applied to a porous portion, the low melting point alloy is melted and made to penetrate into the porous portion.
    Type: Grant
    Filed: November 12, 2004
    Date of Patent: December 21, 2010
    Assignee: Senju Metal Industry Co., Ltd.
    Inventors: Issaku Sato, Sinzo Nakamura, Naoki Sato, Toshio Hakuto
  • Publication number: 20080193324
    Abstract: A conventional Bi-containing sliding material sometimes underwent seizing in a sliding part operating at a high rotational speed. The present invention provides a sliding material which does not undergo seizing in a sliding part operating at a high rotational speed and a method for its manufacture. A low melting point alloy containing at least 20 mass % of Bi and having a liquidus temperature of at most 200° C. is made to penetrate into a porous portion comprising a Cu—Sn based alloy. A Bi—Sn based alloy or a Bi—In based alloy is suitable as the low melting point alloy. After a low melting point alloy paste is applied to a porous portion, the low melting point alloy is melted and made to penetrate into the porous portion.
    Type: Application
    Filed: November 12, 2004
    Publication date: August 14, 2008
    Inventors: Issaku Sato, Sinzo Nakamura, Naoki Sato, Toshio Hakuto
  • Publication number: 20080020215
    Abstract: A sliding material has a sintered layer formed atop a backing plate. The sintered layer contains 5-15 mass % of Bi nonuniformly distributed in a Cu—Sn alloy matrix consisting essentially of 8-12 mass % of Sn and a remainder of Cu. The sliding material can be manufactured by nonuniformly mixing Cu—Sn alloy powder and Bi powder, dispersing the mixed powder on a backing plate, and sintering the mixed powder to form a sintered layer on the backing plate. The sliding material does not undergo seizing and does not have separation of the sintered layer from the backing plate even when used in severe conditions such as in hydraulic equipment or construction equipment.
    Type: Application
    Filed: July 10, 2007
    Publication date: January 24, 2008
    Inventors: Sinzo Nakamura, Naoki Sato, Toshio Hakuto