Abstract: On a surface of a glass cloth adhered a mica layer sheet, a mixture of inorganic particles having a thermal conductivity of at least 5 W/mK, a resin, and a solvent is applied to form a layer of the mixture of the inorganic particles, the resin, and the solvent; the layer of the mixture is reduced in thickness using a doctor blade, followed by pressurizing to form a high thermally conducting layer; the mica layer sheet on which the high thermally conducting layer is disposed is cut to obtain a mica insulating tape; and the mica insulation tape is wound around a coil conductor. As a result, an insulated coil that is excellent in the voltage endurance characteristics and has a high thermal conductivity is manufactured.

Abstract: On a surface of a glass cloth adhered a mica layer sheet, a mixture of inorganic particles having a thermal conductivity of at least 5 W/mK, a resin, and a solvent is applied to form a layer of the mixture of the inorganic particles, the resin, and the solvent; the layer of the mixture is reduced in thickness using a doctor blade, followed by pressurizing to form a high thermally conducting layer; the mica layer sheet on which the high thermally conducting layer is disposed is cut to obtain a mica insulating tape; and the mica insulation tape is wound around a coil conductor. As a result, an insulated coil that is excellent in the voltage endurance characteristics and has a high thermal conductivity is manufactured.

Abstract: A resin composition for laminate, which comprises 100 parts by weight of a composition (B), from 0.5 to 10 parts by weight of dicyandiamide and from 1 to 100 parts by weight of a linear polymer, said composition (B) comprising (i) a composition (A) comprising from 20 to 80 parts by weight of a polyfunctional epoxy compound of the formula: ##STR1## wherein R is H or CH.sub.3 and n is an integer of from 0 to 5, and from 80 to 20 parts by weight of an epoxy compound having two epoxy groups in one molecule, and (ii) an aromatic diamino compound incorporated in the composition (A) in such an amount that its active hydrogen is from 0.3 to 0.8 equivalent per equivalent of terminal epoxy groups.