Abstract: A hybrid integrated circuit is provided having a substrate with at least one active and passive element disposed thereon. A lead frame has a plurality of leads and a support plate. The support plate supports the substrate. The support plate and inner leads are encapsulated in a resin mold package. An opening is formed in the support plate to thermally connect the bottom surface of the substrate to the resin mold package, and a plurality of devoid portions are formed in the substrate causing the amount of edge area contacting the resin mold package to be increased and adhesion between the substrate and the resin mold package improved.

Abstract: A hybrid integrated circuit including: a circuit substrate on which at least one of an active and passive semiconductor element is formed; a lead frame having a plurality of leads and a support plate with an opening formed therein, and supporting the circuit substrate thereon; and a mold of resin for packaging the circuit substrate, support plate and part of the leads of the lead frame, wherein a bottom surface of the circuit substrate is exposed and made to contact the mold resin through the opening. The circuit has a ratio of the exposed bottom surface to the entire bottom surface greater than 50%, and a ratio of surface area of the circuit substrate to a principal surface area of the mold of greater than 60%. There are a plurality of support plate configurations. The circuit relieves the mechanical stress caused in the mold package and eliminates cracking of the mold.

Abstract: A thermal recording head comprising an insulating substrate which has thereon a heat generating resistor pattern made of a thin-film resistor, an electrode pattern having a common power supply electrode pattern portion and a common grounded electrode pattern portion, for supplying the power to the resistor pattern, and a controlling electrode pattern portion, and switching elements for controlling the supply of the power to the resistor pattern. The electrode pattern is made of a thick-film copper paste by a printing process. The operation of the switching elements is controlled by the controlling electrode pattern portion.Also disclosed is a process for manufacturing a wiring substrate for a thermal recording head.

Abstract: Peroxidase, which is an enzyme having a catalytic effect on oxidation by hydrogen peroxide and known to be found in vegetables such as horseradish or Japanese radish, is produced according to a biological process using a microorganism belonging to the genus Myrothecium and capable of producing a peroxidase, for example, Myrothecium gramineum 38-3, 46-2 and 283-2, and Myrothecium verrucaria IFO 6113 and IFO 6133.