Patents by Inventor Toshio Kitagawa
Toshio Kitagawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11981271Abstract: The present invention provides a vehicle body soundproof structure Sp that is configured to block noise from outside a vehicle, and comprises a window panel 24 fixed in a window frame 22 located on a side portion of a vehicle body 10, an interior material 50 provided at a vehicle interior side of the window frame 22 and having an upper end portion 52 extending diagonally upward in a direction toward the window panel 24, and a soundproof member 60 fixed to the upper end portion 52 of the interior material 50. The soundproof member 60 is provided in contact in a compressed state with an inner surface of the window panel 24 so as to fill a gap G formed between the upper end portion 52 of the interior material 50 and the window panel 24.Type: GrantFiled: February 11, 2022Date of Patent: May 14, 2024Assignee: HONDA MOTOR CO., LTD.Inventor: Toshio Kitagawa
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Publication number: 20220332264Abstract: The present invention provides a vehicle body soundproof structure Sp that is configured to block noise from outside a vehicle, and comprises a window panel 24 fixed in a window frame 22 located on a side portion of a vehicle body 10, an interior material 50 provided at a vehicle interior side of the window frame 22 and having an upper end portion 52 extending diagonally upward in a direction toward the window panel 24, and a soundproof member 60 fixed to the upper end portion 52 of the interior material 50. The soundproof member 60 is provided in contact in a compressed state with an inner surface of the window panel 24 so as to fill a gap G formed between the upper end portion 52 of the interior material 50 and the window panel 24.Type: ApplicationFiled: February 11, 2022Publication date: October 20, 2022Inventor: Toshio KITAGAWA
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Publication number: 20130247348Abstract: A sunroof drain tube installation assembly and method for installing or replacing a sunroof drain tube in a vehicle includes a drain tube installation tool having an elongated flexible wire with a first end and a second end, and a stopper disposed at the second end of the wire. The wire is threaded through the sunroof drain tube to be installed on the vehicle and then through a sunroof drain tube passageway defined on the vehicle. Optionally, this includes threading the wire through a sunroof drain tube already installed on the vehicle. After threading, the wire is pulled to forcibly install the sunroof drain tube into the sunroof drain tube passageway and, optionally, displacing the previously installed sunroof drain tube.Type: ApplicationFiled: March 26, 2012Publication date: September 26, 2013Applicant: HONDA MOTOR CO., LTD.Inventors: Toshio Kitagawa, Takeshi Yamamoto
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Patent number: 6995332Abstract: The present invention provide a resistance welding method for solving the problem of breakage of the welded portion by corrosion of an iron-copper alloy layer having a poor corrosion resistance formed at the welding portion, when a first metallic member comprising an iron-based metal is joined to a second metallic member comprising a copper based metal, wherein the problem above is solved by forming a nickel film on at least one surface of the first metallic member comprising the iron-based metal and the second metallic member comprising the copper-based metal to be joined, and by applying resistance welding while the first metallic member is made to butt against the second metallic member, thereby forming the first alloy layer containing nickel, copper and iron at the side of the first metallic member, and the second alloy layer containing nickel and copper at the side of the second metallic member to allow the alloy layers to exhibit an excellent corrosion resistance.Type: GrantFiled: November 14, 2003Date of Patent: February 7, 2006Assignees: Murata Manufacturing Co., Ltd., Fuji Xerox Co., Ltd.Inventors: Eiichi Nagatsuka, Toshio Kitagawa, Akito Asakura, Masaki Kitagawa, Akihiko Ueyama
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Publication number: 20040094518Abstract: The present invention provide a resistance welding method for solving the problem of breakage of the welded portion by corrosion of an iron-copper alloy layer having a poor corrosion resistance formed at the welding portion, when a first metallic member comprising an iron-based metal is joined to a second metallic member comprising a copper based metal, wherein the problem above is solved by forming a nickel film on at least one surface of the first metallic member comprising the iron-based metal and the second metallic member comprising the copper-based metal to be joined, and by applying resistance welding while the first metallic member is made to butt against the second metallic member, thereby forming the first alloy layer containing nickel, copper and iron at the side of the first metallic member, and the second alloy layer containing nickel and copper at the side of the second metallic member to allow the alloy layers to exhibit an excellent corrosion resistance.Type: ApplicationFiled: November 14, 2003Publication date: May 20, 2004Applicant: Murata Manufacturing Co., Ltd.Inventors: Eiichi Nagatsuka, Toshio Kitagawa, Akito Asakura, Masaki Kitagawa, Akihiko Ueyama
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Patent number: 6681484Abstract: The present invention provide a resistance welding method for solving the problem of breakage of the welded portion by corrosion of an iron-copper alloy layer having a poor corrosion resistance formed at the welding portion, when a first metallic member comprising an iron-based metal is joined to a second metallic member comprising a copper based metal, wherein the problem above is solved by forming a nickel film on at least one surface of the first metallic member comprising the iron-based metal and the second metallic member comprising the copper-based metal to be joined, and by applying resistance welding while the first metallic member is made to butt against the second metallic member, thereby forming the first alloy layer containing nickel, copper and iron at the side of the first metallic member, and the second alloy layer containing nickel and copper at the side of the second metallic member to allow the alloy layers to exhibit an excellent corrosion resistance.Type: GrantFiled: August 31, 2000Date of Patent: January 27, 2004Assignee: Murata Manufacturing Co., Ltd.Inventors: Eiichi Nagatsuka, Toshio Kitagawa, Akito Asakura, Masaki Kitagawa, Akihiko Ueyama
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Patent number: 6427315Abstract: A coil component and a manufacturing method for producing the same permit a wire terminal to be bonded to an electrode with high reliability by implementing thermal compression bonding using a heater chip. The coil component comprises a bobbin around which a wire is wound, the wire having a solder layer on the outer peripheral surface of a core conductor and an insulating layer formed on the outer peripheral surface of the solder layer. The wire terminal is secured to the electrode provided on the bobbin by thermal compression bonding. A heated heater chip is applied to the terminal to break the insulating layer and to melt the solder layer at substantially the same time. Then, pressure is applied to the heater chip to provide intermetallic bonding between the core conductor and the electrode. Melted solder solidifies and covers the area around the core conductor, thereby securely bonding the wire terminal to the electrode.Type: GrantFiled: June 16, 1999Date of Patent: August 6, 2002Assignee: Murata Manufacturing Co., Ltd.Inventors: Toshio Kitagawa, Yukio Hata
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Patent number: 6100782Abstract: A coil component and a manufacturing method for producing the same permit a wire terminal to be bonded to an electrode with high reliability by implementing thermal compression bonding using a heater chip. The coil component comprises a bobbin around which a wire is wound, the wire having a solder layer on the outer peripheral surface of a core conductor and an insulating layer formed on the outer peripheral surface of the solder layer. The wire terminal is secured to the electrode provided on the bobbin by thermal compression bonding. A heated heater chip is applied to the terminal to break the insulating layer and to melt the solder layer at substantially the same time. Then, pressure is applied to the heater chip to provide intermetallic bonding between the core conductor and the electrode. Melted solder solidifies and covers the area around the core conductor, thereby securely bonding the wire terminal to the electrode.Type: GrantFiled: August 22, 1997Date of Patent: August 8, 2000Assignee: Murata Manufacturing Co., Ltd.Inventors: Toshio Kitagawa, Yukio Hata