Patents by Inventor Toshio Ishimoto

Toshio Ishimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7418193
    Abstract: A video receiving and recording apparatus which can record a momentarily overlooked scene of a television broadcast and which can realize a reduction in power consumption and the like is provided. This video receiving and recording apparatus includes a short-time simple recording operating means for operating the video receiving and recording apparatus so as to record the momentarily overlooked scene in a recording and reproducing section when a viewer momentarily overlooks the specific scene while the viewer is viewing the television broadcast on a television monitor. The momentarily overlooked scene is recorded only when the short-time simple recording operating means is operated while the video receiving and recording apparatus operates in a short-time simple recording mode. A signal of the television broadcast received by a tuner is processed through an external memory only when the video receiving and recording apparatus operates in the short-time simple recording mode.
    Type: Grant
    Filed: October 5, 2004
    Date of Patent: August 26, 2008
    Assignee: Orion Electric Company Ltd.
    Inventors: Machiko Miyagawa, Toshio Ishimoto, Yoshinori Mizushima
  • Publication number: 20070020959
    Abstract: A plurality of jacks are a video signal jack, a left audio signal jack, and a right audio signal jack from left to right. Jack fixing protrusions are formed on a surface of each jack which surface is attached to a circuit board. The jack fixing protrusions are arranged differently among the respective jacks, and can be inserted only into attachment portions of the circuit board corresponding to the respective jacks. Namely, insertion of the respective jacks into incorrect attachment portions is made physically impossible, and erroneous insertion of the jacks can be prevented.
    Type: Application
    Filed: July 14, 2006
    Publication date: January 25, 2007
    Inventors: Toshihiko Sasaki, Toshio Ishimoto, Masayoshi Terashima, Naofumi Okayama
  • Publication number: 20070017699
    Abstract: A pair of through holes are formed in a circuit board, and a silver paste filled up in the through holes connects lands formed on a front surface and a rear surface of the circuit board, respectively to each other. When the silver paste is solidified, the silver paste bulges curvedly from the front and rear surfaces of the circuit board and forms a bump. A surface of the bump is covered with an overcoat. An electronic component is brought into contact with the bump, thereby forming a degassing gap between the electronic component and the circuit board. A gas generated during soldering is discharged from the penetrating hole, into which the lead terminal is inserted, to an outside via the gap between the electronic component and the circuit board.
    Type: Application
    Filed: July 14, 2006
    Publication date: January 25, 2007
    Inventors: Toshio Ishimoto, Toshihiko Sasaki, Naofumi Okayama, Masayoshi Terashima
  • Publication number: 20060200332
    Abstract: A pattern design of a film for manufacturing a printed circuit board is made by using a CAD system, and a plurality of types of Gerber data are produced in which a series of various data has been encoded. For example, a pattern film is formed by combining pattern Gerber data with pattern cut Gerber data. Data for check marks whose sizes are different from each other is added as well as pattern data to each Gerber data such that their central coordinates are to be the same. In this manner, a judgment mark having the check marks combined therewith is formed on the pattern film having the items of Gerber data combined therewith.
    Type: Application
    Filed: February 10, 2006
    Publication date: September 7, 2006
    Inventors: Toshio Ishimoto, Naofumi Okayama, Toshihiko Sasaki
  • Publication number: 20060188702
    Abstract: A copper foil pattern is formed such that mountain portions and valley portions thereof are continuous to be substantially orthogonal to a forward direction of a printed circuit board at the time of solder immersion, and a non-copper foil pattern portion free of a copper foil is provided to be opposed to this copper foil pattern, whereby a peak of the mountain portion is cooled quickly. Thus, a temperature gradient is generated, and a heat is transferred at the time of solder immersion. With this heat transfer, outgases are guided to the peak of the mountain portion, and the guided outgases are easily discharged from a non-copper foil pattern portion in the vicinity of this peak.
    Type: Application
    Filed: February 15, 2006
    Publication date: August 24, 2006
    Inventor: Toshio Ishimoto
  • Publication number: 20060067062
    Abstract: To provide a grounding structure for connecting and fixing a printed circuit board and a conductive frame to a conductive chassis of an electronic apparatus, the height of solder applied to the grounding land is made uniform, thereby ensuring electrical connection between the printed circuit board and the conductive chassis. A copper-foil coating 54 formed on a printed circuit board 50 is divided by a substantially-lattice-shaped resist 55 to form a grounding land 56 including a plurality of obliquely elongated land elements 56c in an area close to the edge of an opening 51 and a plurality of rhombic land elements 56a in the remaining area, and the grounding land 56 is brought into contact with and screw-clamped to a conductive chassis 60 using a locking leg 41.
    Type: Application
    Filed: September 15, 2005
    Publication date: March 30, 2006
    Applicant: ORION ELECTRIC CO., LTD.
    Inventors: Toshio Ishimoto, Naofumi Okayama, Toshihiko Sasaki
  • Publication number: 20060038264
    Abstract: To provide a printed circuit board in which two wiring patterns having a width of 0.15 mm, which are to be passed through the area of the printed circuit board for mounting a 1608-size chip component, are formed by printing, thereby increasing the circuit packaging density, reducing the production cost and suppressing the yield reduction. In a range in which the distance between two lands 12 to which a surface-mount chip component is electrically connected (the distance between points 17a and 17b) allows formation of two wiring patterns having a line width of 0.25 mm (the distance is equal to or more than 1.25 mm), wiring patterns 15 and 16 having a line width of 0.25 mm are formed. In this way, parts of the wiring patterns having a line width of 0.15 mm (narrow parts 15a and 16a) are minimized, and thus, the reduction in production yield is suppressed.
    Type: Application
    Filed: August 17, 2005
    Publication date: February 23, 2006
    Applicant: ORION ELECTRIC CO., LTD.
    Inventor: Toshio Ishimoto
  • Publication number: 20050089304
    Abstract: A video receiving and recording apparatus which can record a momentarily overlooked scene of a television broadcast and which can realize a reduction in power consumption and the like is provided. This video receiving and recording apparatus includes a short-time simple recording operating means for operating the video receiving and recording apparatus so as to record the momentarily overlooked scene in a recording and reproducing section when a viewer momentarily overlooks the specific scene while the viewer is viewing the television broadcast on a television monitor. The momentarily overlooked scene is recorded only when the short-time simple recording operating means is operated while the video receiving and recording apparatus operates in a short-time simple recording mode. A signal of the television broadcast received by a tuner is processed through an external memory only when the video receiving and recording apparatus operates in the short-time simple recording mode.
    Type: Application
    Filed: October 5, 2004
    Publication date: April 28, 2005
    Inventors: Machiko Miyagawa, Toshio Ishimoto, Yoshinori Mizushima