Abstract: A spectral-characteristic acquisition apparatus and a method of obtaining spectral characteristics. The spectral-characteristic acquisition apparatus includes a conveyor including a first conveyance roller pair disposed in a conveyance direction in which an object is conveyed and a second conveyance roller pair disposed downstream from the first conveyance roller pair in the conveyance direction, a sensor to detect that the object has reached the second conveyance roller pair, circuitry to control the second conveyance roller pair to drive by a predetermined amount with a driving force greater than a driving force of the first conveyance roller pair upon detecting that the object has reached the second conveyance roller pair by the sensor and to stop driving, and a color data obtainer to obtain color data from the object at a position where the object stops moving. In the spectral-characteristic acquisition apparatus, the circuitry estimates a spectral characteristic of the object.

Abstract: There is provided a consumable supply method for supplying a refill consumable stored in a refill consumable container to a consumable container installable in an equipment body. The consumable supply method includes removing a refill information storage device storing information on the refill consumable from the refill consumable container; removing an information storage device storing information on a consumable contained in the consumable container, the information being for exchange with the equipment body, from the consumable container; and attaching the refill information storage device removed from the refill consumable container as an information storage device to the consumable container in place of the information storage device removed from the consumable container.

Abstract: A spectral-characteristic acquisition apparatus and a method of obtaining spectral characteristics. The spectral-characteristic acquisition apparatus includes a conveyor including a first conveyance roller pair disposed in a conveyance direction in which an object is conveyed and a second conveyance roller pair disposed downstream from the first conveyance roller pair in the conveyance direction, a sensor to detect that the object has reached the second conveyance roller pair, circuitry to control the second conveyance roller pair to drive by a predetermined amount with a driving force greater than a driving force of the first conveyance roller pair upon detecting that the object has reached the second conveyance roller pair by the sensor and to stop driving, and a color data obtainer to obtain color data from the object at a position where the object stops moving. In the spectral-characteristic acquisition apparatus, the circuitry estimates a spectral characteristic of the object.

Abstract: There is provided a consumable supply method for supplying a refill consumable stored in a refill consumable container to a consumable container installable in an equipment body. The consumable supply method includes removing a refill information storage device storing information on the refill consumable from the refill consumable container; removing an information storage device storing information on a consumable contained in the consumable container, the information being for exchange with the equipment body, from the consumable container; and attaching the refill information storage device removed from the refill consumable container as an information storage device to the consumable container in place of the information storage device removed from the consumable container.

Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed; a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; and a sealing resin for sealing the semiconductor chip, the die pad frame, and the conductive connection member for die pad.

Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region an an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed; a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; and a sealing resin for sealing the semiconductor chip, the die pad frame, and the conductive connection member for die pad.

Abstract: An image forming apparatus includes a plurality of developer containers to contain different types of developers and a container mount in which the plurality of developer containers is removably installed and arranged adjacent to each other. Each of the developer containers includes an engagement portion. The engagement portion of one of the developer containers engages the engagement portion of another of the developer containers adjacent to the one of the developer containers when the developer containers are installed in the container mount in a predetermined order, to allow the developer containers to be installed. Further, the engagement portion of one of the developer containers interferes with the engagement portion of another of the developer containers adjacent to the one of the developer containers when the developer containers are installed in the container mount in a different order from the predetermined order, to prevent the developer containers from being installed.

Abstract: An image forming apparatus includes a plurality of developer containers to contain different types of developers and a container mount in which the plurality of developer containers is removably installed and arranged adjacent to each other. Each of the developer containers includes an engagement portion. The engagement portion of one of the developer containers engages the engagement portion of another of the developer containers adjacent to the one of the developer containers when the developer containers is installed in the container mount in a predetermined order, to allow the developer containers to be installed. Further, the engagement portion of one of the developer containers interferes with the engagement portion of another of the developer containers adjacent to the one of the developer containers when the developer containers is installed in the container mount in a different order from the predetermined order, to prevent the developer containers from being installed.

Abstract: A powder container is for use with an image forming apparatus, and the image forming apparatus includes a driving protrusion that is rotatable and that protrudes toward an upstream side in an insertion direction in which the powder container is inserted. The powder container includes a container body to store powder, a cap attached to the container body, and a transmitted structure provided on the cap to contact the driving protrusion. The transmitted structure extends outward from an outer circumference of the powder container. The cap is rotatable relative to the container body in a predetermined angular range. The rotation of the cap relative to the container body is restricted so that the container body rotates along with the rotation of the cap when the rotation of the cap exceeds the predetermined angular range.

Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed; a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; a first clip frame disposed on the upper surface of the semiconductor chip; a first clip conductive connection member disposed between the first electrode on the semiconductor chip and a lower surface of the first clip frame, the first clip conductive connection member electrically connecting the first electrode of the semiconductor chip and the lower surface of the first clip frame; and a sealing resin for sealing the semic

Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed; a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; and a sealing resin for sealing the semiconductor chip, the die pad frame, and the conductive connection member for die pad.

Abstract: A powder container is for use with an image forming apparatus, and the image forming apparatus includes a driving protrusion that is rotatable and that protrudes toward an upstream side in an insertion direction in which the powder container is inserted. The powder container includes a container body to store powder, a cap attached to the container body, and a transmitted structure provided on the cap to contact the driving protrusion. The transmitted structure extends outward from an outer circumference of the powder container. The cap is rotatable relative to the container body in a predetermined angular range. The rotation of the cap relative to the container body is restricted so that the container body rotates along with the rotation of the cap when the rotation of the cap exceeds the predetermined angular range.

Abstract: A powder container is for use with an image forming apparatus, and the image forming apparatus includes a driving protrusion that is rotatable and that protrudes toward an upstream side in an insertion direction in which the powder container is inserted. The powder container includes a container body to store powder, a cap attached to the container body, and a transmitted structure provided on the cap to contact the driving protrusion. The transmitted structure extends outward from an outer circumference of the powder container. The cap is rotatable relative to the container body in a predetermined angular range. The rotation of the cap relative to the container body is restricted so that the container body rotates along with the rotation of the cap when the rotation of the cap exceeds the predetermined angular range.

Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; a first clip frame disposed on the upper surface of the semiconductor chip; a first clip conductive connection member disposed between the first electrode on the semiconductor chip and a lower surface of the first clip frame, the first clip conductive connection member electrically connecting the first electrode of the semiconductor chip and the lower surface of the first clip frame; and a sealing resin.

Abstract: An image forming apparatus includes an apparatus body, a removable component configured to be removably installed in an installation position in the apparatus body, a cover configured to open and close when the removable component is removed from or installed in the installation position, a replacement removable component configured to be installable in and removable from the installation position in which the removable component is installed, and a holder configured to hold the replacement removable component at a different position from the installation position when the removable component is installed in the installation position and the cover opens. The replacement removable component held by the holder is configured to inhibit the cover from closing.

Abstract: An image forming apparatus includes image bearers, developing devices, developer containers, and developer supply devices. The image bearers are arranged side by side along a movement direction of an intermediate transferor or a sheet. The developing devices, the developer containers, and the developer supply devices are configured to be rearrangeable for each color in the movement direction in a manner that one or each of a developing device, a developer container, and a developer supply device corresponding to each color of the different colors is detached from and attached to the image forming apparatus, separately from a rest of the developing device, the developer container, and the developer supply device. The image forming apparatus is configured to be available for use when colors of the developing device, the developer container, and the developer supply device correspond to each other after rearrangement.

Abstract: A developing device includes a developer bearer opposed to an image bearer, configured to bear developer and rotate in a direction of rotation of the developer bearer, and configured to develop a latent image on the image bearer and a casing opposed to the developer bearer at a position downstream from an opposed position, at which the developer bearer is opposed to the image bearer, in the direction of rotation of the developer bearer. A casing gap between the developer bearer and the casing continuously decreases or increases from a first end of the developing device to a second end of the developing device across a center of the developing device in a longitudinal direction of the developing device.

Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed; a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; a first clip frame disposed on the upper surface of the semiconductor chip; a first clip conductive connection member disposed between the first electrode on the semiconductor chip and a lower surface of the first clip frame, the first clip conductive connection member electrically connecting the first electrode of the semiconductor chip and the lower surface of the first clip frame; and a sealing resin for sealing the semic

Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, the semiconductor chip having an upper surface on which a first electrode is disposed and a lower surface on which a second electrode is disposed; a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; and a sealing resin for sealing the semiconductor chip, the die pad frame, and the conductive connection member for die pad.

Abstract: A semiconductor module includes a die pad frame; a semiconductor chip disposed in a chip region on an upper surface of the die pad frame, a conductive connection member for die pad disposed between the second electrode of the semiconductor chip and the upper surface of the die pad frame, the conductive connection member for die pad electrically connecting the second electrode of the semiconductor chip and the upper surface of the die pad frame; a first clip frame disposed on the upper surface of the semiconductor chip; a first dip conductive connection member disposed between the first electrode on the semiconductor chip and a lower surface of the first clip frame, the first clip conductive connection member electrically connecting the first electrode of the semiconductor chip and the lower surface of the first clip frame and a sealing resin.